Listings of the EDFAS 2005-2006 Board of Directors, the ISTFA 2005 Organizing Committee Program Chairs, and other contributors and committee members.

Listings of the EDFAS 2003-2004 Board of Directors, the ISTFA 2003 Organizing Committee, and other volunteers and committee members.

Listings of the EDFAS 2006-2007 Board of Directors, the ISTFA 2006 Organizing Committee Program Chairs, and other contributors and committee members.

Listings of the EDFAS 2004-2005 Board of Directors, the ISTFA 2004 Organizing Committee Program Chairs, and other contributors and committee members.

Listings of the EDFAS 2002-2003 Board of Directors and Committee Chairs, the ISTFA 2002 Organizing Committee, and other contributors and committee members.

Listings of the EDFAS 2010-2011 Board of Directors, the ISTFA 2010 Organizing Committee and Activities Chairs, and other contributors and committee members.

Listings of the ISTFA 2007 Organizing Committee and Activities Chairs.

Listings of the EDFAS 2008-2009 Board of Directors, the ISTFA 2008 Organizing Committee Program and Activities Chairs, and other contributors and committee members.

Listings of the EDFAS 2001-2002 Board of Directors, the ISTFA 2001 Organizing Committee, and other contributors and committee members.

Printed Circuit Board (PCB) assemblies are moving toward lead-free (LF) alloys and away from the traditional Sn-Pb alloy [1]. This change is creating new and unique failure modes as the process adapts to accommodate the higher temperatures of the new process [2]. In addition, mis-processed lots are more likely due to the complexity of assembling a mix of Sn-Pb and leadfree solders, components, PCBs, solder pastes, and fluxes. This case study helps to highlight the challenge and provides an example of what can happen, how to detect it, and how the defects can cause reliability failures.

Listings of the EDFAS 2000-2001 Board of Directors, the ISTFA 2000 Organizing Committee, and other contributors and committee members.

Listings of the EDFAS 2012-2013 Board of Directors, the ISTFA 2012 Organizing Committee and Activities Chairs, and other contributors and committee members.

Listings of the EDFAS 2023 Board of Directors and the ISTFA 2023 Organizing Committee and Session Chairs.

Listings of the EDFAS 2023 Board of Directors and the ISTFA 2023 Organizing Committee and Session Chairs.

Listings of the EDFAS 2017-2018 Board of Directors, the ISTFA 2017 Organizing Committee and Activities Chairs, and other contributors and committee members.

Listings of the EDFAS 2022 Board of Directors and the ISTFA 2022 Organizing Committee and Session Chairs.

The adoption of 3D packaging technology necessitates the development of new approaches to failure electronic device analysis. To that end, our team is developing a tool called the quantum diamond microscope (QDM) that leverages an ensemble of nitrogen vacancy (NV) centers in diamond, achieving vector magnetic imaging with a wide field-of-view and high spatial resolution under ambient conditions. Here, we present the QDM measurement of 2D current distributions in an 8-nm flip chip IC and 3D current distributions in a multi-layer PCB. Magnetic field emanations from the C4 bumps in the flip chip dominate the QDM measurements, but these prove to be useful for image registration and can be subtracted to resolve adjacent current traces in the die at the micron scale. Vias in 3D ICs display only Bx and By magnetic fields due to their vertical orientation and are difficult to detect with magnetometers that only measure the Bz component (orthogonal to the IC surface). Using the multi-layer PCB, we show that the QDM’s ability to simultaneously measure Bx , By , and Bz is advantageous for resolving magnetic fields from vias as current passes between layers. We also show how spacing between conducting layers is determined by magnetic field images and how it agrees with the design specifications of the PCB. In our initial efforts to provide further z -depth information for current sources in complex 3D circuits, we show how magnetic field images of individual layers can be subtracted from the magnetic field image of the total structure. This allows for isolation of signal layers and can be used to map embedded current paths via solution of the 2D magnetic inverse. In addition, the paper also discusses the use of neural networks to identify 2D current distributions and its potential for analyzing 3D structures.

Listings of the EDFAS 2022 Board of Directors and the ISTFA 2022 Organizing Committee and Session Chairs.

Listings of the EDFAS 2017-2018 Board of Directors, the ISTFA 2017 Organizing Committee and Activities Chairs, and other contributors and committee members.

Many organizations perform component and equipment testing to ensure that parts in various applications and environments are robust and will operate reliably in the field. In addition, failure analyses are often performed to identify the cause of failures resulting from device testing and/or field usage. The Reliability Analysis Center (RAC) Data Sharing Consortium (DSC) accumulates data from these sources and assembles this data into a repository accessible to its members. This article discusses the purpose of the DSC, the benefits of DSC, and the data sharing agreement. It presents a list of organizations who are members of the DSC consortium and of organizations which are in the process of reviewing membership requirements. RAC's mission, the awards it has received, and its efforts towards developing and maintaining effective DoD systems are also covered.