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Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 481-484, November 5–9, 2017,
...Abstract Abstract This paper describes a method for obtaining high-resolution ultrasonic inspection images of semiconductor packages. We evaluated the effect of the incident ultrasonic frequency on the resolution and defect detection. When the incident frequency of the ultrasonic transducers...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 298-305, November 1–5, 2015,
...Abstract Abstract This paper describes the detection capability of micro delamination in ICs according to the transducer frequency of SAM (Scanning Acoustic Microscopy) equipment through a case study of non-destructive failure analysis. The analysis of scanning acoustic microscopy is non...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 480-487, November 12–16, 2006,
...Abstract Abstract Previous work on determining the minimal air gap detectable in scanning acoustic microscope (SAM) focused on the gap thickness detectable in an idealized Newton ring sample using a 75 MHz transducer. However, air gaps thinner than 0.130 microns have been detected by SAM...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 25-28, November 10–14, 2019,
...Abstract Abstract GHz-SAM using toneburst transducers is a method currently lacking the possibility to measure warped samples easily because large parts of such samples are out of focus due to the limited depth of focus of these types of transducers. This paper shows an approach to use...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 84-91, November 14–18, 2010,
... available scanning acoustic microscope equipped with several ultrasonic transducers covering the frequency range from 15 MHz to 175 MHz. The acoustic data recorded were subjected to sophisticated algorithms operating in time-, frequency- and spatial domain for performing signal- and image analysis. In all...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 100-105, November 11–15, 2012,
... transducer design was developed to increase defect resolution and signal to noise for interface characterisation. electronic devices failure analysis integrated circuits mechanical properties microelectromechanical systems scanning acoustic microscopy through-silicon vias Failure analysis...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 454-457, October 31–November 4, 2021,
... consisted of two wafers, a cap wafer and a base wafer with dry-etched pits on a silicon-oxide layer. Cap wafers of different thicknesses were used along with transducers of appropriate focal length. The paper describes the experimental setup and test procedures in detail as well as the results. bonded...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 468-470, November 3–7, 2013,
... lateral and axial resolution of the CSAM scan needs to be improved. The resolution of the CSAM scan is usually determined by the CSAM transducers. As shown in Fig. 1, the characteristic features of CSAM transducers include frequency, focal length, spot size in water, and depth of field. Lateral resolution...
Proceedings Papers

ISTFA1997, ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 197-204, October 27–31, 1997,
.... 13588 N. Central Expwy M/S-147· Dallas· TX 75243 USA Phone: 214.995.6117. Fax: 214.995.7785· E-mail: moore@ti.com Figure 1. Sketch of pulse-echo and through-transmission inspection geometries. receive transmit through-transmission and th d pulse-echo In pulse-echo inspection, only one transducer...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 235-244, November 3–7, 2002,
... Layers on Substrates The presence of thin layers can potentially result in erroneous indications of delamination, and is illustrated for the case of a Parylene-N coating on stainless steel [13, 14]. The effect of transducer frequency on the extent of distortion will be discussed using example images...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 233-239, November 15–19, 2020,
... of a motion control system, a pulse transmitter and receiver, a data acquisition system, a high frequency piezoelectric transducer and a PC. The transducer plays an Copyright © 2020 ASM International® All rights reserved. www.asminternational.org 233 ISTFATM 2020: Papers Accepted for the Planned 46th...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 377-381, November 13–17, 2011,
... of the defect meets or exceeds the resolution of the ultrasound transducer. With modern equipment, resolutions as low as 5um are possible depending on the particular application. The sample needs to be submerged in a coupling medium, such as DI water, in order to transfer the ultrasound efficiently from...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 293-302, November 12–16, 2000,
... of C-SAM C-SAM is a pulse-echo method. An electronic pulser excites a piezo-electric element inside a transducer. Typical center frequencies of the pulses for the investigation of microelectronic packages are 10 to 300 MHz [1]. To record an image, the transducer is scanned across the specimen. At each...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 389-392, November 14–18, 2004,
... analysis sends an ultrasonic signal from a transducer into the package and the returning echo from the different interfaces within the package are analyzed. The areas next to the bond pads and under the bond wires cannot be properly resolved because the geometry of the ball bonds and bond wires deflect...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 385-388, November 14–18, 2004,
...- stress delamination was confirmed via through-transmission SAM (see Fig. 6). Three selected transducer frequencies were used (50, 75 and 110 MHz) in the experiment. Two modes of scanning approach were evaluated: the top-side and the ball- side SAM approach. In the top-side approach, samples were scanned...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 277-283, November 18–22, 1996,
... between the echoes relates to their depth in the device being analyzed (D=vt/2, where D is distance, v is velocity of sound and t is time). The reflection is achieved by a transducer that alternatively acts as a receiver and sender. The transducer electronically switches between transmit and receive modes...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 376-379, November 14–18, 2004,
... of interest in order to acquire trustworthy information about the IC package. Introduction Acoustic microscopy is a well-established tool in the detection of IC package defects and irregularities. In AMI, a sound pulse generated by a transducer is sent into the material to be studied. The sound travels...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 332-336, November 11–15, 2012,
.... In most cases, it would be quite impossible to get any clear echo by direct reflection (C-scan mode) for features beyond the second PCB layer. Working in transmission mode is a possible option but requires the use of high power transducers. Due to the recent progress in transducer design (transducer...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 448-451, November 3–7, 2013,
... delamination electronic packages parallel lapping scanning acoustic microscopy transducers X-ray radiography Enabling Scanning Acoustic Microscopy Inspection of Materials Underneath the Chamfer of the Package Melanie S. Cajita, Marlyn C. Grancapal, Rudolf A. Sia Analog Devices Philippines, Inc., Cavite...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 221-226, November 18–22, 1996,
... to be able to differentiate between voids at different in­ terfaces by virtue of the "shading" of the image. A cross section *toM& uppwi^y our ^ f Figure 2 A representative view of the transducer and DUT in SAM Scanning Acoustic Microscopy - A new method of meas­ uring delamination has been applied...