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logic devices

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Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 196-201, November 9–13, 2014,
...Abstract Abstract In this work, we present two case studies on the utilization of advanced nanoprobing on 20nm logic devices at contact layer to identify the root cause of scan logic failures. In both cases, conventional failure analysis followed by inspection of passive voltage contrast (PVC...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 209-214, November 10–14, 2019,
..., a partial layout of a 14nm logic device is investigated by this method, demonstrating the capabilities for structural verification, and structural overlay of elements from a 7nm logic device were also evaluated. The results demonstrate the value of 3D FIB-SEM tomography for physical confirmation...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 550-555, November 5–9, 2017,
... the combination of laser marking and laser deprocessing technique (LDT) as a quick way to deprocess the AOI. It further explores LDT to improve the job efficiency and throughput in logic devices to achieve cost-saving targets. An experiment was performed on a 14nm technology node prototype chip that integrated...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 133-137, October 28–November 1, 2018,
...-resistive defect of Back-End-of-Line (BEOL) which was not detected by a conventional way and efficiently reduced the turn-around time (TAT) of physical failure analysis (PFA) by 57%, prompting fast feedback to fab. back-end-of-line defect logic device low-resistive defect physical failure analysis...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 262-271, November 2–6, 2003,
...Abstract Abstract For certain programmable logic type devices, the electrical, morphological and failure location differences in the ESD signatures between ICC failures and I/O leakage failures have been identified. Based on these electrical, morphological and physical failure signature...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 680-690, November 14–18, 2004,
...Abstract Abstract For certain programmable logic type devices, the electrical, morphological and failure location differences in the ESD signatures between ICC failures and I/O leakage failures have been identified. Based on these electrical, morphological and physical failure signature...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 46-54, November 12–16, 2006,
...Abstract Abstract Logical-to-physical device navigation for failure analysis is often used to drive physical probers and focused ion beam tools. Traditional methods of creating navigation data rely upon the use of time consuming Layout-versus-Schematic (LVS) based methods. By using existing...
Proceedings Papers

ISTFA1998, ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis, 319-322, November 15–19, 1998,
...Abstract Abstract The Logic Mapper software created by Knights Technology bridges the gap between traditional yield enhancement techniques in the wafer fab and analytical failure techniques in the failure analysis (FA) laboratory. With Logic Mapper, fabs can test logic devices as easily...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 336-341, November 6–10, 2016,
...Abstract Abstract Programmable logics, such as complex programmable logic devices (CPLDs) and field programmable gate arrays (FPGAs), are widely used in security applications. In these applications cryptographic ciphers, physically unclonable functions (PUFs) and other security primitives...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 381-386, November 18–22, 1996,
...Abstract Abstract The increasing popularity of flip-chips brings new challenges to those who must perform device analysis (1). Its ability to accommodate high pin-count and high bandwidth microprocessors, DSPs and complex logic devices is increasing the demand for this technology. Conventional...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 158-163, November 13–17, 2011,
...Abstract Abstract Dynamic Laser Stimulation (DLS) techniques for Soft Defect Localization (SDL) have been well documented for logic devices [1][2]. More recent literature has broadened the traditional SDL pass/fail mapping by employing multiple device parameters including power analysis [3...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 67-69, November 15–19, 2020,
...Abstract Abstract In the failure analysis (FA) of modern semiconductor logic device manufactured in foundry fab, efficient identification of wafer edge’s defect was studied by using volume diagnosis analysis and plasma-focused ion beam (FIB) planar deprocessing. As the chip from wafer edge has...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 397-402, October 28–November 1, 2018,
... and SRAM devices. This paper presents three case studies of subtle defects on a technology beyond 14nm that required nanoprobing. defect isolation electrical probing electron beam absorbed current failure analysis logic devices nanoprobing SRAM devices ISTFA 2018: Conference Proceedings...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 141-146, November 12–16, 2000,
... logic and SRAM devices. Voltage contrast at metal 1 to assist leaky gate localization is also proposed. By combining both techniques, the possibility for isolating gate related defects are greatly enhanced. Case studies also show the advantages of the proposed technique over conventional poly level...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 322-326, November 5–9, 2017,
...Abstract Abstract Failure analysis and defect localization on 28nm All Programmable Zynq System-on-Chip (SoC) device is extremely challenging. While conventional FPGA, which only consists of the Programmable Logic, has greater ease and flexibility in pattern generation during fault isolation...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 427-438, November 14–18, 1999,
... between OUT_3 and OUT_1 Defect Localization Process Guided by Electrical Diagnosis We have developed a classification of IDDQ proven faults on full static logical devices (see table 1) : Table 1 Defect localization techniques according to Minimum or Maximum (gray cell) Ileak values(µA), technology and VDD...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 355-358, November 3–7, 2002,
... operate on real microelectronic devices with array mode for memory devices and random mode for logical devices to capture any electrical fault without the device circuitry information. The inspection results are well recorded in a file for post-inspection review. This file is compatible with most...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 274-278, October 31–November 4, 2021,
... such as PVC and nanoprobing sample preparation. Introduction Convention Delayering workflow for FA In semiconductor FA, the process for advanced technology nodes, especially logic device, is very complicated because metal stack is getting thinner. In particular, BEOL structure requires delayer technique...
Proceedings Papers

ISTFA1998, ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis, 259-266, November 15–19, 1998,
... Impedance Output. The electronic pins of the tester are equivalent to a 10 KOhms impedance. The current going through the device is the sum of the logic IDDQ we want to measure, and the current leaking through the DUT's output buffer. This leakage may hide an IDDQ fault. To avoid this, every output pin...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 337-341, October 31–November 4, 2021,
... is scalable and can be used in both lab and fabrication environments. delayering electrical probing logic devices PFIB milling SEM imaging ISTFA 2021: Proceedings from the 47th International Symposium for Testing and Failure Analysis Conference October 31 November 4, 2021 Phoenix Convention...