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Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 515-518, November 9–13, 2014,
...Abstract Abstract The MEMS structure has its particular character like hollow areas inside, and “floating” structures. Traditional TEM sample preparation method usually leads to distortion and dissociation defects of the floating structure. This paper introduces two innovative practical methods...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 489-496, November 12–16, 2000,
...Abstract Abstract Electrical shorting in micro-electro-mechanical systems (MEMS) is a significant production and manufacturing concern. We present a new approach to localizing shorted MEMS devices using Thermally-Induced Voltage Alteration (TIVA) [1]. In TIVA, the shorted, thermally isolated...
Proceedings Papers

ISTFA1997, ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 133-142, October 27–31, 1997,
...Abstract Abstract Micro-Electrical Mechanical Systems (MEMS) is an emerging technology with demonstrated potential for a wide range of applications including sensors and actuators for medical, industrial, consumer, military, automotive and instrumentation products. Failure analysis (FA) of MEMS...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 188-192, November 6–10, 2016,
...Abstract Abstract This paper discussed on how the importance of failure analysis to identify the root cause and mechanism that resulted in the MEMS failure. The defect seen was either directly on the MEMS caps or the CMOS integrated chip in wafer fabrication. Two case studies were highlighted...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 304-307, November 6–10, 2016,
...Abstract Abstract MEMS samples, with their relatively large size and weight, present a unique challenge to the failure analyst as they also included thin films and microstructures used in conventional integrated circuits. This paper describes how to accommodate the large MEMS structures without...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 324-329, October 28–November 1, 2018,
...Abstract Abstract Metal-insulator-metal (MIM) capacitors with single TiO2 and a TiO2/Y2O3 stack are used as insulator films in MIM and MEMS, respectively, are explored. It is found that, under electron injection from bottom electrode, the TiO2 MIM capacitors demonstrate resistive switching...
Proceedings Papers

ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 345-348, November 11–15, 2001,
...Abstract Abstract Optical Micro-Electro-Mechanical Systems (Optical MEMS, or MOEMS) comprise a disruptive technology whose application to telecommunications networks is transforming the horizon for lightwave systems. The influences of materials systems, processing subtleties, and reliability...
Proceedings Papers

ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 349-356, November 11–15, 2001,
...Abstract Abstract The purposes of failure analysis are to localize the failure site, to establish the type of failure and to understand the failure mechanism. Some MEMS, such as Analog Device's accelerometer ADXL501, are confronted with stiction problems. Either we get around the problem...
Proceedings Papers

ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 357-364, November 11–15, 2001,
...Abstract Abstract To investigate the mechanical behavior and failure modes of micro-electromechanical systems (MEMS), a high resolution optical tool capable of imaging both fast and slow movements in three dimensions on a microscopic scale is almost mandatory. We report the first experiments...
Proceedings Papers

ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 365-372, November 11–15, 2001,
...Abstract Abstract Fluid ejection systems fabricated using MEMS (microelectromechanical systems) technology have a wide variety of applications ranging from ink jet thermal printing [1] to drug delivery for medical applications [2]. Microfluidic MEMS drop ejectors accurately control the volume...
Proceedings Papers

ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 373-377, November 11–15, 2001,
...Abstract Abstract The work presented in this paper concerns the characterization of MEMS structures, industrially manufactured using front-side bulk micromachining post-process techniques on CMOS dies. The systematic characterization of mechanical parameters, such as stiffness or mass, on a set...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 275-281, November 3–7, 2002,
...Abstract Abstract In this paper we discuss reliability and failure analysis issues of RF-MEMS capacitive switches. We describe specific instrumentation and methods that can be used for testing and examination of these switches. These include SEM, AFM, SAM, static and dynamic optical...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 295-303, November 3–7, 2002,
... of field and real-time imaging capability means that very deep structures such as surface micromachined MEMS can be clearly imaged with one image, greatly simplifying defect and failure analysis. failure analysis imaging system design microelectromechanical systems microscopes signal processing...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 6-12, November 12–16, 2006,
...Abstract Abstract This paper describes an acoustic phonon-based characterization technique as a novel tool for the characterization of dynamic microelectromechanical (MEMS) devices such as resonators, switches, micromirrors, accelerometers and gyroscopes. The technique intrinsically features...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 147-152, November 12–16, 2006,
...Abstract Abstract This paper reports on a setup and a method that enables automated analysis of mechanical stress impact on microelectromechanical systems (MEMS). In this setup both electrical and optical inspection are available. Reliability testing is possible on a single chip as well...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 79-83, November 15–19, 2020,
...Abstract Abstract Currently gaps in non-destructive 2D and 3D imaging in PFA for advanced packages and MEMS exist due to lack of resolution to resolve sub-micron defects and the lack of contrast to image defects within the low Z materials. These low Z defects in advanced packages include...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 222-229, November 15–19, 2009,
...Abstract Abstract The goal of this paper is to construct a process diagnostic system of the MEMS device based on this "Large Scale Integrated (LSI) Diagnostic system" and then to perform a structural evaluation of the devices based upon the data. The paper explains the methods of analysis...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 290-296, November 14–18, 2010,
...Abstract Abstract Applications of Micro-Electro-Mechanical Systems (MEMS) sensors have developed rapidly in the last decade, increasing the need of Failure Analysis (FA) to characterize abnormalities and to identify failure modes of various types of MEMS devices. One of the greatest challenges...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 540-543, November 3–7, 2013,
...Abstract Abstract This paper demonstrates a new de-process flow for MEMS motion sensor failure analysis, using layer by layer deprocessing to locate defect points. Analysis tools used in this new process flow include IR optical microscopy, thermal system, SEM and a cutting system to de-process...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 216-220, November 14–18, 2004,
...Abstract Abstract Adhesion is important to the yield and performance of MEMS (Micro-Electro-Mechanical Systems) and NEMS (Nano- Electro-Mechanical Systems). Measuring the work of adhesion, with an AFM (Atomic-Force Microscope), allows one to study surface interactions from an energy perspective...