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scanning transmission electron microscope

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Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 93-99, November 3–7, 2002,
...-resolution element identification when used in conjunction with high-resolution STEM images provides an analysis technique that exceeds the capabilities of conventional SEM imaging. energy dispersive X-ray analysis failure analysis scanning electron microscope scanning transmission electron...
Proceedings Papers

ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 436-439, November 6–10, 2005,
... and transmission electron microscopy. High accurate metrology depends on accuracy of magnification of electron microscope. We developed accurate magnification calibration for scanning transmission microscope. This method is carried out by using micro scale specimen and silicon single crystal lattice fringe images...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 474-479, November 9–13, 2014,
...Abstract Abstract The modern scanning transmission electron microscope (S/TEM) has become a key technology and is heavily utilized in advanced failure analysis (FA) labs. It is well equipped to analyze semiconductor device failures, even for the latest process technology nodes (20nm or less...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 77-85, November 3–7, 2002,
...Abstract Abstract Recent developments in transmission electron microscopy (TEM) sample preparation have greatly reduced the time and cost for preparing thin samples. In this paper, a method is demonstrated for viewing thin samples in transmission in an unmodified scanning electron microscope...
Proceedings Papers

ISTFA2007, ISTFA 2007: Conference Proceedings from the 33rd International Symposium for Testing and Failure Analysis, 115-120, November 4–8, 2007,
... microscope (BF-TEM) and HADDF- scanning transmission electron microscope (STEM) tomography to analyze barrier layer step coverage, defects, and W fill quality in advanced DRAM. By appropriate use of BF-TEM or HAADF STEM tomography, optimal information for failure analysis, root cause clarification...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 170-171, November 11–15, 2012,
... analysis. The 3D tomography samples were prepared in lamella shape by using focused ion beam (FIB). The electron energy loss spectroscopy (EELS) and 3D tomography analysis in scanning transmission electron microscope (STEM) HAADF mode were carried out. Through 3D tomography image reconstruction by AMIRA...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 282-287, November 2–6, 2003,
...Abstract Abstract A novel technique for three-dimensional structural and elemental analyses using a dedicated focused ion beam (FIB) and scanning transmission electron microscope (STEM) has been developed. The system employs an FIB-STEM compatible sample holder with sample stage rotation...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 242-246, November 15–19, 2009,
...Abstract Abstract This paper deals primarily with the difficulties and solutions to scanning transmission electron microscope (STEM) sample preparation by dual beam focused ion beam. Approximately twenty major challenges were encountered spanning hardware, software, and material sample...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 24-25, November 13–17, 2011,
... dark field - scanning transmission electron microscope images is presented as an effective technique to measure local strains in the current node of Si based transistors. dark field images failure analysis geometric phase analysis local lattice strain measurement scanning transmission...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 274-277, November 9–13, 2014,
.../transmission electron microscope specimens is combined with fast conventional EXLO and EXpressLO "pick and place" solutions. The combination of large material removal rates with PFIB and EXLO allows for efficiency and high throughput of FIB lift out specimens. failure analysis focused ion beam scanning...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 315-316, November 2–6, 2008,
...Abstract Abstract Scanning electron microscope (SEM) and high resolution transmission electron microscope analysis combined with focused ion beam have been used to locate the physical defect. Visualizing the defect by these techniques was found to be difficult. This paper introduces a novel...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 331-337, November 14–18, 2004,
...Abstract Abstract The dual-beam system, which combines a high-resolution scanning electron microscope (SEM) with a focused ion beam (FIB), allows sample preparation, imaging, and analysis to be accomplished in a single tool. This paper discusses how scanning transmission electron microscopy...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 320-327, November 2–6, 2008,
...Abstract Abstract Scanning transmission electron microscopy with scanning electron microscopes (SEM-STEM) has become increasing used in both SEM and dual-beam focused ion beam (FIB)-SEM systems. This paper describes modeling undertaken to simulate the contrast seen in such images. Such modeling...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 397-405, November 12–16, 2000,
.... It is shown that the material is more stable under the ion beam than under the electron beam in the scanning electron microscope (SEM) or in the transmission electron microscope (TEM). The milling of the material by H2O vapor assistance is strongly enhanced. Also by applying XeF2 etching an enhanced milling...
Proceedings Papers

ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 121-123, November 11–15, 2001,
...Abstract Abstract In semiconductor failure analysis, there is a demand that after mechanical polishing and scanning electron microcopy (SEM) examination, the failure site needs to be analyzed by transmission electron microscope (TEM) for a detailed examination to find the root cause...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 606-616, November 11–15, 2012,
... and impact the IC yield. electron beam inspection focused ion beam integrated circuits optical microscope platinum deposition sample preparation scanning electron microscope transmission electron microscope tungsten plugs voids Studies of Buried Voids Capturing with e-Beam Inspection System...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 465-470, November 14–18, 2004,
...Abstract Abstract This paper studies the effects of an electron beam and an ion beam in sample preparation at the borderless bit-line contact (CB) between a transistor and a bit line in a deep trench capacitor DRAM [1] using the Transmission Electron Microscope (TEM) and the Electron Energy...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 255-260, November 14–18, 2004,
... energy (<3.0 kV) scanning electron microscopy (SEM) is often not able to detect this type of defect. In rare cases, where the defect is successfully exposed by the traditional procedure, it is very challenging to perform additional transmission electron microscopy (TEM) characterization of the defect...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 114-119, November 1–5, 2015,
... intermetallic compounds scanning electron microscope transmission electron microscopy Detection and Measurement of Intermetallic Thin Films Using EDX Line Scanning Carl Nail EAG, Irvine, California, United States cnail@eaglabs.com Abstract Elementally characterizing intermetallic compounds (IMCs...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 227-233, November 3–7, 2002,
... sample preparation scanning electron microscopy silicon transmission electron microscopy transmission x-ray microscope A Transmission X-ray Microscope (TXM) for Non-destructive 3D Imaging of ICs at Sub-100 nm Resolution Steve Wang*, Frederick Duewer, Shashidar Kamath, Christopher Kelly, Alan Lyon...