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microprocessors

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Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 94-97, November 12–16, 2006,
.... failure analysis plasma etching sample preparation scanning capacitance microscopy SOI microprocessors transistors 'HYHORSPHQW RI %DFNVLGH 6FDQQLQJ &DSDFLWDQFH 0LFURVFRS\ 7HFKQLTXH IRU $GYDQFHG 62, 0LFURSURFHVVRUV 9LQRG 1DUDQJ 3 0XWKX0 &KLQ 'HYLFH $QDO\VLV /DERUDWRUKDL &KHH /DQH0' 6LQJDSRUH...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 311-315, November 12–16, 2006,
...Abstract Abstract In this paper, we present application of the SDL technique towards full root cause analysis of functional and structural failures from BIST, SCAN etc. on AMD’s advanced Silicon-on-Insulator (SOI) microprocessors based on a 90 nm process technology node. The devices were...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 419-422, November 12–16, 2006,
...Abstract Abstract The emergence of multiple core, high speed microprocessors in sub 90nm node technologies present challenges for defect localization, especially in SRAM logic circuits involving Array Built In Self Test (ABIST). Voltage sensitive, temperature sensitive and frequency sensitive...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 402-406, November 2–6, 2008,
... and removes the ‘tail’ artifacts due to amplifier ac-coupling response. Three case studies on microprocessor devices with different failure modes are presented to show that the enhancements made a difference between successful and unsuccessful defect localization. AC coupling failure mode analysis...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 309-316, November 14–18, 2010,
.../dV electrical characterization of defective transistors, and correlated the data from SCM technique and electrical data from nano-probing to locate failing transistors. electrical characterization failure analysis microprocessors scanning capacitance microscopy silicon-on-insulator...
Proceedings Papers

ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 87-93, November 11–15, 2001,
... of TDR analysis. The authors have successfully incorporated the TDR technique into AMD’s microprocessor failure analysis flow, improving success rate, reducing risk and decreasing turn-around time. The paper will include a brief description of TDR theory and hardware, technical barriers that the authors...
Proceedings Papers

ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 167-170, November 11–15, 2001,
... the usefulness of laser probing for at least one more generation. failure analysis laser probing liquid immersion optical probing semiconductor wafer fabrication silicon Liquid Immersion Objective for High-Resolution Optical Probing of Advanced Microprocessors Travis Eiles Intel Corporation, Santa...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 377-380, November 10–14, 2019,
...Abstract Abstract This paper analyzes the through-put time and output of fault isolation and failure analysis (FI/FA) flows on state-of-the-art microprocessors. An average reduction in through-put time of 40% was demonstrated with a shortened FI/FA flow while still maintaining a high success...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 3-8, November 12–16, 2000,
...) through-put time (TPT) as compared to backside electron-beam (E-beam) probing because of the elimination of backside trenching and probe hole generation operations. CMOS electron-beam probing failure analysis flip-chip packaging integrated circuits laser voltage probes microprocessors optical...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 547-551, November 12–16, 2000,
...Abstract Abstract Optical probing using the Schlumberger IDS-2000 and other infrared-based analysis techniques have proved to be critical in the debug and analysis of flip-chip-packaged microprocessors. During probing, processors are operating with test patterns that generate a large amount...
Proceedings Papers

ISTFA1998, ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis, 472-482, November 15–19, 1998,
... of backside analytical approaches, some examples of applications and a case study are also included. advanced microprocessors failure analysis flip chips sample preparation Abstract The advent of Flip Chip and other complex package configurations and process technologies have made conventional...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 555-560, November 6–10, 2016,
...Abstract Abstract This work investigates the origin of the single event hard failures of an advanced commercial FinFET microprocessor induced by heavy ions using a combination of failure analysis tools. It focuses on elucidating the reason behind the hard and catastrophic failures of Intel 5th...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 574-579, November 5–9, 2017,
... of this technique to delayer sub-20 nm microprocessor chips with real defects to root cause the failure is presented. back end of line deprocessing integrated circuits low-k dielectrics mechanical manual polishing microprocessor devices reactive-ion etching root cause analysis wet chemical methods...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 407-411, November 12–16, 2006,
... analysis memory arrays microprocessors pattern testing scan chain testing Improving Yield using Scan and DFT based Analysis for High Performance PowerPC® Microprocessor Ray Talacka, Nandu Tendolkar Freescale Semiconductor, 6501 William Cannon Drive West, Austin, Texas 78735 ray.talacka@freescale.com...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 61-66, November 15–19, 2020,
... of microprocessors manufactured by 14nm 3D FinFET technology was present. Then, we will present how to wisely design electrical probing plan after PEM analysis. The electrical probing plans are tailored to different scan chain and ATPG failures of microprocessors for improving failure analysis success rate without...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 197-202, November 14–18, 2004,
... analysis microprocessors phase-locked loop picosecond imaging circuit analysis quantum efficiency silicon on insulator superconducting single photon detector Timing Analysis of a Microprocessor PLL using High Quantum Efficiency Superconducting Single Photon Detector (SSPD) Peilin Song, Franco...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 741-746, November 3–7, 2002,
...Abstract Abstract This paper presents the first single element time resolved emission (TRE) data collected from microprocessors fabricated with 0.13 µm process silicon using tester loop lengths, and in many cases acquisition times, comparable to laser voltage probing. The data presented here...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 40-44, November 2–6, 2003,
...Abstract Abstract In this paper we examine the use of the Superconducting Single-Photon Detector (SSPD) [1] for extracting electrical waveforms on an IBM microprocessor fabricated in a 0.13µm technology with 1.2V nominal supply voltage. Although the detector used in our experiments is prototype...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 35-38, November 14–18, 1999,
...Abstract Abstract Picosecond Imaging Circuit Analysis (PICA) is a new technique shown here to be applicable to the analysis of complex VLSI circuits. PICA was used to diagnose a timing failure in the early design of the G6 microprocessor chip. The fault occurred at high frequencies upon...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 335-341, November 14–18, 1999,
...Abstract Abstract Characterizing and fault localizing sub 0.25μm six level copper BEOL microprocessor RISC designs operating above 450 MHz clock speeds pose significant challenges in functional defect localization and identification. The flip chip designs of these microprocessors with high...