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sample preparation

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Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 466-473, November 1–5, 2015,
...Abstract Abstract The X-ray inspection of fully assembled samples is becoming ever more important as the benefits of using area array packages/chip scale packages/flip chips are applied to more and more products. Sample preparation has traditionally been used to improve access to geometry...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 100-104, November 9–13, 2014,
... analysis steps to be continued such as chip level fault localization, chip micro probing for fault isolation, parallel lapping [2, 3, 4] and passive voltage contrast. Therefore, quality of sample preparation is critical. This paper discussed and demonstrated a quick, reliable and cost effective methodology...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 255-260, November 9–13, 2014,
... automatically acquired within a modular automated processing system (MAPS). copper failure analysis focused ion beam modular automated processing systems organic light-emitting diodes sample preparation scanning electron microscope Site-Specific, Wide Field-of-View Cross-Sectional Sample...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 261-267, November 9–13, 2014,
... of these outstanding characteristics of lasers, it is very surprising that sample preparation for microstructure diagnostics did not derive the advantages from laser micromachining. microPREPTM, is a new laser-micromachining tool developed by 3D-Micromac capable of making fast, clean, and efficient laser ablation...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 383-387, November 9–13, 2014,
...Abstract Abstract High resolution laser imaging, using high numerical aperture (NA) solid immersion lens (SIL) for backside fault isolation imposes stringent sample preparation requirements; as a result of the short focal length of SIL, a die must be thinned to a targeted thickness with less...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 413-419, November 9–13, 2014,
...Abstract Abstract In this paper, we describe automated FIB for TEM sample preparation using iFast software on a Helios 450HP dual-beam system. A robust iFast automation recipe needs to consider as many variables as possible in order to ensure consistent sample quality and high success rate...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 420-424, November 9–13, 2014,
...Abstract Abstract In this paper, three productive polishing transmission electron microscopy (TEM) sample preparation methods are reported. The methods are studied to improve the efficiency and expand the application fields. Method 1 and 2 address expanding conventional polishing method...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 425-429, November 9–13, 2014,
...Abstract Abstract This paper reports optimized Transmission Electron Microscopy (TEM) sample preparation methods with Focus Ion Beam (FIB), which are used to reduce or avoid the overlapping of TEM images. Several examples of optimized cross-section sample preparation on 38nm and 45nm pitch...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 462-468, November 9–13, 2014,
...Abstract Abstract This paper reports a novel method for site specific plan view transmission electron microscopy (TEM) sample preparation. The detailed procedure is introduced step by step. To demonstrate the practicality of this technique in failure analysis, case studies on 45nm and below...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 469-473, November 9–13, 2014,
...Abstract Abstract With continuous scaling of CMOS device dimensions, sample preparation for Transmission Electron Microscope (TEM) analysis becomes increasingly important and challenging as the required sample thickness is less than several tens of nanometers. This paper studies the protection...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 474-479, November 9–13, 2014,
...). However, the typical sample preparation process flow utilizes a dual beam focused ion beam (FIB) microscope for sample preparation, with the final sample end-pointing monitored using the scanning electron microscope (SEM) column. At the latest technology nodes, defect sizes can be on the order...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 515-518, November 9–13, 2014,
...Abstract Abstract The MEMS structure has its particular character like hollow areas inside, and “floating” structures. Traditional TEM sample preparation method usually leads to distortion and dissociation defects of the floating structure. This paper introduces two innovative practical methods...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 519-524, November 9–13, 2014,
... these issues, a focused ion beam lift-out based approach for site-specific cross-section sample preparation is developed in this work. A directional mechanical polishing procedure to produce smooth damage-free surface for junction profiling is also implemented. Two failure analysis applications of the sample...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 318-322, November 1–5, 2015,
... TEM sample is one of the keys which enables to facilitate successful TEM analysis. This paper demonstrates a few examples to show the tricks on positioning, protection deposition, sample dicing, and focused ion beam milling of the TEM sample preparation for advanced DRAMs. The micro-structures...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 103-107, November 14–18, 1999,
...Abstract Abstract The rising demand in the semiconductor industry for higher spatial resolution in the analysis of device defects has focused attention on the use of transmission electron microscopy (TEM). However, conventional TEM sample preparation may be difficult and time-consuming...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 117-124, November 14–18, 1999,
.... A polishing system has been evaluated and optimised for this purpose. Surface roughness (Ra) of 1 nm or better was obtained. Representative applications are shown and discussed. failure analysis infrared photoemission microscope plastic encapsulation sample preparation silicon surface roughness...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 161-171, November 12–16, 2000,
...Abstract Abstract This paper presents a comparative study of backside sample preparation techniques with applicability to conventional as well as flip chip package types. We will cover mechanical (grinding and milling tools), chemical (wet and dry chemistries) and other approaches such as laser...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 553-558, November 12–16, 2000,
...Abstract Abstract A new ultra-short pulse laser ablation based backside sample preparation method has been developed. This technique is contact-less, non-thermal, precise, repetitive and adapted to each type of material present in IC packages. Backside preparation examples are presented...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 470-471, November 10–14, 2019,
...Abstract Abstract Demarest et al. concluded in their previous report that a ten times improvement in placement accuracy was required to enable automated transmission electron microscopy (TEM) sample preparation, and wafer alignment by GDS coordinates demonstrated a factor of two improvement...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 508-512, November 10–14, 2019,
... and development phase, failure analysis plays an important role in determining the root cause of failures seen in test vehicle silicon photonics modules. The fragile nature of the test vehicle modules warrants the development of new sample preparation methods to facilitate subsequent non-destructive...