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equivalence test

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Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 263-268, October 31–November 4, 2021,
.... equivalence test probability density quantile comparison equivalence criteria statistical failure analysis ISTFA 2021: Proceedings from the 47th International Symposium for Testing and Failure Analysis Conference October 31 November 4, 2021 Phoenix Convention Center, Phoenix, Arizona, USA DOI: 10.31399...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 449-459, October 28–November 1, 2018,
... this analytical data with the layout and fan out of the net instances could provide greater resolution into the likely defective area. Furthermore, adding constraints can also be used to further simplify the test and/or control the fan out of failures. Only equivalencies where there is observable fan out can...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 36-39, November 2–6, 2003,
...]. Chronologically, such techniques include picosecond image circuit analysis (PICA)[2], laser voltage probing (LVP)[3], and dynamic or time-resolved emission (TRE)[4]. In typical examples of backside probing the device under test (DUT) relies on device stimulation from automatic test equipment (ATE) or equivalent...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 134-138, November 14–18, 2004,
...Abstract Abstract Electrical fault isolation constitutes the first steps in characterizing and isolating the failure modes and root causes of a failing motherboard. Ideally the Failure Analysis Test tools provide complete coverage of all motherboard buses and silicon devices. Time and resource...
Proceedings Papers

ISTFA2007, ISTFA 2007: Conference Proceedings from the 33rd International Symposium for Testing and Failure Analysis, 337-343, November 4–8, 2007,
...Abstract Abstract The analyzed new Application Specific Integrated Circuit (ASIC) design failed latch-up test on two input pins during current stress. In order to determine the root cause, the Failure Analysis (FA) with use of backside Emission Microscopy (EMMI) was performed. The EMMI results...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 121-126, November 18–22, 1996,
... transistor circuit. A leak path' A O - H 1 States S1 S2 S3 S4 Stimulus A I 0 1 0 0 1 1 1 0 Normal resDonses B Y 0 1 1 1 0 1 1 0 Faulty responses B' Y' M1 1 1 1 M2 M5 1 0 TP: test pattern Rno (C) Fig. 8. Circuit fault 2 and its equivalent circuits, (a) Circuit fault 2. (b) A truth table. M1, M2 and M5...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 127-132, November 18–22, 1996,
... as a diagnostic tool, both the simulation and manufacturing modes of evaluation were done. In simulation mode, both the fault model and the heuristics used by the fault diagnosis software are tested by inserting known defects using a focused ion beam (FIB), machine. This process is then repeated with unknown...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 389-396, November 14–18, 1999,
... were injected in good packaged units that had passed all tests. The first type of defect was a stuck-at defect injected by tying a signal line to power or ground. Eight stuck-at faults were injected and successfully isolated. It was confirmed that the diagnosis results yielded a single equivalence...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 559-568, November 3–7, 2002,
... of interconnect material properties and physical dimensions. We compare the empirical results of this study to SPICE calculations, which were based on an equivalent circuit element model of the interconnect. We show that the empirical data obtained in these experiments supports the validity of the equivalent...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 138-140, October 28–November 1, 2018,
... are regarded as either decrease in charge at cell capacitor or increase in systematic interferences. Simple equivalent circuit of One Transistor One Capacitor (1T1C) DRAM and theoretical approach in time-domain are provided for quantitative noise analysis related to sense amplifier circuitries. Results show...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 191-196, November 14–18, 2004,
...Abstract Abstract In this paper, DACS stands for Defects that Affect Chain and System, which could be any type of silicon defects caused by an unintentional interaction between a scan chain signal and a system logic signal. The device could fail scan chain testing or show up as a latent failure...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 320-327, November 2–6, 2008,
...: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis November 02 November 06, 2008, Portland, Oregon, USA DOI: 10.31399/asm.cp.istfa2008p0320 Copyright © 2008 ASM International® All rights reserved. www.asminternational.org 320 or with other regions to form the final...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 434-439, November 10–14, 2019,
...Abstract Abstract Looping on test vectors is a widespread requirement in failure analysis of semiconductor devices. The start of the loop and the number of vectors in the loop can be of critical importance. Present-day vector memory architecture tends to impose restrictions on both due to test...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 50-54, November 11–15, 2012,
... to detect and differentiate between these TSV related failures. High-frequency TSV Failure Analysis 50 Copyright © 2012 ASM International® All rights reserved www.asminternational.org ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis November 11...
Proceedings Papers

ISTFA1998, ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis, 49-55, November 15–19, 1998,
... evolution of a nMOS transistor (2N4351) under FIB irradiation The required value of the 2N4351 transistor gate voltage to obtain a drain current of 5mA has been determined from the initial Id-Vg characteristics of the transistor under test (drain biased at 100mV. It should be noticed that this equivalent...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 713-722, November 3–7, 2002,
...- form the CT tests with the defect provoked. The currents measured under the CT tests can be adjusted by subtract- ing the currents measured under the defect provoking test. Even though the presence of the defect s current is likely to change the equivalent resistances of the CUT under the CT tests...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 197-203, November 10–14, 2019,
...-on-demand blanking could not reach the 200-ps equivalent widths achieved with sinusoidal blanking. As corroborating evidence that we can achieve 200-ps equivalent width with sinusoidal blanking using our standard blanker, we built a test system to go inside our SEM system consisting of a printed circuit...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 9-17, November 14–18, 2004,
.... The system utilizes a 10 ps pulse-width mode-locked laser to generate equivalent-time sampling pulses. A custom wavelength-tunable and spectrally matched external-cavity laser diode source is used for noise cancellation. A 20-GHz intrinsic system bandwidth with a 2x lower noise-floor, in comparison...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 509-519, November 11–15, 2012,
... circuits. IC manufacturing processes have become more and more complex, and hence yield and reliability are facing new challenges [1]. Failure analysis of observed failures during test is always preceded by a logic diagnosis phase. Logic diagnosis is the process of isolating the source of observed errors...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 162-165, November 14–18, 2004,
... to the involved device polysilicon resistor. In the latter case, each modification step being followed by an electrical characterization, the evolution of device VCO phase noise versus equivalent resistor value could be drawn and the optimum value quantified. deposition processes electrical...