Failure analysis of small contamination at the surface and sub-surface interface represents a major set of common microelectronics and semiconductor issues. The application of O-PTIR spectroscopy analyses provides flexibility to sample preparation and improves sensitivity to very small levels of contamination even below <1 micron in layers or particles on or just below the surface. The detection of this contamination can be limited if only bright field imaging is used to contrast the region of interest (ROI) and the surrounding structure. Adding fluorescence microscopy is an additional imaging technique that adds another layer of chemical specificity and provides locations of unseen ROI’s for additional IR and Raman spectral analysis.

This paper describes a new infrared (IR) technique that offers sub-micron spatial resolution with a pump-probe scheme that can offer simultaneous collection of IR and Raman spectra at the same spatial resolution. The technique uses a single beam to collect both IR and Raman spectra using a technique called Optical Photothermal Infrared (O-PTIR). The O-PTIR technique provides constant spatial resolution over the entire mid-IR range due to the use of a fixed wavelength probe beam at 532 nm. The paper provides examples that highlight the advantages of the novel technique for addressing challenges that are commonly observed in the failure and contamination analysis community.

This paper discusses the use of optical photothermal infrared (O-PTIR) spectroscopy combined with Raman analysis. The new technique overcomes many of the limitations of conventional FTIR and Raman spectroscopy when used alone. It is based on an infrared-visible pump-probe system that incorporates a wavelength-tunable IR laser that emits a pulsed beam that is combined colinearly with the output of a 532-nm green laser. As the paper explains, infrared radiation is partially absorbed by the test target when the wavelength of the laser resonates with the vibrational mode of the material. This excitation process causes the area under the infrared spot to heat up, in turn, causing local expansion along with changes in the refractive indices. These photothermal effects cycle on and off in synch with the pulsed IR beam and the amplitudes of the on-off states are captured by the co-located visible beam and plotted as a function of wavelength over the tunable range of the IR laser. The diffraction limited spot size of the visible beam is approximately 416 nm, corresponding to a spatial resolution of about 1 μm, which is 30 times more precise than conventional FTIR. In addition, by measuring photothermal effects in localized regions, it is possible to identify chemicals in quantities of matter as small as 0.4 pg. By comparison, the sensitivity of transmission mode FTIR is significantly less at around 100 pg.

Traditionally, reliability defects are addressed by end-of-line electrical measurements and extensive and dedicated testing during packaging. These tests cover almost every known defect condition and ensure product reliability with high confidence, but they occur in the final stage of manufacturing and are quite time intensive. This paper shows that inline reliability metrology based on Raman spectroscopy is an effective approach for early fault detection and can be used to monitor unintended epi growth, strain, lattice defects, stacking faults, dislocations, and post-etch residues. It can also reveal process anomalies and potential material problems. The paper examines the relationship between process parameters and reliability and reviews the enablers of preventive, early-detection inline metrology in the fab.

Global thinning is a technique that enables backside failure analysis and radiation testing. In some devices, it can also lead to increased thresholds for single-event latchup and upset. In this study, we examine the impacts of global thinning on 28 nm node FPGAs. Test devices are thinned to 50, 10, and 3 μm via CNC milling. Lattice damage, in the form of dislocations, extends about 1 μm below the surface, but is removed by polishing with colloidal SiO2. As shown by finite-element modeling, thinning increases compressive global stress in the Si while solder bumps (in flip-chip packages) increase stress locally. The results are confirmed by stress measurements obtained through Raman spectroscopy, although more complex models are needed to account for nonlinear effects in devices thinned to 3 μm and heated to 125°C. Thermal imaging shows that increased local heating occurs with increased thinning, but the maximum temperature difference across the 3-μm die is less than 2°C. Ring oscillators throughout the FPGA fabric slow about 0.5% after thinning and another 0.5% when heated to 125°C, which is attributed to stress changes in the Si.

Rapid identification of organic contamination in the semi and semi related industry is a major concern for research and manufacturing. Organic contamination can affect a system or subsystem’s performance and cause premature failure of the product. As an example, in February 2019 the Taiwan Semiconductor Manufacturing Company (TMSC), a major semiconductor manufacturer, reported that a photoresist it used included a specific element which was abnormally treated, creating a foreign polymer in the photoresist resulting in an estimated loss of $550M [1].

