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Proceedings Papers

ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 40-45, November 6–10, 2005,
... process failure analysis fault isolation silicon manufacturing static infrared emission Multi-Point Probing on 65nm Silicon Technology using Static IREM-based Methodology Daniel Bockelman, Asifur Rahman, Ifar Wan, Steven Chen, Scott Ettinger Intel Corporation., Hillsboro, OR USA Email...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 531-537, November 3–7, 2002,
... complexity compared with dynamic probing techniques. Introduction The Infrared Emission Microscope (IREM) has been highly successful in detecting and localizing circuit problems and defects during silicon debug, low yield analysis (LYA), and fault isolation of the Pentium ® and Pentium ® 4 Microprocessors...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 65-72, November 9–13, 2014,
... Abstract Logic State Imaging (LSI) using Infra-Red Emission Microscopy (IREM) [1-4] has been an indispensable technology for silicon CMOS process development and product debug applications. Its main limitations are relatively poor spatial resolution due to the broadband near-infrared photons...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 1-5, November 15–19, 2020,
... and yield/reliability debug on base die as base die is sandwiched between top die and package and existing optical debug techniques such as infrared emission microscopy (IREM), laser assisted device alteration (LADA), laser timing module (LTM), laser voltage probe (LVP), and thermal induced voltage...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 267-269, November 1–5, 2015,
... Abstract Infrared emission microscopy (IREM) is often the simplest and fastest fault isolation technique. In contrast to emission microscopy, laser-based techniques, such as thermally induced voltage alteration and light induced voltage alteration (LIVA), are not as dependent on leakage...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 173-176, November 12–16, 2000,
... Laboratories Infrared Emission Microscope (IREM), and a prototype system, which used a Sensors Unlimited camera. The key parameters from each detector are summarized in Table 1. Table 1 Detectors System LSM IREM SUI Detector Si MCT InGaAs Range ( m) <1.1 1 - 2.5 0.9 1.7 Array Size 512X512 256X256 320X240...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 190-196, November 11–15, 2012,
.... On infrared emission microscopes (IREM), DPI in optical imaging mode and DPI plus probing [DPIP] in emission mode, showed 2X or more in terms of optical resolution (imaging mode) and 2X or more SnR (emission-probing mode) improvements. Striking images in probing mode, revealing previously “invisible” emission...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 54-59, November 13–17, 2011,
... of the Debug Block, we then provide an overview of the LADA, IREM, LVP, TRE, and FIB tools and their corresponding technical challenges for Intel’s next generation microprocessors. Finally we discuss the circuits, layout, and 32nm results. circuit Edit debug block focused ion beam infra-red emission...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 52-56, November 1–5, 2015,
... is outlined as follows. We will describe the key optical FI techniques for 10nm technologies and beyond, which includes infrared emission microscopy (IREM) and Continuous-Wave Laser Scanning Microscope based Signal imaging and Probing (CW-SIP) in the next section. We will then discuss nanoprobing techniques...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 103-108, November 14–18, 2004,
... Infrared Emission Microscopy (IREM). An anomalous emission was observed under the power pad, which was the subject of ESD test. Subsequently, backside reconstruction was done (Figure 11) to allow front side deprocessing, which revealed the ESD damage. See Figures 12 and 13. Figure 8: Parallel lapping...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 21-24, November 1–5, 2015,
... of activated TVC circuits. From this experiment, it is concluded that an additional circuit or experimental setup is not necessary for LLSI. Introduction Logic state imaging (LSI) of operating devices using infra-red (IR) emission, which is also known as infra-red emission microscopy (IREM), has been one...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 578-582, November 11–15, 2012,
.... This has resulted in multiple issues of die cracking/chipping after die thinning for subsequent Infra- Red Emission Microscope (IREM) examination. A special interposer support (debug interposer) was fabricated to attach PoP device on to the debug interposer for extra mechanical support. Figure 3 shows...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 110-118, November 15–19, 2009,
... and was used to collect post-FIB data for speed path debug. Due to the sensitivity of power, thermal, and speed data on the 1266 process lead vehicle product, further detail cannot be shared at this time. Impact of Ultra-Thin of Physical Si Debug Optical Probing IREM IREM analysis was performed on a Intel Core...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 498-505, November 14–18, 2004,
... the last written data rather than the cell being read. Relying only on raster and LYA would be greatly insufficient as this defect causes all cells to fail raster but yield normal LYA curves. 7. Emission Analysis Thermal or infrared emission microscopy(IREM) is performed within the failing boundary...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 514-519, November 6–10, 2016,
...) Fig 3: (a) LVP imaging at the signal frequency showing abnormal spot at the failing transistor and shows no modulation in the following nodes (b) LVP Probing waveforms at the passing and failing inverters (c) IREM data shows strong emission when the input is set to 1 and no emission when the input...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 424-427, November 13–17, 2011,
... and technique improved remaining silicon thickness uniformity as well as process time. Introduction Post silicon validation techniques specifically FIB (Focused Ion Beam) circuit editing and optical probing using LADA (Laser Assisted Device Alteration), TRE (Time Resolved Emission), and IREM (Infrared Emission...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 261-263, November 15–19, 2020,
... of the bridged signals and VDD (GND) ISTFA 2014 Proceedings. [2] D. Bockelman, A. Rahman, I. Wan, S. Chen, S. Ettinger, Multi-point Probing on 65nm Silicon Technology using Static IREM-based Methodology ISTFA 2005 Proceedings. [3] TetraMAX® ATPG User Guide Version L-2016.03-SP2, June 2016, Bridging Fault ATPG...
Proceedings Papers

ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 352-354, October 30–November 3, 2022,
... work of members from global FA team in both Singapore and San Diego, particular to Grace Tan, Martin Villafana which provided many useful guidance & discussions. References [1] Ifar Wan, D. Bockelman, Yun Xuan, S. Chen, IREM usage in the detection of highly resistive failures on 65nm products , IEEE...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 349-353, November 3–7, 2002,
... electron beam probing. LVP was developed to work similar to electron beam probing to acquire the AC behavior of the device. The Infrared Emission Microscope (IREM) was developed to detect the infrared radiation emitted by the defect when the device is excited under normal operation. Limitations Even though...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 299-303, November 9–13, 2014,
...). Introduction Current optical fault isolation tools exploit properties of silicon at infrared wavelengths to nondestructively probe integrated circuits. Such tools include infrared emission microscopy (IREM), laser voltage probing (LVP), and time- resolved emissions (TRE). In FI the device under test (DUT...