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chairman
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Proceedings Papers
ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, iii, November 18–22, 1996,
... Abstract Listing of the ISTFA 1996 Organizing Committee. ORGANIZING COMMITTEE Edward I. Cole, Jr. Chairman Sandia National Laboratories Albuquerque, New Mexico Shekhar Khandekar Vice Chairman Level One-Communications, Inc. Sacramento, California Seshu V. Pabbisetty Woskhop Chairman Texas...
Proceedings Papers
ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, xiii, November 12–16, 2000,
... Committee), ASM, and, the members of EDFAS, look forward to the future of failure analysis. Daniel L. Barton, Ph.D. Sandia National Laboratories ISTFA 2000 General Chairman bartondl@sandia.gov ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis November...
Proceedings Papers
ISTFA1998, ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis, xiii, November 15–19, 1998,
.... Lee Microchip Technology Inc. 1998 ISTFA Conference General Chairman ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis November 15 November 19, 1998, Dallas, Texas, USA DOI: 10.31399/asm.cp.istfa1998fm02 Copyright © 1998 ASM International® All...
Proceedings Papers
ISTFA1998, ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis, 79-82, November 15–19, 1998,
... Chairman IIT Research Institute Reliability Analysis Center 201 Mill St. Rome, NY 13440 USA Phone: (315) 339-7055 Fax: (315) 336-1371 Email: ddylis@rome.iitri.com David Dylis is a Senior Engineer with IIT Research Institute (IITRI) in Rome, NY. Currently he is Chairman of the Reliability Analysis Center...
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Many organizations perform component and equipment testing to ensure that parts in various applications and environments are robust and will operate reliably in the field. In addition, failure analyses are often performed to identify the cause of failures resulting from device testing and/or field usage. The Reliability Analysis Center (RAC) Data Sharing Consortium (DSC) accumulates data from these sources and assembles this data into a repository accessible to its members. This article discusses the purpose of the DSC, the benefits of DSC, and the data sharing agreement. It presents a list of organizations who are members of the DSC consortium and of organizations which are in the process of reviewing membership requirements. RAC's mission, the awards it has received, and its efforts towards developing and maintaining effective DoD systems are also covered.
Proceedings Papers
ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, iii-vi, November 6–10, 2005,
... Semiconductor, Inc. Jeremy A. Walraven MEMS Sandia National Laboratories Kendall S. Wills Packaging; Sample Preparation Texas Instruments, Inc. ISTFA 2005 TUTORIAL COMMITTEE William E. Vanderlinde Organizing Committee Tutorial Chairman Laboratory For Physical Sciences Tutorial Committee Chair Topic Affiliation...
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Listings of the EDFAS 2005-2006 Board of Directors, the ISTFA 2005 Organizing Committee Program Chairs, and other contributors and committee members.
Proceedings Papers
ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, iii-vi, November 14–18, 2004,
... 2004 TUTORIAL COMMITTEE William E. Vanderlinde Organizing Committee Tutorial Chairman Laboratory For Physical Sciences Tutorial Committee Chair Topic Affiliation Cosme Furlong Sample Preparation Worcester Polytechnic Leo G. Henry Failure Mechanisms ESD TLP Consulting/Testing Rebecca L. Holdford...
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Listings of the EDFAS 2004-2005 Board of Directors, the ISTFA 2004 Organizing Committee Program Chairs, and other contributors and committee members.
Proceedings Papers
ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 446-452, November 13–17, 2011,
... in Electronic Design News [10], It may sound like a cliché, but it s true, says Jack Stradley (chairman of the SIA anti-counterfeiting committee). If we don t hang together, we ll all hang separately. This is a call Figure 6: X-ray inspection of tantalum capacitors from same lot indicates extreme variation...
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The International Symposium for Testing and Failure Analysis (ISTFA) 2010 event added a focus topic on Counterfeiting in Electronics. This topic was chosen because of the emergence of this concern and the critical role that Failure Analysis plays in this challenge. Failure Analysts will be involved deeply as companies worldwide are attempting to reduce the impact of increasing numbers of counterfeit products in the supply line and in fielded products. This paper will attempt to provide an overview of the topic and support the contributors to ISTFA 2010 while providing additional resources for information.