Failure analysis of organics at the microscopic scale is an increasingly important requirement, with traditional analytical tools such as FTIR and Raman microscopy, having significant limitations in either spatial resolution or data quality. We introduce here a new method of obtaining Infrared microspectroscopic information, at the submicron level in reflection (far-field) mode, called Optical-Photothermal Infrared (O-PTIR) spectroscopy, that can also generate simultaneous Raman spectra, from the same spot, at the same time and with the same spatial resolution. This novel combination of these two correlative techniques can be considered to be complimentary and confirmatory, in which the IR confirms the Raman result and vice-versa, to yield more accurate and therefore more confident organic unknowns analysis.

The given project is to benchmark typical preparation methods under the aspect of the influence of initial intrinsic stresses inside electric components. Raman spectroscopy has been applied as well as the piezo resistive readout on a specifically designed model stress monitoring chip.

Carrier mobility enhancement through local strain in silicon is a means of improving transistor performance. Among the scanning probe microscopy based techniques, tip-enhanced Raman spectroscopy (TERS) has shown some promising results in measuring strain. However, TERS is known to depend critically on the quality of the plasmonic tip, which is difficult to control. In this study, a test structure is used to demonstrate the capability of photo-induced force microscopy with infrared excitation (IR PiFM) in direct measurement of strain with approximately 10 nm spatial resolution. For SiGe pitch less than about 800 nm, the region between the SiGe lines should maintain residual strain. For a region with SiGe pitch of 1000 nm, it is verified that the strain between the SiGe lines is fully relaxed. PiFM promises to be a powerful tool for studying nanoscale strain in diverse material.

Spatial resolution limitations of IR thermal microscopy also limit the temperature accuracy for small thermal sources. Use of Raman temperature measurements significantly improves spatial resolution and thereby temperature accuracy. Previous, visible-wavelength, Raman temperature measurements are limited to top side measurements in silicon. This paper describes the first ever IR Raman measurements in silicon and demonstrates its use for backside temperature measurements.

Two instances of BGA package level failures were identified during in-circuit electrical test. The electrical opens occurred as a result of contamination issues originating at the board supplier. Analytical techniques including optical inspection, SEM/EDS, Raman and FTIR were key in identifying photoresist on the board surface in the first case study and nickel carbonate contamination on the board surface in the second case study. In the first case study, resolution was achieved with a Plasma etch process. In the second case study, CCAs were cleaned with a wet chemical etch process formulated specifically to attack the nickel carbonate.

This paper describes a new method for the mapping of local temperatures in the active region of highpower III-V semiconductor transistors for microwave applications. The measurement technique involves scanning a focused laser beam at the surface of a chip inside its package, while the photoluminescence (PL) or the Raman spectra produced are recorded sequentially for each position of the laser beam. The local temperature is deduced either from the corresponding wavelength shift of the PL (which represents changes in the band-gap due to heating) or from Raman Stokes peak shift or from the Stokes to anti-Stokes intensity ratio (which correspond to changes in optical phonon frequencies and population respectively due to heating). Results are shown both for SiC-based field effect transistors and for bipolar type transistors (heterojunction bipolar transistors – HBTs – in the GaAs/Ga1-xInxP system). A spatial resolution of 1 µm and an accuracy in the temperature determination of ± 3 °C are demonstrated, especially for the HBTs. Finally, procedures are proposed to implement the information on local operating temperatures provided by this method into thermal resistance calculations.

In this paper, Photon Emission Microscopy (PEM) and micro-Raman Spectroscopy (μRS) are applied for temperature profile measurements and failure characterization in gg-nMOS ESD protection devices. The measurements were carried out in avalanche and snapback biasing conditions. A correlation between the temperature profile obtained by μRS and the light emission location, measured by PEM, is observed for non-degraded devices. In addition, ESD-degraded devices were studied. PEM, μRS, Spectroscopic Photon Emission Microscopy (SPEM) and electrical measurements were used to investigate the origin of the light emitted at the failure site. They showed that the light emission occurring at the failure site is due to impact ionization.

It is shown, using micro-Raman spectroscopy, that Shallow Trench Isolation introduces high stresses in the active area of silicon devices when wet oxidation steps are used. These stresses result in defect formation in the active area, leading to high diode leakage currents. The stress levels are highest near the outer edges of line structures and at square structures. They also increase with decreasing active area dimensions.