Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Topics
Subjects
Article Type
Volume Subject Area
Date
Availability
1-5 of 5
Industrial computed tomography
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Proceedings Papers
Environmental X-Ray Computed Tomography (E-CT)—3D CT at Elevated to Cryogenic Temperatures
Available to Purchase
ISTFA2022, ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis, 163-169, October 30–November 3, 2022,
Abstract
View Papertitled, Environmental X-Ray Computed Tomography (E-CT)—3D CT at Elevated to Cryogenic Temperatures
View
PDF
for content titled, Environmental X-Ray Computed Tomography (E-CT)—3D CT at Elevated to Cryogenic Temperatures
While 2.5D and 3D solutions continue to drive advancements in the electronics packaging industry, challenges persist with their reliability and qualification. In this paper, we introduce a new technique that may prove valuable for nondestructive, in-situ measurements of package and die warpage. This system allows for the powerful visualization tools of Computed Tomography to be applied to samples at elevated and cryogenic temperatures over a broad temperature range (+125C to -257C).
Proceedings Papers
Large-Scale CT Inspection of Feed-Through EMI Filters for Space Application
Available to Purchase
ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 49-52, October 31–November 4, 2021,
Abstract
View Papertitled, Large-Scale CT Inspection of Feed-Through EMI Filters for Space Application
View
PDF
for content titled, Large-Scale CT Inspection of Feed-Through EMI Filters for Space Application
This paper describes a project to develop and deploy a systematic screening methodology involving computed tomography (CT) to inspect a set of electromagnetic interference (EMI) filter components for a spacecraft application. The goal was to deploy the nondestructive CT test to replace the destructive test method typically deployed for such components. The paper describes the development of test criteria, fixturing, inspection process, and data analysis, including quantitative image analysis of voids and cracks. The initial results indicated that the parts would not pass the requirements established in the test design. A waiver was written to the project clarifying that if the parts were to be used in the assembly, they should be considered as simple conductors with EMI filtering capability viewed as an added benefit rather than a guaranteed design requirement.
Proceedings Papers
Automated Via Detection for PCB Reverse Engineering
Available to Purchase
ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 157-171, November 15–19, 2020,
Abstract
View Papertitled, Automated Via Detection for PCB Reverse Engineering
View
PDF
for content titled, Automated Via Detection for PCB Reverse Engineering
Reverse engineering (RE) is the only foolproof method of establishing trust and assurance in hardware. This is especially important in today's climate, where new threats are arising daily. A Printed Circuit Board (PCB) serves at the heart of virtually all electronic systems and, for that reason, a precious target amongst attackers. Therefore, it is increasingly necessary to validate and verify these hardware boards both accurately and efficiently. When discussing PCBs, the current state-of-the-art is non-destructive RE through X-ray Computed Tomography (CT); however, it remains a predominantly manual process. Our work in this paper aims at paving the way for future developments in the automation of PCB RE by presenting automatic detection of vias, a key component to every PCB design. We provide a via detection framework that utilizes the Hough circle transform for the initial detection, and is followed by an iterative false removal process developed specifically for detecting vias. We discuss the challenges of detecting vias, our proposed solution, and lastly, evaluate our methodology not only from an accuracy perspective but the insights gained through iteratively removing false-positive circles as well. We also compare our proposed methodology to an off-the-shelf implementation with minimal adjustments of Mask R-CNN; a fast object detection algorithm that, although is not optimized for our application, is a reasonable deep learning model to measure our work against. The Mask R-CNN we utilize is a network pretrained on MS COCO followed by fine tuning/training on prepared PCB via images. Finally, we evaluate our results on two datasets, one PCB designed in house and another commercial PCB, and achieve peak results of 0.886, 0.936, 0.973, for intersection over union (IoU), Dice Coefficient, and Structural Similarity Index. These results vastly outperform our tuned implementation of Mask R-CNN.
Proceedings Papers
X-Ray Computed Tomography: A Potentially Destructive “Non-Destructive Evaluation” Technique
Available to Purchase
ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 519-521, November 10–14, 2019,
Abstract
View Papertitled, X-Ray Computed Tomography: A Potentially Destructive “Non-Destructive Evaluation” Technique
View
PDF
for content titled, X-Ray Computed Tomography: A Potentially Destructive “Non-Destructive Evaluation” Technique
Characterization of Computed Tomography X-Ray ionizing dose will be presented along with a methodology to protect space bound flight hardware from exceeding total ionizing dose (TID) budget prior to mission completion.
Proceedings Papers
3D X-ray Computed Tomography (CT) for Electronic Packages
Available to Purchase
ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 56-61, November 2–6, 2003,
Abstract
View Papertitled, 3D X-ray Computed Tomography (CT) for Electronic Packages
View
PDF
for content titled, 3D X-ray Computed Tomography (CT) for Electronic Packages
Next generation assembly/package development challenges are primarily increased interconnect complexity, density, and multi-layer/multi-stacked packages with ever shorter development time. The results of this trend present some distinct challenges for the analytical tools and techniques to support this technology roadmap. The key challenge in the analytical tools and techniques is the development of nondestructive imaging for improved time to information. The 3D X-ray Computed tomography (CT) system named “X-Tek NGI” has been co-developed by Intel and X-Tek to address this need. The current paper will discuss the configuration and several applications where this tool has been applied successfully to solve current package technology development issues and provide package construction analysis (including enabled components). This paper will discuss the details of the system configuration, examples together with the current limitations and future direction for non-destructive package failure analysis.