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Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 198-201, November 15–19, 2020,
...Abstract Abstract Power consumption of conventional CMOS semiconductor architectures has grown to the point where novel structures need to be introduced to mitigate the power load within the chip. The introduction of the specialized artificial intelligence devices goes hand in hand...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 34-39, October 31–November 4, 2021,
...Abstract Abstract There are several variants of artificial intelligence (AI) hardware structures that are under study by the semiconductor industry for potential use in complementary metal–oxide–semiconductor (CMOS) designs. This paper discusses some of the failure analysis challenges that have...
Proceedings Papers

ISTFA2021, ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis, b1-b40, October 31–November 4, 2021,
... of Machine Learning Features and Label Application in failure Analysis Machine Learning Models Machine Learning Workflow Artificial neural networks Neural Networks Convolutional Neural Networks Machine Learning Models Case Study I Case Study II Case Study III 2 Artificial Intelligence...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 1-5, October 31–November 4, 2021,
..., however, the nature of it, as individual reports reporting concrete devices and their corresponding processes, makes it inefficient to consult for the human experts. In this context, the following paper proposes a Artificial Intelligence solution for the gathering of this FA knowledge stored...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 12-19, October 31–November 4, 2021,
... reliability in critical applications. With growing developments in Artificial Intelligence (AI) and computing power, a novel framework for automatically extracting a PCBs BoM potentially exploiting AI, was presented in 2019 [5]. A PCBs Bill Of Materials (BoM) is a centralized source of information containing...
Proceedings Papers

ISTFA1996, ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis, 189-195, November 18–22, 1996,
... Assessment in Signature Analysis," to be presented at Int. Symp. Test, and Fail. Anal, Nov 18-22 1996. 2. G. F. Luger and W. A. Stubblefield, Artificial Intelligence and the Design of Expert Systems, Benjamin Cummings Publishing Co. Inc., 1989, p. 314 3. Rich and Knight, Artificial Intelligence, McGraw- Hill...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 256-265, November 10–14, 2019,
... conference on Uncertainty in artificial intelligence. Morgan Kaufmann Publishers Inc., 1997, pp. 175 181. [27] W.-Y. Wu, M.-J. J. Wang, and C.-M. Liu, Automated inspection of printed circuit boards through machine vision, Computers in industry, vol. 28, no. 2, pp. 103 111, 1996. [28] M. Piccardi...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 108-114, October 31–November 4, 2021,
... security measures to enable data sharing for industrywide collaboration. Introduction HI and SiP architecture are a byproduct of the ever-increasing demands coming from key market segments that drive the growth of the microelectronics industry. These include Artificial Intelligence (AI), Internet of Things...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 291-295, October 31–November 4, 2021,
..., intellectual property intelligence and reverse engineering applications. The benefit is to achieve higher resolution for a field of view (FOV) through multiple-volume stitching, overcoming the detector size limitation. However, the total scan time is long because of the multi-volume data acquisition. The DLHRR...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 206-210, October 31–November 4, 2021,
..., and good CMOS technology compatibility [1-3]. More recently, phase change memory has also been explored for analog computing in artificial intelligence applications [4-6]. In a PCM cell, a phase change material is formed between two electrodes and its resistance can change via phase transformations...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 418-422, October 31–November 4, 2021,
... and Failure Analysis, Pasadena, California, USA, 2017. [5] A. Khan, , et al. "A survey of the recent architectures of deep convolutional neural networks," Artificial Intelligence Review, vol. 53, pp. 5455-5516, 2020. [6] H. Yakura, , et al. "Malware Analysis of Imaged Binary Samples by Convolutional Neural...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 394-402, October 31–November 4, 2021,
... in Natural and Artificial Systems: An Introductory Analysis with Applications to Biology, Control and Artificial Intelligence , MIT Press, 1992. case studies. 401 [16] S.N. Sze, W.K. Tiong, A Comparison between Heuristic and Meta- Heuristic Methods for Solving the Multiple Traveling Salesman Problem , Proc...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 79-83, November 15–19, 2020,
... in the identification of defects &/or mechanical alignment issues previously undetectable with conventional x-ray imaging within minutes. Additionally, the data can be further refined using Artificial intelligence (AI) machine learning for rapid fault localization. Furthermore, interfaces between low Z materials...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 141-145, October 31–November 4, 2021,
... been reduced by 30%, and the read/write latency of the memory has been improved by more than 35%. The 176L 3D NAND flash memory shows a significant improvement in performance which can help meet the requirements of very demanding applications such as 5G, artificial intelligence, cloud storage and smart...
Proceedings Papers

ISTFA1997, ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 243-252, October 27–31, 1997,
.... Tsujide and K. Morohashi, Procs. of 6th Euro- pean Symposium Reliability of Electron Devices, Failure Physics and Analysis, 345-350(1995) 9. J. de Kleer; Artificial Intelligence, 28, 127-162(1986) 1O.K. Okubo, H. Teguri, A. Ito, Proc. Symposium on Electron Beam Testing, 153-158(1991) (in Japanese) 1. H...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 173-181, November 3–7, 2013,
... to be exploited and explored. Femtosecond near-infrared radiation can deliver significant levels of peak optical power to a functional device which, in turn, can temporarily disturb the prescribed digitization level in local memory cells, holding their individual transistors in artificially high electronic states...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 232-241, November 2–6, 2003,
... minimum spanning tree (EMST) is the minimum length acyclic graph G connecting all vertices of a set V (see Figure 3b) [1,2]. An artificial neural network (ANN) is a mathematical model that emulates some of the observed properties of biological nervous systems and draws on the analogies of adaptive...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 29-36, November 3–7, 2002,
..., therefore this defect appears artificially blurred in the amplitude image. The comparison shows that some local heat sources detected by IR amplitude 100 µm topography 100 µm lock-in FMI 100 µm #1 #4 #5 #1 #2 #3 #4 #5 phase 500 µm 33 lock-in thermography in positions #2 and #3 and also the lower part...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 506-513, November 2–6, 2003,
... module into an industrial ATE. This tool created the first learning ATE that can automatically learn and approximate the behavior of the chip from a set of training test pattern. In the operation phase, we developed an intelligent optimization module into an industrial ATE by combining neural networks...