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laser assisted device alteration lada

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Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 410-414, November 10–14, 2019,
...Abstract Abstract Laser Assisted Device Alteration (LADA) or Soft Defect Localization (SDL) is commonly used to root cause device marginality due to functional or structural failures. At a high level, LADA involves setting the device under test (DUT) at its marginal state and using focused near...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 73-81, November 9–13, 2014,
...Abstract Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuit. In this paper, the characterization of continuous wave 1340nm laser induced currents and the LADA failure rate show that a two photon absorption...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 241-244, November 1–5, 2015,
...Abstract Abstract In the case of conventional planar FET, Dynamic Laser Stimulation (DLS) is a very effective method to isolate marginal failure. Depending on laser sources, DLS is divided by Soft Defect Localization (SDL) and Laser Assisted Device Alteration (LADA). SDL uses 1320nm wavelength...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 224-230, November 14–18, 2010,
...Abstract Abstract In this paper, we report on the first observation and study of two-photon absorption (TPA) based laser assisted device alteration (LADA) using a continuous-wave (CW) 1340nm laser. The study was conducted using LADA systems equipped with high numerical aperture (NA) liquid...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 82-86, November 9–13, 2014,
...Abstract Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 14-20, November 1–5, 2015,
...Abstract Abstract A modulated laser beam in the form of a continuous pulse train is explored on Laser Assisted Device Alteration (LADA). We term this pulsed-LADA to differentiate from conventional continuous wave (cw)-LADA. It is found that a duty cycle of less than 0.9 at low frequency above 1...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 1-5, November 1–5, 2015,
..., is introduced as a new fault localization method capable to overcome current limitation of Laser Assisted Device Alteration (LADA) application on soft failure and extends it to hard failure debug. We present the EeLADA methodology and experimental data to demonstrate its feasibility. carrier injection...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 43-51, November 15–19, 2009,
...Abstract Abstract We describe a technique that is used to obtain timing information from laser assisted device alteration (LADA). The technique uses a non-pulsed laser scanning microscope to obtain timing information with a temporal resolution on the order of microseconds. Custom software...
Proceedings Papers

ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 106-114, November 6–10, 2005,
... are presented for techniques based on functional tests like Soft Defect Localization (SDL) and Laser Assisted Device Alteration (LADA). A new methodology, Delay Variation Mapping (DVM), will also be presented and discussed. delay variation mapping failure analysis integrated circuit analysis laser...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 431-437, November 12–16, 2006,
... quality, which is ever so critical to achieve DPM goals, is becoming a formidable challenge. In this paper, we present a test content validation procedure through novel application of Laser Assisted Device Alteration (LADA), i.e. soft fault injection in state elements, which had proven itself in Itanium®...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 527-532, November 6–10, 2016,
...Abstract Abstract Time-resolved laser assisted device alteration (TR-LADA) has interesting applications to reduce the spatial spread of LADA site, as well as benefit device design debug. This paper describes an implementation using a 1063nm wavelength nanosecond pulse-on-demand laser diode...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 329-333, November 15–19, 2009,
.... This is the dedicated supply for the processor core. Devices could be made to pass at elevated voltages (from 1.4 V to 1.7 V and higher compared to a nominal value of 1.2 V). Laser Assisted Device Alteration (LADA) The processor core block of the SOC has no design-for-test capability for logic fault diagnosis...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 176-179, November 5–9, 2017,
... of analysis is affected. Marginal failure is common in failure analysis in which the failure is dependent to voltage or timing. Instead of using conventional die top micro probing to isolate the failure location, Laser Assisted Device Alteration (LADA) [4] together with modified test pattern is used...
Proceedings Papers

ISTFA2021, ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis, e1-e99, October 31–November 4, 2021,
...Abstract Abstract Presentation slides from the ISTFA 2021 tutorial, “[LADA and SDL: Powerful Techniques for Marginal Failures].” laser-assisted device alteration soft defect localization DOI: 10.31399/asm.cp.istfa2021tpe1 47th International Symposium for Testing and Failure Analysis...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 228-237, November 5–9, 2017,
... scanning microscope pulsed lasers solid immersion lens time resolved laser-assisted device alteration Picosecond Time-Resolved LADA Integrated with a Solid Immersion Lens on a Laser Scanning Microscope Kris Dickson, Kent Erington, Dan Bodoh, Keith Serrels, Charles Petri, Juan Ybarra, and Khiem Ly NXP...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 54-59, November 13–17, 2011,
... interconnects on 130nm products almost eliminated milling selectivity of interconnects over ILD, then low-k dielectrics on 90nm further exasperated this issue. The LADA: Laser Assisted Device Alteration (LADA), was developed initially as a debug technique. A near-infrared laser is raster scanned over a failing...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 168-172, November 3–7, 2013,
...], or via local heating of the IC [3]. They can also be used to directly measure electrical waveforms via laser voltage probing (LVP) [4]. An interesting question can then be asked, what happens when these methods are used simultaneously? For example, one could apply Laser Assisted Device Alteration (LADA...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 188-192, November 2–6, 2008,
... memory failure modes, even these fault optimized patterns do not provide adequate fail site localization. In these cases, the MBIST method cannot be adapted readily to perform in-depth electrical characterization. Dynamic Laser Stimulation (DLS) techniques such as LADA (Laser Assisted Device Alteration...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 299-303, November 9–13, 2014,
... absorption in the bulk. Slightly shorter wavelengths can be used when perturbing the device is desired, as in laser-assisted device alteration (LADA), but these still cannot resolve features below ~200 nm. Near-field scanning optical microscopy (NSOM) offers one solution. NSOM is a scanning probe technique...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 14-19, November 14–18, 2010,
... based on laser-induced carrier generation techniques such as optical beam-induced current (OBIC) imaging [4] and laser-assisted device alteration (LADA) [5]. Therefore, through extrapolation and amalgamation of the traditional OBIC technique we investigate the feasibility of two-photon LADA (2p LADA)1...