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laser assisted device alteration lada

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Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 1-5, November 1–5, 2015,
... as a new fault localization method capable to overcome current limitation of Laser Assisted Device Alteration (LADA) application on soft failure and extends it to hard failure debug. We present the EeLADA methodology and experimental data to demonstrate its feasibility. carrier injection debugging...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 82-86, November 9–13, 2014,
... Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 410-414, November 10–14, 2019,
... Abstract Laser Assisted Device Alteration (LADA) or Soft Defect Localization (SDL) is commonly used to root cause device marginality due to functional or structural failures. At a high level, LADA involves setting the device under test (DUT) at its marginal state and using focused near infra...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 241-244, November 1–5, 2015,
... Abstract In the case of conventional planar FET, Dynamic Laser Stimulation (DLS) is a very effective method to isolate marginal failure. Depending on laser sources, DLS is divided by Soft Defect Localization (SDL) and Laser Assisted Device Alteration (LADA). SDL uses 1320nm wavelength laser...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 431-437, November 12–16, 2006,
... is ever so critical to achieve DPM goals, is becoming a formidable challenge. In this paper, we present a test content validation procedure through novel application of Laser Assisted Device Alteration (LADA), i.e. soft fault injection in state elements, which had proven itself in Itanium® 2 array test...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 73-81, November 9–13, 2014,
... Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuit. In this paper, the characterization of continuous wave 1340nm laser induced currents and the LADA failure rate show that a two photon absorption explanation...
Proceedings Papers

ISTFA2022, ISTFA 2022: Tutorial Presentations from the 48th International Symposium for Testing and Failure Analysis, o1-o20, October 30–November 3, 2022,
... Abstract This presentation provides an overview of the Arduino microcontroller development board, its features and capabilities, and its integrated design environment. It also provides examples of its use in soft defect localization (SDL) and laser assisted device alteration (LADA). laser...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 224-230, November 14–18, 2010,
... Abstract In this paper, we report on the first observation and study of two-photon absorption (TPA) based laser assisted device alteration (LADA) using a continuous-wave (CW) 1340nm laser. The study was conducted using LADA systems equipped with high numerical aperture (NA) liquid and solid...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 14-20, November 1–5, 2015,
... Abstract A modulated laser beam in the form of a continuous pulse train is explored on Laser Assisted Device Alteration (LADA). We term this pulsed-LADA to differentiate from conventional continuous wave (cw)-LADA. It is found that a duty cycle of less than 0.9 at low frequency above 1 kHz...
Proceedings Papers

ISTFA2022, ISTFA 2022: Tutorial Presentations from the 48th International Symposium for Testing and Failure Analysis, c1-c104, October 30–November 3, 2022,
... Abstract This presentation is an application-oriented tutorial on laser-assisted device alteration (LADA) and soft defect localization (SDL) techniques and how they are used to analyze marginal digital failures and identify analog circuits that are sensitive to voltage perturbations...
Proceedings Papers

ISTFA2021, ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis, e1-e99, October 31–November 4, 2021,
... Abstract This presentation is an application oriented tutorial on laser-assisted device alteration (LADA) and soft defect localization (SDL) techniques and how they are used to analyze marginal digital failures and identify analog circuits that are sensitive to voltage perturbations...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 43-51, November 15–19, 2009,
... Abstract We describe a technique that is used to obtain timing information from laser assisted device alteration (LADA). The technique uses a non-pulsed laser scanning microscope to obtain timing information with a temporal resolution on the order of microseconds. Custom software is used...
Proceedings Papers

ISTFA2021, ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis, d1-d96, October 31–November 4, 2021,
...), and laser-assisted device alteration (LADA), and those based on absorption in metals, as in thermally induced voltage alteration (TIVA), optical beam induced resistance change (OBIRCH), and thermoelectric voltage generation or Seebeck effect imaging (SEI). The presentation also covers thermoluminescence...
Proceedings Papers

ISTFA2022, ISTFA 2022: Tutorial Presentations from the 48th International Symposium for Testing and Failure Analysis, d1-d78, October 30–November 3, 2022,
...), and laser-assisted device alteration (LADA), and those based on absorption in metals, as in thermally induced voltage alteration (TIVA), optical beam induced resistance change (OBIRCH), and thermoelectric voltage generation or Seebeck effect imaging (SEI). The presentation also covers thermoluminescence...
Proceedings Papers

ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 144-152, October 30–November 3, 2022,
... and improve their efficacy related to the demands posed by the debug of 5nm technologies and smaller geometries. We anticipate that fully integrated and evolved dLVP will complement workhorse FA applications such as Laser Assisted Device Alteration (LADA) and Soft Defect Localization (SDL) analysis. Wherein...
Proceedings Papers

ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 106-114, November 6–10, 2005,
... for techniques based on functional tests like Soft Defect Localization (SDL) and Laser Assisted Device Alteration (LADA). A new methodology, Delay Variation Mapping (DVM), will also be presented and discussed. delay variation mapping failure analysis integrated circuit analysis laser assisted device...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 329-333, November 15–19, 2009,
... for the processor core. Devices could be made to pass at elevated voltages (from 1.4 V to 1.7 V and higher compared to a nominal value of 1.2 V). Laser Assisted Device Alteration (LADA) The processor core block of the SOC has no design-for-test capability for logic fault diagnosis. This forced a physical fault...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 176-179, November 5–9, 2017,
... failure is common in failure analysis in which the failure is dependent to voltage or timing. Instead of using conventional die top micro probing to isolate the failure location, Laser Assisted Device Alteration (LADA) [4] together with modified test pattern is used to isolate the failure location...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 228-237, November 5–9, 2017,
... microscope pulsed lasers solid immersion lens time resolved laser-assisted device alteration Picosecond Time-Resolved LADA Integrated with a Solid Immersion Lens on a Laser Scanning Microscope Kris Dickson, Kent Erington, Dan Bodoh, Keith Serrels, Charles Petri, Juan Ybarra, and Khiem Ly NXP...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 527-532, November 6–10, 2016,
... Abstract Time-resolved laser assisted device alteration (TR-LADA) has interesting applications to reduce the spatial spread of LADA site, as well as benefit device design debug. This paper describes an implementation using a 1063nm wavelength nanosecond pulse-on-demand laser diode to obtain...