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high-resolution targeted patterns

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Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 377-387, October 31–November 4, 2021,
... of automatic test pattern generator (ATPG) diagnosis in order to determine the failure mechanism. This paper proposes a way to improve resolution using single-shot logic and high-resolution targeted patterns. Two cases are presented to demonstrate the approach and show how it performed on actual failing units...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 7-11, November 3–7, 2013,
... and 10 keV. Beyond this range, X-rays are practically not detected. The metallic targets - with a high precision positioning system -, the sample stage and the detector (a Princeton Instruments Pixis XB) are provided by Gatan, Inc. This tomography system is based on the acquisition of a series...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 390-395, November 2–6, 2008,
... Generation Deterministic DATPG Focused Multiple Detect Test Patterns Implementation cost Low-High Low Scalability Worst case time complexity is O(S2) Time complexity is O(S) Pattern count Usually smaller pattern count when S is small; Pattern count could be large when S is large Depends on S, usually...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 449-459, October 28–November 1, 2018,
...-aware, and IDDQ. These models are necessary to ensure the high quality of products delivered to the customer. Digital Design File Requirements To enable the FA group to perform ATPG testing, diagnosis, and generation of new patterns including single shot logic patterns; various digital design files...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 339-345, November 15–19, 2009,
... spectrometry scanning transmission ion imaging The Helium Ion Microscope For High Resolution Imaging, Materials Analysis, Circuit Edit and FA Applications William B. Thompson, John Notte, Larry Scipioni, Mohan Ananth, Lewis Stern, And Colin Sanford Carl Zeiss SMT, Orion Business Unit, Peabody, MA 01960...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 27-31, November 14–18, 2010,
... prove to be a nuisance for Raman imaging, the high order non-linearity sparked an immediate investigation into their potential application to non-linear imaging. Theoretical modeling predicted a three-fold improvement in image resolution over the diffraction limit. Experimental results using two...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 412-418, November 12–16, 2006,
... quality while maintaining test cost, yield learning based on production test failures mandates that the diagnosis tool be capable of diagnosing directly with compressed pattern failures. The diagnosis tool utilized in this study is suitable for both one-off analysis as well as yield learning based on high...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 526-537, November 5–9, 2017,
... is called targeted pattern and as the name suggests, the purpose of this pattern is to test a specific area related to the suspected fault more extensively for greater diagnostic resolution. Compared with the original pattern, the targeted pattern is generally shorter but more effective at testing a fault...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 544-549, November 5–9, 2017,
... is to provide enough high resolution results to be analyzed by traditional EFA methods like Emission microscopy (EMMI), Optical Beam Induced Resistance Change (OBIRCH) or Thermal hotspots. The findings are usually validated by PFA and the root cause learning is based on the FA hits. For example, if an open M2...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 163-170, November 14–18, 2010,
... and failure analysis of 3D integrated semiconductor devices- novel tools for fault isolation, target preparation and high resolution material analysis Frank Altmann, Matthias Petzold, Christian Schmidt, Roland Salzer Fraunhofer Institute for Mechanics of Materials, Halle, Germany Frank.Altmann...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 383-389, November 2–6, 2008,
... of a transition is important when the guided probe tracing is needed to identify a defect location. This could happen when there are multiple defects on a chip while the logic diagnosis cannot identify a high confidence suspect. In this case, failure analysis engineer will simply trace back from one...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 86-92, October 28–November 1, 2018,
..., the output Z of the XNOR should have high states when both its inputs have the same state, that is, when both A1 and A2 are 0 or both 1. Conventionally LP is performed at the output Z of the cell and compared to the electrical expectation. However, close inspection of the waveforms revealed several...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 369-376, October 31–November 4, 2021,
... is a gross delay fault model and requires an ordered pair of test vectors to create a transition (either at the input or output signals of a logic gate) and propagate the effect. TDF patterns screen out soft failures (failures that occur at a high frequency or lower voltage and are not stuck). In a classical...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 113-116, November 14–18, 2010,
... focused ion beam for milling and a high resolution electron beam for imaging, the tool has the ability to do precision cross-sections or top-down delayering of selected features. Unlike its arguably higher performance small chamber laboratory counterpart, the in-line dual-beam FIB allows direct inspection...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 417-419, November 3–7, 2013,
...Abstract Abstract We report on aberration compensation in an aplanatic solid immersion lens microscope used for high-resolution backside inspection of silicon integrated circuits. The imaging quality of aplanatic SIL microscope is shown to be significantly degraded by aberrations, especially...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 311-316, November 14–18, 1999,
... source ion column, a field emission scanning electron microscope, and four gas injectors was used for probe pad deposition. The ion beam was at 30 keV with currents between 4 and 350 pA. SEM imaging with a resolution down to 1.5 nm was performed using an immersion lens type ultra high resolution (UHR...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 158-165, November 2–6, 2003,
... the gold target. The major drawback to this technique is that the sample normal is at very high tilt angle (70o) to the electron beam. Thus the image is highly foreshortened along the vertical axis, by about a factor of three (1/cos 70o = 2.9). Also, the lateral spatial resolution of the image...
Proceedings Papers

ISTFA2007, ISTFA 2007: Conference Proceedings from the 33rd International Symposium for Testing and Failure Analysis, 107-114, November 4–8, 2007,
... tilt 5. After further thinning of the sample with lowest beam current 6. After Final Cut to cut the lamella loose. The lamella is floating by electrostatic forces ready for ex-situ liftout. The automatically prepared samples were imaged in High Resolution STEM mode as well as in STEM mode in a TEM...
Proceedings Papers

ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 1-7, November 6–10, 2005,
... failure analysis laser scanning microscopy Diffractive Lenses for High Resolution Laser Based Failure Analysis Frank Zachariasse Philips Semiconductors, Nijmegen, The Netherlands frank.zachariasse@philips.com Martijn Goossens Philips Research, Eindhoven, The Netherlands martijn.goossens@philips.com...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 207-213, November 5–9, 2017,
... on this matching result is enabled. Further works are required for understandings of simulated phase images in compound logic cells having many states or high-Z states. compound logic gates electro-optical frequency mapping failure analysis phase image simulation Electro-Optical Frequency Mapping Phase...