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Emissivity
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Proceedings Papers
Defect Localization by Lock-In-Thermography
Available to Purchase
ISTFA2022, ISTFA 2022: Tutorial Presentations from the 48th International Symposium for Testing and Failure Analysis, e1-e63, October 30–November 3, 2022,
Abstract
View Papertitled, Defect Localization by Lock-In-Thermography
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This presentation provides an overview of lock-in thermography and its application in semiconductor failure analysis. It begins with a review of direct thermal imaging, IR transmission and detection, and the fundamentals of lock-in measurements. It compares and contrasts steady-state IR imaging with lock-in thermography and shows how lock-in frequency and the shape of the excitation signal can be varied to increase signal-to-noise ratio and reduce acquisition time, thereby exposing a wider range of defects. It also presents several case studies in which lock-in thermography is used to diagnose shorts and hot spots in packaged devices, electronic systems, and 3D assemblies.
Proceedings Papers
Enhanced Pixel by Pixel Emissivity Correction for Thermal Microscopy
Available to Purchase
ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 451-456, November 14–18, 2004,
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View Papertitled, Enhanced Pixel by Pixel Emissivity Correction for Thermal Microscopy
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for content titled, Enhanced Pixel by Pixel Emissivity Correction for Thermal Microscopy
In thermal microscopy, temperature error arises whenever a constant emissivity value is assumed for different materials. In this paper, we propose a new approach to eliminate these undesirable effects resulting from the ambiguous surface emissivity of materials. This method enables the compensated (true) temperature distribution of a device under test to be obtained from the measured temperature image. A transfer function that relates the measured and true temperature is formed to estimate the actual temperature distribution of a biased device to an accuracy of approximately 0.3-0.7K.