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x-ray tomography

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Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 49-54, November 12–16, 2000,
... on these studies requirements of a 3D imaging capability will be discussed. Critical breakthroughs required for development of such a capability are also summarized. electronic packages package development technical roadmap X-ray tomography 49 X-Ray Tomography for Electronic Packages Deepak Goyal Intel...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 571-573, November 6–10, 2016,
... Abstract Prior to x-ray tomography, cylindrically-shaped samples are obtained using an innovative milling strategy on a Plasma-FIB. The method presented consists of tuning the ion dose as a function of pixel coordinates along with optimization of the scan geometries, drastically reducing...
Proceedings Papers

ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 11-13, November 11–15, 2001,
... Abstract A scanning transmission x-ray microscope was used to perform x-ray tomography of integrated circuit interconnects. Reconstructions of test circuits were made with 140 nm 3D resolution in the best case. failure analysis integrated circuits scanning transmission X-ray microscope...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 154-163, November 1–5, 2015,
... Abstract X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 243-245, November 12–16, 2006,
... to get around this problem, however, often it might not always be adequate. This article proposes a non-destructive method for detecting solder defects at the second level interconnect using 3D X-ray tomography. A total of 6084 solder joints of 0.8mm and 0.5mm pitch BGAs were analyzed. Correlation...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 421-426, November 6–10, 2016,
... Abstract To get both the resolution and the field of view needed, 3Di devices are characterized in this paper using phase-contrast X-ray tomography performed in a synchrotron source. The paper shows how the synchrotron-based tomography can be routinely used as a tool for failure analysis...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 164-172, November 1–5, 2015,
..., thereby restricting its application to a few remote cases. However, the advents of advanced characterization and imaging tools and software have counteracted this point of view. In this paper, we show how X-ray micro-tomography imaging can be combined with advanced 3D image processing and analysis...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 56-61, November 2–6, 2003,
... and techniques to support this technology roadmap. The key challenge in the analytical tools and techniques is the development of nondestructive imaging for improved time to information. The 3D X-ray Computed tomography (CT) system named “X-Tek NGI” has been co-developed by Intel and X-Tek to address this need...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 30-35, November 2–6, 2008,
... Abstract The development of a next generation high-resolution x-ray Computed Tomography (CT) tool and its applications are reported in this paper. Some of the key features are region of interest capability, improved time-to-data, improved usability, and data collection automation capability. We...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 444-448, November 14–18, 2010,
... as the complexity of root cause findings. bending properties decapsulation focused ion beam intermittent faults metallography polishing root cause analysis thermomechanical stress wirebonding X-ray computer tomography Root-cause investigations of stitch bond shearing by means of 3D-X-ray...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 519-521, November 10–14, 2019,
... Abstract Characterization of Computed Tomography X-Ray ionizing dose will be presented along with a methodology to protect space bound flight hardware from exceeding total ionizing dose (TID) budget prior to mission completion. flight hardware ionizing dose X-ray computed tomography...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 77-82, November 18–22, 1996,
... Abstract X-ray microfocus radioscopy and computed tomography (CT) offer detailed information on the internal assembly and material condition of objects under failure analysis investigation. Using advanced systems for the acquisition of radioscopic and CT images, failure analysis investigations...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 95-99, November 11–15, 2012,
..., the combination of EOTPR to isolate the open/high resistance failure location and 3D X-ray Computed Tomography (CT) to image the failure is very effective for System in a Package (SIP) FI/FA. electro optical terahertz pulse reflectometry electronic packages failure analysis fault isolation three...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 314-316, November 15–19, 2020,
... Abstract In this paper, we demonstrate a case for non-destructive detection of submicron wide via-crack in printed circuit boards (PCBs) by using in-situ thermal chamber 3D x-ray computed tomography. The defect location is verified by a PFA (Physical Failure Analysis), and good agreement...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 92-98, November 2–6, 2008,
... the need for physical and tedious cross sectioning of these devices. failure analysis passive electronic devices RF modules X-ray microtomography Non invasive Failure Analysis of Passive Electronic Devices in Wireless Modules using X-ray Micro tomography (MicroCT) Tyler Pendleton, RFMD, 7907...
Proceedings Papers

ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 163-169, October 30–November 3, 2022,
... warpage. This system allows for the powerful visualization tools of Computed Tomography to be applied to samples at elevated and cryogenic temperatures over a broad temperature range (+125C to -257C). cryogenic temperature die warpage electronic packages X-ray computed tomography ISTFA 2022...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 347-356, November 6–10, 2016,
... characterization and imaging tools such as X-ray tomography has shifted the reverse engineering of electronics toward non-destructive methods. These methods considerably lower the associated time and cost to reverse engineer a complex multi-layer PCB. In this paper, we introduce a new anti–reverse engineering...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 7-11, November 3–7, 2013,
... Abstract We have exploited an innovative X-ray tomography system, which is hosted in a Scanning Electron Microscope (SEM). The resolution reached by this equipment is closed to 160nm in 2 dimensions. We imaged Through Silicon Vias (TSV) which have undergone a manufacturing defect...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 237-242, November 6–10, 2016,
... Abstract Automotive ultrasonic parking sensors were analyzed using X- ray computed tomography (XCT or microtomography), in order to determine if there were internal failures generated on the soldering process between copper wires and piezoelectric ceramic on these sensors. This paper reports...
Proceedings Papers

ISTFA2022, ISTFA 2022: Tutorial Presentations from the 48th International Symposium for Testing and Failure Analysis, q1-q52, October 30–November 3, 2022,
... boards. It reviews the basic principles of scanning acoustic microscopy (SAM), X-ray imaging, and 3D X-ray tomography and the factors that affect image resolution and depth. It demonstrates the current capabilities of each method along with different approaches for improving resolution, contrast...