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Proceedings Papers
ISTFA2005, ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis, 451-456, November 6–10, 2005,
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The Directive 2002/95/EC (referred as ROHS) of the European Parliament and of the Council restricts the use of certain hazardous substances in electrical and electronic equipment. This article reports on a fast and inexpensive methodology for rapidly screening entire electronic assemblies that acts as a high-level screen for obvious ROHS violations. Using this methodology, this lab has been able to check entire product lines for basic ROHS compliance and has identified many cases where vendors needed to be informed of ROHS violations before a product could be certified as ROHS compliant. Four tests are employed. Each of them is described, along with the basic theory behind the test: pre-screening with x-ray fluorescence spectroscopy and electron dispersion spectroscopy; detection and identification of polybrominated biphenyl ethers using gas chromatography - mass spectrometry; and chromium 6 colorimetric testing based on diphenylcarbazide.
Proceedings Papers
Advanced Analytical Chemistry Techniques Enable Rapid, Cheap and Concise Electronic Failure Analysis
ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 457-464, November 14–18, 2004,
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This article introduces several analytical chemistry techniques that are extremely useful in the electronics failure analysis (FA) laboratory, but are not normally found in FA laboratories. It presents the techniques in simple language and makes a case for the inclusion of chemists in the rapidly evolving and ever-shrinking world of microelectronic failure analysis. The article discusses the following techniques in terms of their applications, advantages, and operating principles: gel permeation chromatography, gas chromatography-mass spectrometry, Fourier transform-infrared spectroscopy, and electron spectroscopy for chemical analysis (ESCA). As we move into the world of nanotechnology, these techniques will become key in analyzing failures that cannot be visualized using traditional FA methods.