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laser voltage probing lvp

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ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 439-442, November 13–17, 2011,
... functions to ATE test functions. To get through such a difficult situation, this paper presents a novel FA solution, utilizing Laser Voltage Probing (LVP) and set evaluation software and hardware, instead of ATE. This new FA technique can reduce the time to solve a system level application problem, improve...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 3-8, November 12–16, 2000,
...Abstract Abstract A novel optical probing technique to measure voltage waveforms from flip-chip packaged complementary metal-oxide-semiconductor (CMOS) integrated circuits (IC) is described. This infrared (IR) laser based technique allows signal waveform acquisition and high frequency timing...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 313-321, November 3–7, 2013,
...Abstract Abstract Fault localization on functional macros during advanced technology development requires a complex combination of tester based diagnostics and image based techniques including laser voltage imaging (LVI), laser voltage probing (LVP), critical parameter analysis (CPA) with laser...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 249-255, November 2–6, 2008,
...Abstract Abstract We present an overview of Ruby, the latest generation of backside optical laser voltage probing (LVP) tools [1, 2]. Carrying over from the previous generation of IDS2700 systems, Ruby is capable of measuring waveforms up to 15GHz at low core voltages 0.500V and below. Several...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 280-289, October 28–November 1, 2018,
...Abstract Abstract Optical probing from the backside of an integrated circuit (IC) is a powerful failure analysis technique but raises serious security concerns when in the hands of attackers. For instance, attacks using laser voltage probing (LVP) allow direct reading of sensitive information...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 168-172, November 10–14, 2019,
... of the measurement is important as well to understand the failure behavior and find the root cause. This paper demonstrates this importance by describing two insightful case studies with unique observations from laser voltage imaging/laser voltage probing (LVP), optical beam induced resistance change, and soft...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 5-13, November 14–18, 2010,
...Abstract Abstract Laser Voltage Imaging (LVI) is a new application developed from Laser Voltage Probing (LVP). Most LVP applications have focused on design debug or design characterization, and are seldom used for global functional failure analysis. LVI enables the failure analysis engineer...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 193-197, November 15–19, 2009,
... signals through the backside. However, as the fabrication process technology continues to shrink, the operating voltage drops as well. When the operating voltage drops below 1.0V, signal probing systems using TRE find it harder to detect the signals [2]. Fortunately, Laser Voltage Probing (LVP) technology...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 232-238, November 11–15, 2012,
... issue. A complete comparison is done between the 3 contactless probing techniques available in our laboratory which are the E-Beam Testing (EBT), Time Resolved Emission (TRE) and the recent Laser Voltage Probing (LVP) to highlight strength and weakness of each probing techniques in front of this timing...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 179-181, November 10–14, 2019,
...) and Laser Voltage Probing (LVP) are widely established for logic EFA, [3] but require periodic activation via ATE which may not be possible using MBIST hardware and test-patterns optimized for fast production testing. This paper discusses the test setup challenges to enable LVI & LVP on SRAM fails...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 221-227, November 5–9, 2017,
...Abstract Abstract Laser voltage imaging (LVI) and its derivatives are established techniques for isolating broken scan/JTAG chains which work on periodic signals, but are ineffective when debugging aperiodic signals. Laser voltage probing (LVP) works on one transistor at a time which makes...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 184-190, November 2–6, 2003,
...Abstract Abstract In recent years, two new techniques were introduced for flip chip debug; the Laser Voltage Probing (LVP) technique and Time Resolved Light Emission Microscopy (TRLEM). Both techniques utilize the silicon’s relative transparency to wavelengths longer than the band gap...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 35-41, November 1–5, 2015,
...Abstract Abstract Laser Voltage Probing (LVP) using continuous-wave near infra-red lasers are popular for failure analysis, design and test debug. LVP waveforms provide information on the logic state of the circuitry. This paper aims to explain the waveforms observed from combinational...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 161-165, November 6–10, 2016,
...Abstract Abstract Visible Light (or Laser) Probing (VLP) is an exciting new development in Laser Voltage Probing (LVP) technology because it promises a dramatic improvement in resolution over current Near Infrared (NIR) solutions [1-3]. To have adequate visible light transmission for waveform...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 110-114, November 9–13, 2014,
...Abstract Abstract Visible light laser voltage probing (LVP) for improved backside optical spatial resolution is demonstrated on ultra-thinned samples. A prototype system for data acquisition, a method to produce ultrathinned SOI samples, and LVP signal, imaging, and waveform acquisition...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 6-13, November 1–5, 2015,
...Abstract Abstract Visible light laser voltage probing (LVP) for backside improved optical spatial resolution is demonstrated on ultrathinned bulk Si samples. A prototype system for data acquisition, a method to produce ultra-thinned bulk samples as well as LVP signal, imaging, and waveform...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 36-39, November 2–6, 2003,
...]. Chronologically, such techniques include picosecond image circuit analysis (PICA)[2], laser voltage probing (LVP)[3], and dynamic or time-resolved emission (TRE)[4]. In typical examples of backside probing the device under test (DUT) relies on device stimulation from automatic test equipment (ATE) or equivalent...
Proceedings Papers

ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 275-280, November 11–15, 2001,
... (PICA) and Laser Voltage Probing (LVP). Although optical transparency does depend on gallium implantation dose, Ga staining is, however, not necessarily a limitation to the implementation of photon optical tools in the debug laboratory. Comparisons are made on the results from devices under...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 753-762, November 3–7, 2002,
...) and low dark-count rate (<30 s-1). TRPE measurements taken from a 0.13 μm geometry CMOS IC are presented. A single laser, time-differential probing scheme that is being investigated for next-generation laser voltage probing (LVP) is also discussed. This new scheme is designed to have shot-noise-limited...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 148-153, November 10–14, 2019,
... challenges occur after the die is packaged. The difficulty further lies in non-destructively analyzing the die. Another issue with failure analysis is accurately deprocessing the device for probe pad deposition. Techniques like Electro Optical Probing (EOP) or Laser Voltage Probing (LVP) acquire electrical...