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scanning acoustic tomography

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Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 454-457, October 31–November 4, 2021,
...Abstract Abstract This paper assesses the capabilities of scanning acoustic tomography (SAT) for the analysis of bonded silicon wafers. In order to quantitatively evaluate detectability and resolution, the authors acquired images from samples prepared with artificial voids. The samples...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 233-239, November 15–19, 2020,
... or rushing into destructive techniques, leading to poor understanding of the failure mechanism and root-cause, customer dissatisfaction. Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM) has been adopted by several Failure Analysis labs because it provides reliable non...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 332-336, November 11–15, 2012,
... be used to overcome these limitations. It will be shown through several examples how three non-destructive methods usually dedicated to package analyses can be efficiently adapted to PCBs and PCBAs: • Scanning Acoustic Microscopy (SAM) • 3D X-ray Computed Tomography (CT) • Infrared Thermography A case...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 293-299, November 18–22, 1996,
... to die adhesion. Experiment Results Significantly less delamination (i.e. better ad­ hesion) was seen on the solvent cleaned material (Figure 8). This finding was independent of wafer lot or mold press (Figures 9,10). Scanning acoustic tomography also includes time-of-flight information (TOF). TOF...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 269-276, November 18–22, 1996,
... of plastic packages. The flag is the copper tab on the PCB substrate. The delamination can be detected by scanning acoustic tomography (SAT) and scanning acoustic microscopy (SAM). Various types of damage observed in both types of PBGA packages are described as follows. 225 GTPAC Seventeen of the 26...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 481-484, November 5–9, 2017,
.... Therefore, devices must be examined to ensure their reliability. As electronic devices become smaller and more sophisticated, there is a stronger demand for non-destructive inspection of the electronic devices with higher resolution. Scanning acoustic tomography (SAT) is a non-destructive flaw detection...
Proceedings Papers

ISTFA1997, ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 197-204, October 27–31, 1997,
... Using Scanning Acoustic Tomography (SCAT) and High Resolution X-ray Microscopy (HRXM Proceedings Int. Symp.for Testing and Failure Anal., 69-74 (1989). 204 Copyright © 1997 ASM International. All rights reserved. 1997 ASM International ...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 377-387, October 31–November 4, 2021,
... procedure ATPG Diagnosis results 1. Identify the failing block/blocks from ATPG diagnosis results. Select the target block(s). Standard analysis flows were done such as package inspection, X-ray and Scanning Acoustic Tomography (SAT). No anomaly was observed. The failure on ATE was validated using a compact...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 330-333, October 31–November 4, 2021,
... Acoustic Tomography (SAT), and open/short (O/S) tester before function test [1-3]. In this study, we used a multi-functionality O/S tester (DCT), which is ASE group developed to replace the traditional O/S tester (Smart1), as shown in Figure 1. The functions of DCT are: (1) O/S test combine defect mapping...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 237-242, November 6–10, 2016,
...Abstract Abstract Automotive ultrasonic parking sensors were analyzed using X- ray computed tomography (XCT or microtomography), in order to determine if there were internal failures generated on the soldering process between copper wires and piezoelectric ceramic on these sensors. This paper...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 49-54, November 12–16, 2000,
... in the multi-layer interconnect packages. Thus a 3D- imaging capability is a requirement. Moore and Hartfield have concluded that the Scanning Acoustics Microscopy (SAM) technique is better than the 2D x-ray radiography for detection of underfill delamination and open ball joints.* This paper will demonstrate...
Proceedings Papers

ISTFA2021, ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis, i1-i109, October 31–November 4, 2021,
... BUT: X-ray can damage devices! Dogan et al., ISTFA 2015 Advice to test for each technology Nature, March, 2017 36 Acoustic techniques 37 Scanning Acoustic Microscopy (SAM) C-scan Principle: Magnitude (a.u.) TOF [us] Time of flight (µs) x 10-6 B-scan 6.8 6.9 7 7.1 7.2 7.3 7.4 3000 3500 4000 4500 5000...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 125-129, November 9–13, 2014,
...- measurements. The combination of these two approaches solves emerging challenges for backside preparation process. computer numerical control milling contour milling failure analysis scanning acoustic microscopy warpage measurements SAM assisted Contour Milling Christian Hollerith, Bernd Krüger...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 49-52, October 31–November 4, 2021,
...Abstract Abstract This paper describes a project to develop and deploy a systematic screening methodology involving computed tomography (CT) to inspect a set of electromagnetic interference (EMI) filter components for a spacecraft application. The goal was to deploy the nondestructive CT test...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 27-32, November 15–19, 2009,
...Abstract Abstract The capability of the Scanning Electron Acoustic Microscopy (SEAM) technique for high resolution non-destructive subsurface imaging at different depths for a multi-level integrated circuit is assessed. Experimental results using a beveled DRAM IC sample are used to quantify...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 314-316, November 15–19, 2020,
... and complex, it is more difficult or even impossible to have high accuracy non-destructive fault isolation tools for localizing the defects such as submicron wide via-crack. SAM (scanning acoustic microscopy) is one of the most widely used non-destructive methods which uses an ultrasonic transducer...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 104-110, October 28–November 1, 2018,
...Abstract Abstract GHz scanning acoustic microscopy (GHz-SAM) was successfully applied for non-destructive evaluation of the integrity of back end of line (BEOL) stacks located underneath wire-bond pads. The current study investigated two sample types of different IC processes. Realistic bonding...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 75-85, November 3–7, 2013,
... Scanning Acoustic Microscopy The device was imaged by C-mode scanning acoustic microscopy (C-SAM) through the underside of the package. This technique [3, 4] successfully imaged the die attaches of all four detector dice and the gold-germanium solder attaches between the small LED substrate and the device...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 92-98, November 2–6, 2008,
... such as gallium arsenide (GaAs) or gallium nitride (GaN). Using XCT, along with other non destructive techniques, such as DC package level curve tracing, RF probing and scanning acoustic microscopy (SAM), it is possible to eliminate the routine use of manual cross sectioning and/or decapsulation. Such physical...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 59-64, October 31–November 4, 2021,
...Abstract Abstract This paper discusses the basic physics of scanning acoustic microscopy, the counterfeit features it can detect, and how it compares with other screening methods. Unlike traditional optical inspection and IR and X-ray techniques, SAM can identify recycled and remarked chips...