This paper explains how laser assisted deposition used in combination with focused ion beam (FIB) milling reduces turnaround time for complex circuit modifications. It presents the results of three case studies, characterizing the process and the effect of various processing parameters. The first case involves the creation of a low resistance path between internal signal lines using only laser techniques; the second case demonstrates the use of laser deposition to route interconnects, millimeters in length, between two complex FIB modifications; and the third case is designed to reproduce a charge build-up problem. The paper also discusses the use of gold as a deposition material.