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printed circuit boards

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Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 313-316, November 18–22, 1996,
...Abstract Abstract A computational macro and micro thermal model of a printed circuit board dielectric breakdown due to local and global heating of the laminate material is presented in this paper. On a macro level, under certain conditions, the circuit board temperature can approach the glass...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 357-361, November 18–22, 1996,
...Abstract Abstract A time delayed dielectric breakdown in printed circuit boards, operating at temperatures below the epoxy resin insulation thermo-electrical limits, is reported. The safe temperature-voltage operating regime was estimated and related to the glass-rubber transition...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 605-608, November 6–10, 2016,
...Abstract Abstract Printed Circuit Boards (PCBs) are easy target for reverse engineering and counterfeiting attacks due to the distributed supply chain. The integrated circuits (ICs) authentication techniques such as Physically Unclonable Function (PUF) are not easily extendible to PCBs...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 59-66, November 5–9, 2017,
...Abstract Abstract This paper describes the failure analysis methods used to characterize micro cracks that resulted in laser vias of printed circuit boards (PCBs) through case studies of destructive failure analysis. Defects such as cracks in laser vias of PCBs can cause open or low leakage...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 469-473, November 12–16, 2006,
...Abstract Abstract Accelerated corrosion leading to system failure has been observed on printed circuit boards present in industrial environments that contain abnormal levels of reduced sulfur gasses, such as hydrogen sulfide (H2S) and elemental sulfur. The problem is compounded by the fact...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 314-316, November 15–19, 2020,
...Abstract Abstract In this paper, we demonstrate a case for non-destructive detection of submicron wide via-crack in printed circuit boards (PCBs) by using in-situ thermal chamber 3D x-ray computed tomography. The defect location is verified by a PFA (Physical Failure Analysis), and good...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 301-308, November 15–19, 2009,
...Abstract Abstract Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 82-87, November 14–18, 2004,
... was between a power and ground plane. This article presents a case study in which the customer was experiencing ignition of a 20-layer printed circuit board after approximately 1000 to 4000 operating hours in an indoor-controlled environment. High currents on the board resulted in extensive damage...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 635-642, November 5–9, 2017,
...Abstract Abstract Multiple, independent, system level test failures that occurred around the same time were traced back to a short circuit on the same type of printed circuit board (PCB). The PCBs were removed from the application and sent to the authors' lab for analysis. This paper reviews...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 333-338, November 3–7, 2002,
...Abstract Abstract In situ decapsulation of plastic devices can be used to avoid the removal or alteration of failure mechanisms caused by exposure to desoldering temperatures. This paper describes techniques to decapsulate devices mounted to a printed circuit board using materials...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 365-369, November 11–15, 2012,
... initiation, followed by fatigue failure that ultimately led to full fracture. A FIB section of a second failure reinforced the finding that the fundamental cracking mechanism was fatigue. crack initiation cracking etching fatigue failure focused ion beam fracture analysis printed circuit boards...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 436-440, November 14–18, 2004,
...Abstract Abstract This paper is a review of propagating faults in printed circuit boards (PCBs) from the perspective of using the resulting burn and melted copper patterns to identify likely locations of fault initiation. Visual examination and x-ray imaging are the main techniques...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 164-172, November 1–5, 2015,
... to facilitate the automation of reverse engineering, and thereby lowering the associated time and cost. In this paper, we demonstrate our proposed process on two different printed circuit boards (PCBs). The first PCB is a four-layer custom designed board while the latter is a more complex commercial system...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 332-336, November 11–15, 2012,
...Abstract Abstract The continuous miniaturization trends followed by a vast majority of electronic applications results in always denser PCBs (Printed Circuit Board) designs and PCBAs (Printed Circuit Board Assembly) with increasing solder joint densities. Current high-end designs feature high...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 261-266, November 14–18, 2004,
...Abstract Abstract The European Union is banning the use of Pb in electronic products starting July 1st, 2006. Printed circuit board assemblies or “motherboards” require that planned CPU sockets and BGA chipsets use lead-free solder ball compositions at the second level interconnections (SLI...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 451-454, November 1–5, 2015,
...Abstract Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 29-37, November 15–19, 2020,
...Abstract Abstract This paper presents a failure analysis to determine the origin of the failure on the soldered balls of one BGA soldered to a Printed circuit board, presenting Intermittency on the soldered joints, by Visual inspection, X ray inspection, Computed Tomography(CT), Cross-section...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 122-126, November 14–18, 2010,
...Abstract Abstract This paper presents a novel technique for decapsulation of integrated circuits (ICs) mounted on printed circuit boards. This technique overcomes wet etch related sidewall blowouts that damage or alter the performance of the IC and board under test. It also allows well defined...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 362-372, November 6–10, 2016,
... it is possible to reach all required areas of a large printed circuit board (PCB) or module to prepare a single component ‘in situ’. This makes subsequent optical or electrical testing faster and often more convenient to accomplish. Electronic End-pointing and 3D curvature compensation methods can often be used...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 440-445, November 2–6, 2003,
... and to reduce the size of the printed circuit board. electronic components failure analysis integrated inductors magnetic emission mapping magnetic sensors printed circuit boards semiconductor applications Magnetic Emission Mapping for Passive Integrated Components Characterisation O. Crépel, Y...