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testing

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Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 147-152, November 12–16, 2006,
... Abstract This paper reports on a setup and a method that enables automated analysis of mechanical stress impact on microelectromechanical systems (MEMS). In this setup both electrical and optical inspection are available. Reliability testing is possible on a single chip as well as on the wafer...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 14-19, November 10–14, 2019,
... Abstract Modern 2D and 3D X-ray technologies are among the most useful non-destructive testing methods that enable the inspection of an object's internal features without cutting or disassembling the sample. This paper discusses the basic operating principle, advantages, and disadvantages of 2D...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 251-256, November 18–22, 1996,
... Proceedings of the 22nd International Symposium for Testing and Failure Analysis, 18 - 22 November 1996, Los Angeles, California Contactless Testing of Pulse Propagation in IC's - A Comparison Between OBIC and Captive-Coupling Detection Techniques K. Hempel, G. Sargsjan F.-Schiller University, Jena, Germany H...
Proceedings Papers

ISTFA1997, ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 3-6, October 27–31, 1997,
... that such high yields cannot be achieved without a substantial increase in the efficiency of failure analysis. Consequently, it is indicated that testing-based failure analysis is the only alternative which must eventually take over the major responsibility for yield ramping. Finally, it is demonstrated...
Proceedings Papers

ISTFA1997, ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 91-96, October 27–31, 1997,
... of the soldered joints must be addressed in order to achieve highly reliable flight hardware. We studied a test method to estimate the thermal fatigue life of soldered joints for space use. This paper examines the thermal fatigue life using two kinds of test methods as heat-resistant evaluation tests of soldered...
Proceedings Papers

ISTFA1997, ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 171-177, October 27–31, 1997,
... radiation electrical characteristics neutron radiation neutron-induced damage Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 27·31 October 1997, Santa Clara, California Characterization of Californium - 252 (2s2Cf) as a Laboratory Source of Radiation for Testing...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 29-36, November 3–7, 2002,
... range, but a spatial resolution below 1 micron. electronic devices failure analysis fluorescent microthermal imaging infrared lock-in thermography integrated circuits lateral heat diffusion silicon Fault Localization and Functional Testing of ICs by Lock-in Thermography O. Breitenstein...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 439-444, November 3–7, 2002,
.../extraction procedures are investigated. Evidence for burn-out, depending on the different procedures, calls for new suitable rules for handling during equipment operation and testing. failure analysis optical connectors optical extraction optical insertion passive optical components High power...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 617-622, November 3–7, 2002,
... Abstract Boundary-scan is a technology that’s been around for over ten years and is delivering the results foreseen by the IEEE working group that developed the 1149.1 specification. Many SMT (surface mount) production lines around the world use boundary-scan to solve the testing challenges...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 209-214, November 2–6, 2003,
..., there was a metrology approach developed to establish this link and root-cause the failures in the field, which was based on microhardness techniques and noncontact via fill measuring metrologies. failure mode analysis microhardness testing polymerization printed circuit boards root cause analysis solder...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 283-290, November 14–18, 2004,
... Abstract The fact that most components on prototype motherboards are likely to be from the same, or nearly the same manufacturing lot, and hence do not show the same variation that may be seen between lots during mass production, magnifies the deficiencies in the design and test process...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 380-384, November 14–18, 2004,
... Abstract This paper presents IDDQ testing for LED integrated with IC module (ICM) circuit. To begin, brief introduction to IDDQ testing, the purpose and failure detectable with this method in CMOS IC context will be discussed. Then, the explanation will be focalized to ICM package and failure...
Proceedings Papers

ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 389-392, November 11–15, 2001,
... Abstract With gate oxide thickness getting thinner and thinner, the possibility of pinholes, thickness variations, and surface irregularity is greatly increasing. Gate oxide integrity (GOI) tests are done to ensure product quality and uniformity of the gate oxide layer. Five percent (5...
Proceedings Papers

ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 469-475, November 11–15, 2001,
... Abstract To deal with failure analysis laboratory tasks, we have developed a modular and smart test system. We demonstrate that Smart Testing Interface can keep a device in the proper electrical state for defect localization. It is a key part of our system and can be easily adapted on a wide...
Proceedings Papers

ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 355-362, November 6–10, 2005,
... Abstract In this paper we present the advanced optical testing of an array fabricated in IBM’s 65 nm SOI CMOS technology, using the Picosecond Imaging Circuit Analysis (PICA) [1-11] tool equipped with the Superconducting Single-Photon Detector (SSPD) [12,13]. Based on the results of the optical...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 333-338, November 18–22, 1996,
.... With Ebeam testing, it sharply decreases voltage contrast during Image Fault Analysis and hide static voltage contrast. During ASIC reconfiguration with FIB, it could induce damages in the glassivation layer. Sample preparation is getting a key issue and we show how we can deal with it by optimizing carbon...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 419-424, November 14–18, 1999,
...-speed, high-resolution designs. analog-to-digital converter autoclave stress test CMOS energy dispersive spectroscopy etching laser ablation passivation photoresist scanning electron microscopy signal-to-noise ratio 419 Residual Photoresist Identified as Cause for Frequency-Dependent...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 203-213, November 12–16, 2000,
... Abstract The IC industry continues to find ways to improve the ability to correlate the electrical failure signature of devices with the physical failure location using different techniques. The purpose of this work is to show that improved transmission line pulse (TLP) testing technique of ESD...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 194-202, November 3–7, 2013,
... of the nature of the defect. failure analysis LED lock-in thermography microelectronic devices near infrared wavelength imaging sampling temperature distribution thermal testing thermoreflectance imaging Time-Resolved Thermoreflectance Imaging for Thermal Testing and Analysis Kazuaki Yazawa...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 482-485, November 3–7, 2013,
... Abstract A systemic analysis was chosen to evaluate a real case Bluetooth (BT) radio failure in the aspects of RF communication, digital design, firmware, application software, semiconductor device physics and processing, and failure analysis. This paper explores the range of testing, including...