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statistical failure analysis

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Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 430-433, November 10–14, 2019,
... semiconductor defects semiconductor manufacturing Statistical Failure Analysis for Non-parametric Characteristic in DRAM Myunghoon Oak, Jongbum Lee, Jungwon Bae, Kyungrak-Cho, Minju-Shin, Choongsun Park, Sunghoon Park, Hongsun Hwang, Taeyoung Oh, Jonghoon Kim, and Jungbae Lee DRAM Product Engineering Team...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 263-268, October 31–November 4, 2021,
...Abstract Abstract There are many wafer level tests, such as Fail Bit Count (FBC), where conventional statistical analysis methods are inadequate because the associated data do not follow a normal distribution. This paper introduces a statistical failure analysis technique that does not rely...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 183-188, November 18–22, 1996,
...Abstract Abstract This paper deals with the basic concepts of Signature Analysis and the application of statistical models for its implementation. It develops a scheme for computing sample sizes when the failures are random. It also introduces statistical models that comprehend correlations...
Proceedings Papers

ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 395-400, November 6–10, 2005,
.... This paper describes the necessary steps in order to set up statistical scan diagnosis, discusses the main failure analysis strategies and gives experimental results. automatic test pattern generation failure analysis fault localization integrated circuits statistical analysis Statistical...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 61-66, November 15–19, 2020,
... further decreasing. To maintain good success rate of failure analysis for advanced 3D FinFET technology, electrical probing is necessary to be incorporated into the failure analysis flow. In this paper, first, the statistic results of PEM emission sites versus real defect locations from 102 modules...
Proceedings Papers

ISTFA1997, ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 299-303, October 27–31, 1997,
...Abstract Abstract In the last several years emission microscopy has become an essential tool for failure analysis, specifically for VLSI devices. This paper describes various die related failure mechanisms in CMOS ASIC devices which were detected by emission microscopy. The failure analysis...
Proceedings Papers

ISTFA2007, ISTFA 2007: Conference Proceedings from the 33rd International Symposium for Testing and Failure Analysis, 242-251, November 4–8, 2007,
... a scientific root cause failure analysis involves systematically performing the failure analysis, which is explained in detail, to eliminate branches from the fault tree and arrive at the root cause of a given failure. Statistical analysis of Li-ion cells is provided, along with a recall determination...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 496-504, October 28–November 1, 2018,
... with statistical analysis, successful plastic package decapsulation happens to be reproducible mainly for die level failure analysis purposes. The paper aims to develop a chemical decapsulation process with optimum parameters needed to successfully decapsulate plastic molded GaAs integrated circuits for die level...
Proceedings Papers

ISTFA1998, ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis, 247-252, November 15–19, 1998,
... or graph and real-time data transmission to a dedicated server Digital Alpha 4100. The Management Module includes approval of the request for analysis from the Client Module, creation of reports about analysis results and statistical service for the subjects like failure modes in a device, operation time...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 233-238, November 14–18, 1999,
... and contrasted with traditional statistical approaches as well as those of expert systems, neural nets, and signature analysis. Data mining is applied to a number of common problem scenarios. Finally, future trends in data mining technology relevant to failure analysis are discussed. data mining database...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 508-510, November 5–9, 2017,
... of interconnection. Finally, a proposed method was verified with statistical analysis of 800,000 FBGA DRAM chips and physical analysis of failure chips. DRAM packages electrical measurements failure analysis fine pitch ball grid arrays flip chips statistical analysis wire bonding New Insight...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 399-404, November 14–18, 1999,
...Abstract Abstract Power bipolar devices with gold metallization experience high failure rates. The failures are characterized as shorts, detected during LSI testing at burn-in. Many of these shorted locations are the same for the failed devices. From a statistical lot analysis, it is found...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 463-467, November 12–16, 2000,
... is to provide other engineers working in defect and failure analysis an insight into the power of this metrology tool and how it can provide a firm basis for characterizing failures related to the dicing process. dicing die cracking failure analysis semiconductor chips stress concentrations 463...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 16-20, November 15–19, 2009,
... enables collection of various defect induced bit leakage data for low-cost and fast failure analysis. It also enables collection of massive bit leakage data for statistical evaluation and location sensitivity assessment. 28 nm process 45 nm process failure analysis leakage current nondestructive...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 388-393, October 31–November 4, 2021,
.... diagnosis accuracy diagnosis resolution statistical diagnosis scan-based testing ISTFA 2021: Proceedings from the 47th International Symposium for Testing and Failure Analysis Conference October 31 November 4, 2021 Phoenix Convention Center, Phoenix, Arizona, USA DOI: 10.31399/asm.cp.istfa2021p0388...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 566-575, November 14–18, 2004,
... how this failure pattern analysis together with statistical analysis can be utilized to generate a valuable deformation portfolio. The paper is organized as follows: first, a very brief background of our recently presented fail bitmap analysis approach is given. Second, key results of the performed...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 219-220, November 12–16, 2006,
... ATPG (automatic test pattern generation) failure data. The method outlined will enable the selection of representative samples for physical failure analysis (PFA), following fault isolation with automated scan based software tools like Fast scan [1] or Tetramax [2]. Previous statistical analyses have...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 703-712, November 3–7, 2002,
... to a wide variety of process parameter variation issues of concern to both test and FA communities. data-driven methods failure analysis statistical post-processing wafer sort test Parametric Variation or Defects? Statistical Post-Processing Analysis of Wafer-Sor t Data W. Rober t Daasch IC...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 177-182, November 18–22, 1996,
...Abstract Abstract Hie failure analysis lab has analyzed 'n' devices that all have the same failure signature (a failure mode plus other observable characteristics), and found that they all failed from the same mechanism. We wish to identify this mechanism with the failure signature so...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 166-170, November 15–19, 2009,
... of failure modes for the combined system, including the inverters, disconnects, etc. PV Reliability and Failure Analysis The approach to calculating reliability and failure statistics of components in general is fairly well understood, if not always applied. How is the reliability of a system determined...