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Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 588-593, November 6–10, 2016,
... to the bond wires in the IC package. Bond pull analysis based on simulation and finite element methods also exists but relies on the original model for a bond wire from a CAD design. In this work, we introduce X-ray tomography imaging with 700nm imaging resolution to acquire the 3D geometry details of bond...
Proceedings Papers

ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 173-178, November 10–14, 2019,
...Abstract Abstract In modern-day semiconductor failure analysis (FA), the need for computer-aided design (CAD) has extended beyond the sole physical layout to a much larger scope of integrated circuit (IC) design data, such as the source schematic and netlist. Due to the improved accuracy...
Proceedings Papers

ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 176-179, November 5–9, 2017,
...Abstract Abstract The work presented here is related to the utilization of computer aided design (CAD) Navigation tools in combination with images from Emission Microscope (EMMI) to improve the accuracy and efficiency of Failure Analysis. The paper presents the flow to quickly identify...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 111-117, November 3–7, 2013,
... in the design. This paper examines the geometries available for FIB nanomachining, via milling/etching, and deposited metal jumpers by analyzing polygon data from computer aided design (CAD) virtual layers gathered across four process technologies, from 180nm down to 28nm. The results of this analysis...
Proceedings Papers

ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 73-81, November 14–18, 2004,
... for the analyst to overlay design layouts, such as CAD Knights, directly onto the current paths found by the SSM. In this paper, we present four case studies where SSM successfully localized short faults in advanced wire-bond and flip-chip packages after other fault analysis methods failed to locate the defects...
Proceedings Papers

ISTFA1998, ISTFA 1998: Conference Proceedings from the 24th International Symposium for Testing and Failure Analysis, 365-372, November 15–19, 1998,
... mechanical polishing techniques (CMP) and autorouted design techniques. As the new technique is realized as an extension of a standard CAD-navigation software and as it makes use of standard image format "TIFF" for data input, which is available at all modern equipments for failure analysis, these technique...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 108-114, October 31–November 4, 2021,
... to facilitate fault isolation in assembly and test. One way to address these challenges is through a computer-aided design (CAD) database that can be navigated across multiple components without exposing sensitive information. This paper describes the development and use of such a resource and how it enables...
Proceedings Papers

ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 337-341, October 31–November 4, 2021,
... of failure analysis, it is critical that design manufacturers possess the ability to isolate any given single layer of their logic samples. These isolated layers can be inspected for defects via SEM, provide validation of CAD designs, or tested with electrical probing for failure analysis. The work here...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 471-475, November 2–6, 2008,
... as fast as possible. The Atmel-CIMPACA laboratory located in Rousset, France, can do Failure Analysis on wafer, thanks to its wafer prober designed to work on DCG systems equipment and integrated CAD software (Meridian, Emiscope, NEXS software suite). Wafer level yield analysis typically requires long...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 113-116, November 14–18, 2010,
... of static random access memory (SRAM) electrical testing. The embedded memory blocks on some processors are fully configured and probe pad testable as early as the forth metal level. Using a unique navigation technique that combines electrically sorted SRAM bit map data with CAD coordinate information...
Proceedings Papers

ISTFA2006, ISTFA 2006: Conference Proceedings from the 32nd International Symposium for Testing and Failure Analysis, 46-54, November 12–16, 2006,
... The LVS Bottleneck to Producing Navigation Data When CAD navigation was first introduced as a means of guiding physical probers and focused ion-beam systems in the late 1980 s, analysts were forced into dealing with tools that were part of the designer s realm. Device analysts suddenly had to learn how...
Proceedings Papers

ISTFA1999, ISTFA 1999: Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis, 247-254, November 14–18, 1999,
... to the remaining point. This would tell one roughly how much off the alignment has turned out to be. c) CAD based navigation: In a CAD based system one gets a visual representation of the circuits using the CAD design data. Using standard tools and packages available, one can use the layout, schematic data...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 391-396, November 6–10, 2016,
... modifications are accomplished with a gallium liquid metal ion source (LMIS) based column that often incorporates a backside infrared (IR) camera, a high accuracy stage, a complex integrated gas delivery system, and linkage to CAD navigation software. The ion beam spot size of these systems is limited...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 9-13, November 2–6, 2003,
... via chain exposed by laser and then laser damaged for use in our scanning SQUID microscope HR study. To help us understand what to look for in the resulting image, a finite element simulation engine was used to calculate the expected result using the 3D CAD design of this exact structure...
Proceedings Papers

ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 85-87, November 2–6, 2008,
... full-wafer dual beam is used to perform the failure analysis. The use of a dual beam FIB/SEM allows easy automated or manual navigation by use of defect files and CAD design files. Once the failing cell has been located within the DUT in the view of the SEM, several analysis techniques can be employed...
Proceedings Papers

ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 189-193, November 3–7, 2013,
... aligned with the correcpondiing sections in Figure 3 (i). Figure 3 (iii) shows the CAD design of the 3-layer linear via chain pictured in Figure 3 (i). Different structures were powered up and scanned under a magnetic microscope using a SQUID sensor. The resulting magnetic field images were then analyzed...
Proceedings Papers

ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 373-376, November 13–17, 2011,
... or for complete design recovery in the case of obsolescence. Those interested in design verification are often comparing collected images against known layout design CAD files to ensure there is nothing missing in the device under test, or more importantly, that nothing unknown or otherwise malicious has been...
Proceedings Papers

ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 45-54, November 2–6, 2003,
... sites. These regions are placed in a virtual layer containing the pertinent CAD information for the purposes of TRPE and PICA. The advantages of this technique are threefold. First, the TRPE window sizes are quickly defined. Secondly, proprietary information about the specific circuit design can...
Proceedings Papers

ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 38-48, November 14–18, 2010,
... information about how the image was acquired is logged into the CAML file. Some of the information stored includes: Design name, wafer, and die location; EFA tool name, serial number, operator, and location; CAD location of the image; Lens, acquisition time, camera, etc. Test pattern and stimulus...
Proceedings Papers

ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 118-124, November 6–10, 2016,
... failures to help identify process issues and design weaknesses, leading to yield and reliability improvements. Output Input Buffer 3 X: 5120.6850 Y: 4203.8400 CAD 1 m Planar SEM (a) (b) Planar view Tilted view Output Net Shorted Net Shorted Area X: 5123, 4216 Y: 5123, 4203 EBAC Acknowledgements The authors...