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laser-assisted device alteration

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Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 527-532, November 6–10, 2016,
...Abstract Abstract Time-resolved laser assisted device alteration (TR-LADA) has interesting applications to reduce the spatial spread of LADA site, as well as benefit device design debug. This paper describes an implementation using a 1063nm wavelength nanosecond pulse-on-demand laser diode...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 43-51, November 15–19, 2009,
...Abstract Abstract We describe a technique that is used to obtain timing information from laser assisted device alteration (LADA). The technique uses a non-pulsed laser scanning microscope to obtain timing information with a temporal resolution on the order of microseconds. Custom software...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 224-230, November 14–18, 2010,
...Abstract Abstract In this paper, we report on the first observation and study of two-photon absorption (TPA) based laser assisted device alteration (LADA) using a continuous-wave (CW) 1340nm laser. The study was conducted using LADA systems equipped with high numerical aperture (NA) liquid...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 173-181, November 3–7, 2013,
...Abstract Abstract By inducing two-photon absorption within the active layer of a 28nm test chip, we demonstrate nonlinear laser-assisted device alteration and single-event upsets by temporarily perturbing the timing characteristics of sensitive transistors. Individual qualitative...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 410-414, November 10–14, 2019,
...Abstract Abstract Laser Assisted Device Alteration (LADA) or Soft Defect Localization (SDL) is commonly used to root cause device marginality due to functional or structural failures. At a high level, LADA involves setting the device under test (DUT) at its marginal state and using focused near...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 73-81, November 9–13, 2014,
...Abstract Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuit. In this paper, the characterization of continuous wave 1340nm laser induced currents and the LADA failure rate show that a two photon absorption...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 241-244, November 1–5, 2015,
...Abstract Abstract In the case of conventional planar FET, Dynamic Laser Stimulation (DLS) is a very effective method to isolate marginal failure. Depending on laser sources, DLS is divided by Soft Defect Localization (SDL) and Laser Assisted Device Alteration (LADA). SDL uses 1320nm wavelength...
Proceedings Papers

ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 106-114, November 6–10, 2005,
... are presented for techniques based on functional tests like Soft Defect Localization (SDL) and Laser Assisted Device Alteration (LADA). A new methodology, Delay Variation Mapping (DVM), will also be presented and discussed. delay variation mapping failure analysis integrated circuit analysis laser...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 14-20, November 1–5, 2015,
...Abstract Abstract A modulated laser beam in the form of a continuous pulse train is explored on Laser Assisted Device Alteration (LADA). We term this pulsed-LADA to differentiate from conventional continuous wave (cw)-LADA. It is found that a duty cycle of less than 0.9 at low frequency above 1...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 82-86, November 9–13, 2014,
...Abstract Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 431-437, November 12–16, 2006,
... quality, which is ever so critical to achieve DPM goals, is becoming a formidable challenge. In this paper, we present a test content validation procedure through novel application of Laser Assisted Device Alteration (LADA), i.e. soft fault injection in state elements, which had proven itself in Itanium®...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 329-333, November 15–19, 2009,
...Abstract Abstract A system-on-chip processor (90 nm technology node) was experiencing a high basic function failure rate. Using a lab-based production tester, laser assisted device alteration, nanoprobing, and physical inspection; the cause of failure was traced to a single faulty P channel...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 1-5, November 1–5, 2015,
..., is introduced as a new fault localization method capable to overcome current limitation of Laser Assisted Device Alteration (LADA) application on soft failure and extends it to hard failure debug. We present the EeLADA methodology and experimental data to demonstrate its feasibility. carrier injection...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 228-237, November 5–9, 2017,
... scanning microscope pulsed lasers solid immersion lens time resolved laser-assisted device alteration Picosecond Time-Resolved LADA Integrated with a Solid Immersion Lens on a Laser Scanning Microscope Kris Dickson, Kent Erington, Dan Bodoh, Keith Serrels, Charles Petri, Juan Ybarra, and Khiem Ly NXP...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 176-179, November 5–9, 2017,
... of analysis is affected. Marginal failure is common in failure analysis in which the failure is dependent to voltage or timing. Instead of using conventional die top micro probing to isolate the failure location, Laser Assisted Device Alteration (LADA) [4] together with modified test pattern is used...
Proceedings Papers

ISTFA2021, ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis, e1-e99, October 31–November 4, 2021,
...Abstract Abstract Presentation slides from the ISTFA 2021 tutorial, “[LADA and SDL: Powerful Techniques for Marginal Failures].” laser-assisted device alteration soft defect localization DOI: 10.31399/asm.cp.istfa2021tpe1 47th International Symposium for Testing and Failure Analysis...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 188-192, November 2–6, 2008,
... memory failure modes, even these fault optimized patterns do not provide adequate fail site localization. In these cases, the MBIST method cannot be adapted readily to perform in-depth electrical characterization. Dynamic Laser Stimulation (DLS) techniques such as LADA (Laser Assisted Device Alteration...
Proceedings Papers

ISTFA2007, ISTFA 2007: Conference Proceedings from the 33rd International Symposium for Testing and Failure Analysis, 86-92, November 4–8, 2007,
... like LADA (Laser Assisted Device Alteration) [16] or PICA (Picosecond Imaging Circuit Analysis) [17], etc. which could also be used. Anyway, the success mainly depends on a good investigation of an electrical diagnosis. Choice of electrical and environmental parameters plays important part in the soft...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 230-233, November 12–16, 2006,
...] and Laser Assisted Device Alteration (LADA) performing [6]. In this article, TIVA and OBIRCH were used to get defect locations. Some case studies will be discussed below. Methods and Analysis The principle of OBIRCH/TIVA is when a laser beam irradiates a circuit, it will cause the resistance change due...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 196-200, November 5–9, 2017,
... resolved laser-assisted device alteration Time Resolved LADA using a modulated pulsed laser to fault isolate bridging defects and framing high accuracy Physical FA plan in 14nm FinFET technologies. Gaurav Mattey, Lava Ranganathan Qualcomm Technologies Inc., San Diego, California, USA. Abstract: Dynamic...