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electro-optical probing

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Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 123-129, November 10–14, 2019,
... by Electro-Optical Probing (EOP)/Laser Voltage Probing (LVP) from backside is shown and the cause of these phenomena are studied. Based on the real case collection, two kinds of failure mode are summarized, and simulated experiments are performed. The results indicate that when a current path from power...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 148-153, November 10–14, 2019,
... challenges occur after the die is packaged. The difficulty further lies in non-destructively analyzing the die. Another issue with failure analysis is accurately deprocessing the device for probe pad deposition. Techniques like Electro Optical Probing (EOP) or Laser Voltage Probing (LVP) acquire electrical...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 329-335, November 3–7, 2013,
... integrated circuits laser probing second harmonic analysis semiconductor devices Comparison of C.W. Electro Optical Probing and light emission techniques K. Sancheza, P. Perdua, K. Melendeza, T. Nakamurab a CNES, DCT/AQ/LE, Toulouse, FR. b Hamamatsu Photonics Japan. 18, avenue Edouard Belin, BPI 1414...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 366-368, October 31–November 4, 2021,
...Abstract Abstract This paper explains how the authors determined the cause of a fast-to-rise failure discovered during scan chain testing of an image sensor. The failed device was mounted on a portable card that facilitates transfer between test platforms in an electro-optical probing (EOP...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 19-25, November 14–18, 1999,
... silicon 19 Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing Mike Bruce, Greg Dabney, Shawn McBride, Jason Mulig, Victoria Bruce, Charles Bachand Advanced Micro Devices, Austin, Texas Steven Kasapi and Jeffrey A. Block Schlumberger ATE, San Jose, California Abstract A new...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 258-262, October 31–November 4, 2021,
... (Transmission Electron Microscopy) and EOP (Electro Optical Probe) analysis. connection between the inside and outside of the chamber and impedance matching. In particular, when the maximum DC Measurement Results saturation current is at a several uA level, such as the DRAM main cell, the relevant signal cannot...
Proceedings Papers

ISTFA2021, ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis, m1-m34, October 31–November 4, 2021,
... to device Optical Inspection/Analysis Photon Emission Laser Electro-optical Analysis Stimulation Analysis Picosecond Circuit Photoelectric Laser Thermal Laser Electro-optical Frequency Electro-optical Probing(EOP) Analysis (PICA) Stimulation 1.1µm) Stimulation 1.1µm) Mapping (EOFM) / Laser -Voltage / Laser...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 27-33, November 14–18, 1999,
... on the electro-optic effect in CMOS, which is used for the signal acquisition. The question of invasiveness of the photo-injected carriers is then discussed. Information on the entire probing environment is also provided. The article also discusses results and presents a comparison with other waveform...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 33-37, November 15–19, 2009,
... in emitted photons as supply voltage decreases with each technology node [5]. Laser Voltage Probing [6] is an active backside technique which is based on electro-optical effects in silicon devices [7]. The technique uses a 1.064 m wavelength laser which is invasive due to electron hole pair generation...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 52-59, November 15–19, 2009,
... and electrical tests can be coupled in order to provide more accurate information about the failure, especially vector information in addition to x and y localization. We have developed a Full Dynamic Laser Stimulation (F-DLS) approach based on laser modulation by electro optic modulator to face this challenge...
Proceedings Papers

ISTFA2021, ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis, d1-d96, October 31–November 4, 2021,
... Subthreshold On-state Gate Drain 20 Electro Optical / Laser Voltage Probing (EOP/ LVP) 21 Laser Stimulation Techniques Photo - electric Laser Stimulation (PLS) band-to-band absorption (semiconductor) separation of generated carriers by internal or external electric fields (OBIC, LIVA=Light Induced...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 381-386, November 18–22, 1996,
... waveforms which may be used to perform timing analysis on the device. A backside pulsed laser electro-optic technique for measuring internal node timing (6) has been developed for waveform acquisition. Although this technique permits acquisition of waveforms from a bi-polar device which has had its...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 154-162, October 31–November 4, 2021,
... security measures. Attackers usually exploit one of several interactions between light and semiconductors to generate logic-state images that reflect data in memory. Thermal laser stimulation (TLS) and laser probing via electro-optical frequency mapping (EOFM) have been reported in the literature...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 471-481, November 3–7, 2013,
... is homogenous on the planar surface of the laser spot. 4.1.2. Experiments on a diode The instrument we have used at CNES includes a Time Resolved Imaging (TRI) camera and an Electro Optical Probe (EOP) system. EOP has been used to observe elementary structures through the silicon. It has a 1330 nm laser probing...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 245-249, November 15–19, 2020,
...Abstract Abstract A typical workflow for advanced package failure analysis usually focuses around two key sequential steps: defect localization and defect characterization. Defect localization can be achieved using a number of complementary techniques, but electro optical terahertz pulse...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 387-392, November 13–17, 2011,
...Abstract Abstract We propose in this paper to introduce the L-NEPS (Laser Nano Electro-static field Probe Sensor), which can detect the slight quasi-electrostatic field generated by optical excitation and thermal excitation occurred when laser beam irradiates on the surface and back of the Die...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 182-191, November 10–14, 2019,
... to perform logic analysis to further isolate the fault. The authors believe that single shot patterns can also be combined with laser-based probing techniques like Electro-Optical Probing (EOP) and Laser Voltage Probing (LVP) [11][12][13] or other analysis where it is needed or helpful to put a specific cell...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 526-537, November 5–9, 2017,
... (LVP) and Electro Optical Probing (EOP) [10] [11] [12]; and others could be focused on this area instead of analyzing the complete digital block or a bigger portion of the digital block. DALS Implementation: DALS is a Soft Defect Localization (SDL) technique [13] [14] [15] that could be performed...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 207-213, November 5–9, 2017,
... or high-Z states. 1: Introduction Laser Voltage Probing (LVP) and Electro-Optical Probing (EOP) are used for failure analysis of semiconductor integrated circuits (ICs) [1]. These are methods of measuring the waveforms of transistors inside ICs. Laser Voltage Imaging (LVI) and Electro-Optical Frequency...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 86-92, October 28–November 1, 2018,
...) or Electro- Optic probing (EOP) is a cornerstone of modern day electrical fault isolation of integrated circuits [1]. The technique can help study the functionality of a single, if not, a small group of transistors while the device is in operation. The technique is widely used to debug timing issues due...