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accelerated life test

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Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 183-188, November 14–18, 1999,
.... accelerated operational test accuracy gallium arsenide field effect transistors gate leakage current junction temperature thermal resistance 183 A Technique for Measuring Device Temperature with High Accuracy in Accelerated Operational Life Tests K. Takeda, M. Harigaya, Y. Miyazaki NEC Corporation...
Proceedings Papers

ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 205-214, November 3–7, 2002,
...Abstract Abstract Recently, Motorola was notified that certain of their RFIC devices had failed electrically during Accelerated Life Testing (ALT) at their customer’s board-mounting facility. These devices were assembled in both 8 and 16 lead narrow-body SOIC packages, and had been previously...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 513-518, November 10–14, 2019,
... connections in a short time. In addition, the validity of this evaluation method for TSOP PEM is shown by comparing with the evaluation results of thermal shock test and life test, which are conventional reliability evaluation methods. failure analysis highly accelerated limit test plastic...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 146-149, October 31–November 4, 2021,
.../scanning electron microscope (FIB/SEM), an Ar gas ion nanomill, and STEM imaging. III-V compound failure mechanisms accelerated life testing argon ion milling focused ion beam scanning electron microscopy STEM imaging ISTFA 2021: Proceedings from the 47th International Symposium for Testing...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 166-170, November 15–19, 2009,
... of Components The best way to improve the reliability of the system is to improve the reliability of each component and then to address any unreliable interactions between the components within the system. An initial series of accelerated life tests (ALTs) is in place for PV modules through international...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 59-64, November 2–6, 2008,
... cycling, temperature humidity bias test, thermal shock test, HAST (Highly Accelerated Stress Testing), and HALT (Highly Accelerated Life Testing). Failure Modes & Mechanisms Thick film resistors functionality is dependent on the electrical circuit and environmental conditions under which they are used...
Proceedings Papers

ISTFA2009, ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis, 301-308, November 15–19, 2009,
... Analysis, pp. 57-60, Volume1, Issue 4, August 2001. [22] Boddy, P.J., Delany, R.H., Lahti, J.N., Landry, E.F. and Restrick, R.C. Accelerated Life Testing of Flexible Printed Circuits, 14th International Reliability Physics Symposium, 1976, pp. 108-116. [23] Electrochemical Migration: Electrically Induced...
Proceedings Papers

ISTFA1998, ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis, 472-482, November 15–19, 1998,
... side. This deprocessing methodology has enabled the localization of oxide and metal defects but can destroy silicon related defects. Case History Background A significant number of advanced CMOS microprocessor qualification failures were examined after accelerated life testing (ALT) at 125 °C and 5.25...
Proceedings Papers

ISTFA1998, ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis, 347-352, November 15–19, 1998,
... will be stopped when the temperature is below that needed for the flux activators to be in a vapor state. This paper contains details of this failure mode in hermetically sealed EMI filters and includes life test data (insulation resistance at elevated temperature), life reduction calculations, and photographs...
Proceedings Papers

ISTFA2000, ISTFA 2000: Conference Proceedings from the 26th International Symposium for Testing and Failure Analysis, 355-366, November 12–16, 2000,
... by fatigue and creep mechanisms occur over extended periods of time. To predict reliability and design life from accelerated testing, the failures must occur as a result of accelerating the proper failure mechanisms and not as a result of mechanisms unique to the test conditions [17]. The most popular...
Proceedings Papers

ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 389-394, November 6–10, 2005,
... an evaluation with test vehicles of 130nm and 90nm technology, the following acceleration factors were obtained, Ea>0.9ev and β (Beta)>-5.85. In addition, it was determined that a lower defect density gave a lower Weibull shape parameter. As a result of failure analysis, it is found that the main failures...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 145-148, November 14–18, 1999,
...Abstract Abstract Latch-up induced during High Temperature Operating Life (HTOL) test of a mixed signal device fabricated with 1.0 μm CMOS, double poly, double metal process caused failures due to an open in aluminum metal line. Metal lines revealed wedge voids of about 50% of the line width...
Proceedings Papers

ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 477-480, October 28–November 1, 2018,
... defects. The simple method that can screen out the degradation failures during the initial test is to use the burn-in stress at higher temperature to increase the acceleration factor (AF). However, the disadvantage of this simple way is the reduction of stress uniformity due to the increase...
Proceedings Papers

ISTFA1998, ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis, 393-398, November 15–19, 1998,
... demonstrated, equivalent to the same ESD structures placed conventionally around the bond pad. Significantly, reliability has been demonstrated over High Temperature Operating Life (HTOL), temp cycle, autoclave, storage life testing and assembly parameter designed experiments (DOE). There are many possible...
Proceedings Papers

ISTFA1997, ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 91-96, October 27–31, 1997,
..., there was a great difference over the narrow temperature range. We concluded that the acceleration of the thermal fatigue life for actual thermal environmental conditions cannot be estimated accurately in such cases. To optimize the heat-resistant test and shorten the testing time, we performedthermal shock testing...
Proceedings Papers

ISTFA2012, ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis, 239-249, November 11–15, 2012,
..., and is accelerated during storage at elevated temperatures. The degradation and failure during use conditions is generally accelerated due to the transient power requirements, the high frequency of charge/discharge cycles and differences between the state-of-charge and the depth of discharge influence...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 283-291, November 3–7, 2013,
... Modes in Power-cycling Tests ; CIPS 2012. [2] Celya, J. R. et al., Towards Accelerated Ageing Methodologies and Heelth of Power Mosfets , Annual Conference of the Prosnostics and Heelth Management Society, 2009. [3] Interface Degradation of Al Heavy Wire Bonds on Power Semiconductors during Active...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 485-488, November 5–9, 2017,
... and accelerate root-cause identification for temperature induced package failures; therefore, it improves throughput-time for packaging technology development. electronic packaging root cause analysis solder thermal interface materials X-ray metrology Advanced In Situ X-ray Metrology for Thermal...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 134-137, November 3–7, 2013,
... results are more stable. Therefore, we recommend using AES for bondpad contamination monitoring in wafer fab. A simulation method is proposed to determine the specification limit of F and a Shelf Life Accelerated Test (SLAT). The Spec limit, which is related to bondpad quality, impacts the die bondability...
Proceedings Papers

ISTFA1997, ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 189-194, October 27–31, 1997,
... and overall voltage drop during a constant current life test indicates defect propagation from outside to inside the active region. REDR (Recombination Enhanced Defect Reaction) is proposed as the driving growth mechanism. 189 Copyright © 1997 ASM International® All rights reserved. www.asminternational.org...