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bridging defects

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Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 196-200, November 5–9, 2017,
... sites) that can help with making precisely accurate Physical FA plans that reduce turnaround time and also ensure high success rates. Specifically, in the case of a bridging defect between two nets wherein DLS sites were only seen on the victim net using conventional CW laser, the time resolved pulsed...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 370-373, November 9–13, 2014,
...Abstract Abstract As semiconductor technology continues to advance to smaller dimensions and more complex circuit designs, it is becoming more challenging to locate the resistive short directly between two metal lines (signals) due to a metal bridge defect. Especially these two metal lines...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 261-263, November 15–19, 2020,
...Abstract Abstract The aim of this paper is to present a typical bridge defect case inside digital circuitry, from diagnosis to emission point of view. Specific considerations have allowed to establish the exact point of failure. Keywords— bridge defect, aggressor and victim, region...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 264-266, November 15–19, 2020,
.... Finally, it was proven through the WBI evaluation for over 60k DRAM chips. DRAM electrical test error-code correction metal line bridge defects wafer level burn-in A Study on the Early Detection of Metal Line Bridge Defects Using Wafer Burn-in Stress Kyunghwui Min, Hayoung Kwon, Seihui Lee...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 587-591, November 11–15, 2012,
...Abstract Abstract The bridge defect is one of the most difficult defects to locate. When classical static and dynamic optical techniques reach their limits, applying a dynamic signal on the power supplies for stimulating the defect allows obtaining useful additional information helping...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 424-426, November 5–9, 2017,
... is also useful to screen latent defects or to predict device lifetime. In this paper, we studied un-correctable errors which occurred due to various types of storage node bridge defects in ECC DRAM. 12 faulty cells among 1,000 cells are observed after burn-in stress. Retention time of each cell...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 456-462, November 3–7, 2013,
...Abstract Abstract Gate-to-drain contact short issue in floating gate memory has been studied. Two cases will be discussed, floating-gate to drain contact short, and control-gate to drain contact short, both caused by leakage bridge defect. The abnormal electrical device characteristic combined...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 153-157, November 13–17, 2011,
... of failure can be addressed. In our FA case study, we will show that LIT is a most efficient solution to address a bridge defect located inside a complex logic area, and furthermore that LIT highlights the defect itself and not only the consequences of the defect. bridge defects defect localization...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 127-132, November 18–22, 1996,
... defects in unknown locations. Experiments on several chips demonstrate the value of the tool and its limitations in relation to detection of classic stuck-at faults and some realistic faults, such as bridging defects. bridging defects fault diagnosis fault model focused ion beam integrated...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 597-601, November 5–9, 2017,
... a larger area of inspection helpful in finding the very thin underetched barrier defect that resulted in a TiN bridging issue. Results and Discussion Case Study 1: FA on MIM Via punch thru defect During wafer fabrication, a number of wafers suffered from leakage failure at the wafer edge. These were...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 248-252, October 31–November 4, 2021,
... the root cause of subtle defects, such as bridging, in flip chip failures. bridging defects defect localization EBIRCH flip chips lock-in thermography sample preparation ISTFA 2021: Proceedings from the 47th International Symposium for Testing and Failure Analysis Conference October 31...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 99-102, November 14–18, 2004,
...Abstract Abstract Bridging faults are a common failure mechanism in integrated circuits and scan-based diagnosis does a good job of isolating these defects. Diagnosis, however, can sometimes result in large search areas. Typically, these areas are caused by long repeater nets. When this happens...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 63-68, November 12–16, 2000,
... of the particle or contamination. In failure analysis, seven kinds of killer defects were found in Flat ROM devices. They are: silicon crystalline defect on silicon substrate, BN+ line breakdown defect, BN+ line opening defect, missing contact defect, poly bridging defect, metal bridging and metal filament...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 86-90, November 13–17, 2011,
... simulation-based analysis of the test failures [1-3] [5-7]. It produces a diagnosis report consisting of a small list of potential defect locations and defect types (bridge, open, etc.) that best describes the observed test failures. In this paper we refer to these as diagnosis suspects. Based...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 412-418, November 12–16, 2006,
..., indicated that the defect is non-stuck type as some of the patterns passing on the tester were failing in simulation. Based on the layout of the top suspects a bridge defect was suspected and adaptive ATPG was used to create additional test patterns to detect the bridges. The concept of adaptive ATPG...
Proceedings Papers

ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 283-286, November 6–10, 2005,
...Abstract Abstract New process will introduce new failure mechanisms during microelectronic device manufacturing. Even if the same defect, its root causes can be different for different processes. For aluminum(Al)-tungsten(W) metallization, the root cause of metal bridging is quite simple...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 115-124, November 9–13, 2014,
... that we will be able to recognize easily in real cases. Results obtained are on various devices such as stand-alone MOSFETs, resistance, diodes and also on controlled defects such as gate breakdown, electromigration and bridge defects drawn in the design. Figure 7 below shows an example of a cell which...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 306-312, November 3–7, 2013,
... and can be detected using the LVI setup. The TFI technique is set up by mapping the frequency applied on the power supply of the circuit (instead of data signals for LVI). Depending on the nature of the defect, TFI will allow mapping the thermal part of the signal (case of bridge defect and local heating...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 459-463, November 2–6, 2008,
...Abstract Abstract In this paper, a comprehensive study to find a memory related yield loss in 90 nm technology will be discussed. The loss was related to spacer bridging, blocking silicide formation and Lightly Doped Drain (LDD), source/drain implant. Soft Defect Localization (SDL) techniques...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 237-242, November 6–10, 2016,
... reports the use of X-ray radiography and computer image processing for the study of internal defects. By using X-ray tomography technique, pores, cracks, holes, solder balling, insufficient solder, lead related defects, device related defects, and solder bridging may be identified (1-2). When coupled...