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soft defect localization sdl

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ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 21-27, November 3–7, 2002,
... Abstract We have developed a new scanning laser microscopy methodology, Soft Defect Localization (SDL), that directly locates soft defects from the front side and backside of an IC. The method combines localized laser heating with the pass/fail state of a device to successfully localize soft...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 311-315, November 12–16, 2006,
... improvements. 90 nm process failure mode analysis root cause analysis soft defect localization SOI microprocessors Applications of Soft Defect Localization (SDL) on AMD Advanced SOI Microprocessors Yi-Xuan Seah, M Palaniappan, JM Chin Advanced Micro Devices (S) Pte Ltd, 508, Chai Chee Lane...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 158-163, November 13–17, 2011,
... Abstract Dynamic Laser Stimulation (DLS) techniques for Soft Defect Localization (SDL) have been well documented for logic devices [1][2]. More recent literature has broadened the traditional SDL pass/fail mapping by employing multiple device parameters including power analysis [3], spectrum...
Proceedings Papers

ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 128-134, November 6–10, 2005,
... Abstract A new localization method called LIA-SDL is introduced and applied to scan shift problems. The method combines local thermal stimulation technique with lock-in technique applied to periodical test pattern. The localization capability on soft defects is shown in comparison with SDL...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 38-42, November 15–19, 2009,
... Abstract In this paper, we describe a modified soft defect localization (SDL) technique, PSDL (pseudo-soft defect localization), to localize pseudo-soft defects in integrated circuits (ICs). Similar to soft defects, functional failures due to pseudo-soft defects are sensitive to operating...
Proceedings Papers

ISTFA2007, ISTFA 2007: Conference Proceedings from the 33rd International Symposium for Testing and Failure Analysis, 191-192, November 4–8, 2007,
... Abstract Equipment manufacturers have developed peripherals for their tools that add soft defect localization (SDL) capability to existing optical beam tools, in many cases providing excellent results. However, these upgrades add significant cost to the tool. This paper presents the design...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 103-107, November 15–19, 2020,
... Abstract Soft Defect Localization (SDL) method has been a common failure analysis technique used in fault isolation of temperature dependent failures, however proper signal conditioning and conversion of the monitored signal into a pass/fail signal are critical in acquiring an accurate defect...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 350-356, November 3–7, 2013,
... Abstract Soft Defect Localization (SDL) is a laser scanning methodology that is commonly used to isolate integrated circuits soft defects. The device is exercised by a functional vector set in a loop manner while localized laser heating stimulates a change in the pass/ fail (P/F) response...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 228-231, November 11–15, 2012,
... Abstract This paper presents a case study on scan test reject in a mixed mode IC. It focuses on the smart use of combined mature FA techniques, such as Soft Defect Localization (SDL) and emission microscopy (EMMI), to localize a random scan test anomaly at the silicon bulk level. dynamic...
Proceedings Papers

ISTFA2022, ISTFA 2022: Tutorial Presentations from the 48th International Symposium for Testing and Failure Analysis, c1-c104, October 30–November 3, 2022,
... Abstract This presentation is an application-oriented tutorial on laser-assisted device alteration (LADA) and soft defect localization (SDL) techniques and how they are used to analyze marginal digital failures and identify analog circuits that are sensitive to voltage perturbations...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 227-232, November 2–6, 2008,
... Abstract Soft defect localization (SDL) is a method of laser scanning microscopy that utilizes the changing pass/fail behavior of an integrated circuit under test and temperature influence. Historically the pass and fail states are evaluated by a tester that leads to long and impracticable...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 396-399, November 9–13, 2014,
... Abstract Soft Defect Localization (SDL) is a dynamic laser-based failure analysis technique that can detect circuit upsets (or cause a malfunctioning circuit to recover) by generation of localized heat or photons from a rastered laser beam. SDL is the third and seldom used method on the LSM...
Proceedings Papers

ISTFA2021, ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis, e1-e99, October 31–November 4, 2021,
... Abstract This presentation is an application oriented tutorial on laser-assisted device alteration (LADA) and soft defect localization (SDL) techniques and how they are used to analyze marginal digital failures and identify analog circuits that are sensitive to voltage perturbations...
Proceedings Papers

ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 115-120, November 6–10, 2005,
... Abstract Soft Defect Localization (SDL) is an analysis technique where changes in the pass/fail condition of a test are monitored while a laser is scanned across a die.[1,2,3,4] The technique has proven its usefulness for quickly locating failing nodes for functional fails that are temperature...
Proceedings Papers

ISTFA2022, ISTFA 2022: Tutorial Presentations from the 48th International Symposium for Testing and Failure Analysis, o1-o20, October 30–November 3, 2022,
... Abstract This presentation provides an overview of the Arduino microcontroller development board, its features and capabilities, and its integrated design environment. It also provides examples of its use in soft defect localization (SDL) and laser assisted device alteration (LADA). laser...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 241-244, November 1–5, 2015,
... Abstract In the case of conventional planar FET, Dynamic Laser Stimulation (DLS) is a very effective method to isolate marginal failure. Depending on laser sources, DLS is divided by Soft Defect Localization (SDL) and Laser Assisted Device Alteration (LADA). SDL uses 1320nm wavelength laser...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 371-377, November 2–6, 2003,
... stimulation techniques dedicated to dynamic IC diagnostics have been proposed. These two techniques, called Resistive Interconnection Localization (RIL) and Soft Defect Localization (SDL), combine a continuous laser beam with a dynamically emulated IC. The laser stimulation effect on the circuit is monitored...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 206-210, November 14–18, 2010,
... Abstract In new product designs increasing effort is needed to observe and prove failure mechanisms or process marginalities. For advanced failure analysis Soft Defect Localization (SDL) [1] and Time Resolved Emission (TRE) [2,3] have now become a standard analysis method. Both techniques...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 168-172, November 10–14, 2019,
... on laser voltage probing (LVP) and soft defect localization (SDL) which could only be resolved by a detailed interpretation of the measurement results. Case Studies The first case is a sawtooth LVP signal induced by a metal short. We will talk about the unusual LVI/LVP results when the signal modulation...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 459-463, November 2–6, 2008,
... Abstract In this paper, a comprehensive study to find a memory related yield loss in 90 nm technology will be discussed. The loss was related to spacer bridging, blocking silicide formation and Lightly Doped Drain (LDD), source/drain implant. Soft Defect Localization (SDL) techniques [1], sub...