Listings of the EDFAS 2005-2006 Board of Directors, the ISTFA 2005 Organizing Committee Program Chairs, and other contributors and committee members.

Listings of the EDFAS 2003-2004 Board of Directors, the ISTFA 2003 Organizing Committee, and other volunteers and committee members.

Listings of the EDFAS 2006-2007 Board of Directors, the ISTFA 2006 Organizing Committee Program Chairs, and other contributors and committee members.

Listings of the EDFAS 2004-2005 Board of Directors, the ISTFA 2004 Organizing Committee Program Chairs, and other contributors and committee members.

Listings of the EDFAS 2002-2003 Board of Directors and Committee Chairs, the ISTFA 2002 Organizing Committee, and other contributors and committee members.

Listings of the EDFAS 2010-2011 Board of Directors, the ISTFA 2010 Organizing Committee and Activities Chairs, and other contributors and committee members.

Listings of the ISTFA 2007 Organizing Committee and Activities Chairs.

Listings of the EDFAS 2008-2009 Board of Directors, the ISTFA 2008 Organizing Committee Program and Activities Chairs, and other contributors and committee members.

Listings of the EDFAS 2001-2002 Board of Directors, the ISTFA 2001 Organizing Committee, and other contributors and committee members.

Listings of the EDFAS 2012-2013 Board of Directors, the ISTFA 2012 Organizing Committee and Activities Chairs, and other contributors and committee members.

Listings of the EDFAS 2000-2001 Board of Directors, the ISTFA 2000 Organizing Committee, and other contributors and committee members.

Printed Circuit Board (PCB) assemblies are moving toward lead-free (LF) alloys and away from the traditional Sn-Pb alloy [1]. This change is creating new and unique failure modes as the process adapts to accommodate the higher temperatures of the new process [2]. In addition, mis-processed lots are more likely due to the complexity of assembling a mix of Sn-Pb and leadfree solders, components, PCBs, solder pastes, and fluxes. This case study helps to highlight the challenge and provides an example of what can happen, how to detect it, and how the defects can cause reliability failures.

Listings of the EDFAS 2017-2018 Board of Directors, the ISTFA 2017 Organizing Committee and Activities Chairs, and other contributors and committee members.

Listings of the EDFAS 2022 Board of Directors and the ISTFA 2022 Organizing Committee and Session Chairs.

Listings of the EDFAS 2017-2018 Board of Directors, the ISTFA 2017 Organizing Committee and Activities Chairs, and other contributors and committee members.

Listings of the EDFAS 2022 Board of Directors and the ISTFA 2022 Organizing Committee and Session Chairs.

Listings of the EDFAS 2021-2022 Board of Directors and ISTFA 2021 Organizing Committee and Session Chairs.

In this paper, we carried out PIND (Particle Impact Noise Detection) test and X-ray inspection of a transistor in a TO-18 package for commercial and industrial applications. From our evaluation results, we explain the validity of the PIND test by comparing PIND test and X-ray inspection results. We make clear that PIND test is able to detect internal foreign material that may be transparent to X-ray inspection. In addition, we report analysis results of internal foreign materials from defective devices. This matter suggests that a problem is contamination control in the manufacturing process, most likely the sealing process.

Many organizations perform component and equipment testing to ensure that parts in various applications and environments are robust and will operate reliably in the field. In addition, failure analyses are often performed to identify the cause of failures resulting from device testing and/or field usage. The Reliability Analysis Center (RAC) Data Sharing Consortium (DSC) accumulates data from these sources and assembles this data into a repository accessible to its members. This article discusses the purpose of the DSC, the benefits of DSC, and the data sharing agreement. It presents a list of organizations who are members of the DSC consortium and of organizations which are in the process of reviewing membership requirements. RAC's mission, the awards it has received, and its efforts towards developing and maintaining effective DoD systems are also covered.

In the failure analysis (FA) process, a large amount and variety of data are involved: product information, images created by lab equipment, requester and accounting information, etc. Instead of using separate tools for image handling, sample tracking, report creation, and email, workflows can be improved by integrating all these functions in one single IT system. This paper describes the process and result of developing a dedicated FA software tool. The discussion provides details of the specification, main features, and architecture of the system. This system has been rolled out at 15 labs and is used by approx. 500 analysts and several thousands of company-internal FA customers. The flexible architecture made the adaptation to all the different business processes possible and provides a future-proof solution.