This presentation covers ion beam analytical tools, their capabilities, and uses. It provides an overview of ion sources, examines emerging trends in surface analysis, and assesses the potential of ultrafast lasers for panoscopic patterning, athermal ablation, and elemental analysis. It compares and contrasts liquid metal, gas field, and plasma sources and presents examples highlighting the capabilities of FIB-SIMS and FIB-SEM Auger/XPS surface analysis techniques. It also introduces computationally guided microspectroscopy (CGM) and assesses its potential impact on multi-variant analysis, point spread deconvolution, and compressed sensing.

This presentation covers ion beam analytical tools, their capabilities, and uses. It provides an overview of ion sources, examines emerging trends in surface analysis, and assesses the potential of ultrafast lasers for panoscopic patterning, athermal ablation, and elemental analysis. It compares and contrasts liquid metal, gas field, and plasma sources and presents examples highlighting the capabilities of FIB-SIMS and FIB-SEM Auger/XPS surface analysis techniques. It also introduces computationally guided microspectroscopy (CGM) and assesses its potential impact on multi-variant analysis, point spread deconvolution, and compressed sensing.

A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.