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PFIB milling

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Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 460-464, November 10–14, 2019,
...Abstract Abstract This paper introduces a novel sample preparation method using plasma focused ion-beam (pFIB) milling at low grazing angle. Efficient and high precision preparation of site-specific cross-sectional samples with minimal alternation of device parameters can be achieved...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 274-278, October 31–November 4, 2021,
... of cobalt and its propensity to oxidize, thus complicating electrical measurements, is another challenge. In this study, the authors demonstrate an alternative delayering method based on plasma focused ion beam (PFIB) milling aided by DX gas. The workflow associated with the new method is more efficient...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 241-243, November 10–14, 2019,
... of Maryland where a TESCAN XEIA instrument was used for final Xe+ PFIB thinning. The specimens were directly thinned to electron transparency by milling on both sides of the specimen using 5 keV Xe+ ions at 80o incidence angle from the XEIA PFIB source as shown in the schematic diagrams in Figs. 2a,b...
Proceedings Papers

ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 388-400, November 1–5, 2015,
... of interest (Fig. 6). For the delayering steps, the sample was tilted to 52-degrees and FIB milled with Xe+ ions with ion beam currents ranging from 1nA to 1µA with the DX chemistry [18] application file managing the gas delivery system. PFIB+DX deprocessing started at metal 6 and proceeded layer-by-layer...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 337-341, October 31–November 4, 2021,
... is scalable and can be used in both lab and fabrication environments. delayering electrical probing logic devices PFIB milling SEM imaging ISTFA 2021: Proceedings from the 47th International Symposium for Testing and Failure Analysis Conference October 31 November 4, 2021 Phoenix Convention...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 17-26, November 3–7, 2013,
... distinct advantages, specific limitations have been identified: A. The Plasma-FIB (PFIB) platforms offer a 20-50 fold increase in milling rates enabling excellent quality sample preparation at precise locations in less than 2 hours provided material removal is limited to ~ 150x150x150 m3. Moreover...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 244-248, November 10–14, 2019,
... Focused Ion Beam (pFIB) low angle milling, the area of interest in a failure IC device is made accessible from any direction for nanoprobing and Electron Beam Absorbed Current (EBAC) analysis. This methodology allows subtle defects to be more accurately localized and analyzed for thorough root-cause...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 274-277, November 9–13, 2014,
... improve dramatically when the specimen is completely FIB milled free (or nearly free as in figure 1). EXLO and EXpressLO examples were performed on an EXpressLO LLC lift out station as shown below in figures 2 and 3. Figure 1: SEM image of PFIB prepared specimen. ISTFA 2014: Conference Proceedings from...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 342-346, October 31–November 4, 2021,
... methods, enabling enhanced process monitoring and control. 3D fiducial 3D NAND memory channel etch offset channel tilt PFIB milling SEM imaging ISTFA 2021: Proceedings from the 47th International Symposium for Testing and Failure Analysis Conference October 31 November 4, 2021 Phoenix...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 255-260, November 9–13, 2014,
...-specific sample prep of features of tens-to-hundreds of microns in size which may be buried under hundreds of microns of substrate or packaging material [7]. To support this application space, a plasma-based FIB (PFIB) source was developed, providing imaging currents as low as 1.5pA and milling current...
Proceedings Papers

ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 325-329, November 15–19, 2020,
...) was also tried to prepare the in-situ TEM sample to resolve this gallium aggregation phenomenon of heating experiment. Xe PFIB are widely known that damage layer is thinner than Ga FIB. Because Xe ions originate from a noble gas, they are unlikely to bond with target materials while milling for materials...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 141-145, October 31–November 4, 2021,
... measurement accuracy. Practically, the TEM-specimen can be milled thinner by FIB milling; however, the curtaining effect may become significant affecting the imaging resolution, and may even damage the region of interest of the sample. Plasma focused ion beam (PFIB) is one of the useful methods for sample...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 38-42, November 9–13, 2014,
... defects and device structures with a spatial resolution of ~ 1 nm. The DB-PFIB system is capable of sequentially milling and imaging (Slice & View) 100s of um size areas of the Region-of-Interest in order to locate the hidden nm size defects for faster root cause. Figure 2. Image showing PFIB large volume...
Proceedings Papers

ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 430-435, November 9–13, 2014,
... only to low k dielectric stacks and were achieved in less than 2hours. When delayering is required through SiO2 dielectric stacks and over a larger area, the time required to complete the process on a Ga FIB could be excessive. The introduction of Plasma FIB (PFIB) systems using a Xe source [6] where...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 251-255, November 5–9, 2017,
... line sputtering and GAE with XeF2 precursor by 30 keV Xe+ beam was tested in Tescan FERA FIB/SEM instrument, using 50um aperture and primary beam current of 5 pA. Another test of single-beam-width line sputtering and Pt deposition was made in an FEI PFIB/SEM instrument with a 30 keV Xe+ beam using...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 227-231, November 10–14, 2019,
..., and position of the bits as a function of depth. 3D NAND technology eccentricity metrology techniques NAND stack planar cell area scanning electron microscopes statistical analysis Automated gas-enhanced PFIB surface preparation enabled metrology and statistical analysis of 3D NAND devices Chris...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 329-335, November 10–14, 2019,
... to the challenges are discussed in detail in this paper. To summarize, the following items are crucial to obtaining repeatable and reliable result on 7nm devices. Stable nanoprobing system Proper sample prep using PFIB or mechanical delayering in situ ion mill to get rid of surface oxide and/or dielectric...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 427-431, November 6–10, 2016,
...Abstract Abstract Within this paper, the authors present an adapted FA flow for state-of-the-art Package Failure Analysis for 20nm technology and below. As a key aspect, three methods (EOTPR, 3D Xray & PFIB) are introduced as the next-gen FA standard methods for emerging package...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 418-422, October 31–November 4, 2021,
... locations on cross sections created by the PFIB microscope. The depths were measured from the scanning electron images of the milled cross sections. It was found that the model explained 29% of the variance in depth at the measured points, with a mean absolute error of approximately 210 nm. Analysis...
Proceedings Papers

ISTFA2021, ISTFA 2021: Tutorial Presentations from the 47th International Symposium for Testing and Failure Analysis, n1-n72, October 31–November 4, 2021,
... resolution Quantitative (can be) Hyperspectral image data pFIB-SIMS Larger area, depths & sensitivity 1 Graphite Anode SEM Image Before ToF-SIMS SEM Image After ToF-SIMS Characterization of a semiconductor structure - courtesy of Rusty Harris' Group at Texas A&M. 3 Cathode pFIB-SIMS Yield Enhancement...