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optical beam-induced current

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Proceedings Papers

ISTFA2007, ISTFA 2007: Conference Proceedings from the 33rd International Symposium for Testing and Failure Analysis, 77-80, November 4–8, 2007,
...Abstract Abstract By implementing two-photon optical-beam-induced current microscopy using a solid-immersion lens, imaging inside a silicon flip chip is reported with 166nm lateral resolution and an axial resolution capable of resolving features only 100nm in height. failure analysis...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 17-21, November 12–16, 2000,
...Abstract Abstract The Single Contact Optical Beam Induced Currents (SCOBIC) is a new failure analysis technique, which allows the imaging of junctions by a single connection to the substrate or power pin of an integrated circuit. Modern packaging technologies and multi-layer metallizations has...
Proceedings Papers

ISTFA1998, ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis, 461-464, November 15–19, 1998,
... in initial part thickness, as well as part wedge and bowing. In this paper we describe an optical beam induced current (OBIC) method for accurate closed-loop endpointing with direct reference to the active device surface on the flipped die. The method relies on an exponentially increasing current...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 255-263, November 11–15, 2012,
... analysis, and OBIC (Optical Beam Induced Current) as a non-destructive technique for detecting and localizing various defects in semiconductor devices. This failure analysis tool was a high resolution optical infrared photon emission microscope used mainly in microelectronics for qualitative analysis...
Proceedings Papers

ISTFA1998, ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis, 25-29, November 15–19, 1998,
.... Results showed that NF-OBIRCH method has three advantages over the conventional OBIRCH method: its spatial resolution is higher; the OBIRCH caused by heating can be observed using the metallized probe without interference from the optical beam induced current; and the OBIC can be observed using...
Proceedings Papers

ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 305-311, November 11–15, 2001,
...: emission microscopy, liquid crystal analysis, and electron beam (e-beam) probing with focused ion beam (FIB) milling. The backside techniques are optical beam induced current (OBIC) and optical beam induced resistance change (OBIRCH). We discuss the fault mechanism, including the relation between the “hot...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 272-277, November 15–19, 2009,
...Abstract Abstract Laser-based failure-analysis techniques such as optical beam-induced current (OBIC) or optical beam-induced resistance change (OBIRCH) involve scanning a focused laser beam across a sample by means of a laser scanning microscope (LSM). In this paper, we demonstrate a new...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 381-386, November 18–22, 1996,
... techniques are exhausted. The flipchip process, however, makes topside analysis impractical in most situations. There are several different techniques that are currently being used for backside analysis. These are emission microscopy (3), optical beam induced current (OBIC) (4), and a combination of software...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 543-551, November 3–7, 2002,
... silicon generated a Seebeck voltage sufficiently large to be detected. Finally, the pulsed Optical Beam Induced Current technique (OBIC) under no bias condition was evaluated and compared to both biased and nonbiased Thermal Laser Stimulation techniques. It proved to be complementary as it offers...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 335-341, November 14–18, 1999,
... numbers of I/O outputs can involve backside and frontside fault localization techniques such as emission microscopy, OBIC (Optical Beam Induced Current) using I.R. laser scanning microscopy, LIVA (Light Induced Voltage Alteration) [1,2], and PICA (Picosecond Imaging Circuit Analysis)[3,4], to identify...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 446-453, October 31–November 4, 2021,
... current (OBIC) techniques, and open defects are isolated by active voltage contrast imaging in the scanning electron microscope (SEM). We confirm our results by transmission electron microscopy (TEM) based cross sectioning. 3D heterogenous integration fault isolation optical beam-induced current...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 108-111, November 2–6, 2008,
... Current (OBIC) imaging. electronic packages failure analysis integrated circuits laser marking optical beam induced current imaging thermally induced voltage alteration An Analytical Technique to Assess the Risk of Laser Damage to Encapsulated Integrated Circuits During Package Laser Marking...
Proceedings Papers

ISTFA1997, ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 159-163, October 27–31, 1997,
...Abstract Abstract This paper describes a new technique, called the Light-Induced State Transition (LIST) method, that uses an optical beam induced current (OBIC) system for failure analysis of CMOS LSIs. This technique allows the user to locate a low signal line shortcircuited to a GND bus...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 533-539, November 6–10, 2016,
...Abstract Abstract Applications of MpOBIC (Multi-photon Optical Beam Induced Current) are discussed for use in defect localization. The MpOBIC signals in a ring oscillator under static conditions are examined and demonstrate the superior optical resolution of the system over traditional OBIRCH...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 393-399, November 18–22, 1996,
... side. This paper discusses fault isolation techniques and procedures used on the back side of the die. The two major back side techniques, back side emission microscopy and back side OBIC (Optical Beam Induced Current), are introduced and applied to solve real problems in failure analysis. A back side...
Proceedings Papers

ISTFA1997, ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 185-188, October 27–31, 1997,
... the standard curve tracer characterizations, and utilization of two microsection techniques, significance is placed on the use of a laser scanning microscope (LSM). The LSM has four main analys is features: photoemission (FE) microscopy, optical beam induced current (OBIC), confocal microscopy and infrared...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 446-450, November 5–9, 2017,
... electron beam induced current electron beam induced resistance change fault localization lock-in techniques optical beam induced resistance change resistance change imaging root cause analysis transistors High resolution localization using lock-in based electron beam methods Felix Rolf, Christian...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 456-463, November 5–9, 2017,
...Abstract Abstract Fault isolation is an important initial component of the failure analysis investigation as it provides the first indicator of the defect physical location. The most broadly familiar fault isolation techniques include photoemission microscopy (PEM), optical beam induced...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 609-612, November 6–10, 2016,
... is also applied to visualization of a magnetic field created by a current flowing inside a printed circuit board and a light emitting diode package. ball grid arrays failure analysis light-emitting diode packages lock-in thermography magnetic field imaging optical beam induced resistance change...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 259-261, November 2–6, 2003,
... via chain failures. The Scanning electron microscope based techniques discussed are Passive Voltage Contrast (PVC) and Substrate Current Imaging (SCI). The optical beam technique discussed is Thermally Induced Voltage Alteration (TIVA) on the Laser Scanning Microscope. A combination...