This presentation addresses the issue of counterfeiting in the semiconductor industry. It begins with a review of the global supply chain and the various forms of counterfeiting taking place. It then identifies assets that require tamper protection and the types of attacks to which they are prone. It also presents several approaches for physical inspection and assurance at the IC and system level.

This presentation covers the challenges associated with IC package inspection and shows how two nondestructive techniques, scanning acoustic microscopy and X-ray imaging, are being used to locate and identify a wide range of defects, particularly those in 3D packages and multilayer boards. It reviews the basic principles of scanning acoustic microscopy (SAM), X-ray imaging, and 3D X-ray tomography and the factors that affect image resolution and depth. It demonstrates the current capabilities of each method along with different approaches for improving resolution, contrast, and measurement time.

This presentation provides an overview of chip-scale packages (CSPs) and the challenges they create for failure analysis. It begins with a review of stacked, multichip, and wafer-level packages, using images and illustrations to highlight complexities. It then presents examples of package-level failure mechanisms including various forms of cracking, inadvertent wire bond contact, and die-edge chipping. It likewise assesses die-level analysis challenges and provides practical solutions. The presentation also includes several case studies and describes new and emerging challenges.

This presentation provides an overview of chip-scale packages (CSPs) and the challenges they create for failure analysis. It begins with a review of stacked, multichip, and wafer-level packages, using images and illustrations to highlight complexities. It then presents examples of package-level failure mechanisms including various forms of cracking, inadvertent wire bond contact, and die-edge chipping. It likewise assesses die-level analysis challenges and provides practical solutions. The presentation also includes several case studies and describes new and emerging challenges.

This presentation addresses the issue of counterfeiting in the semiconductor industry. It begins with a review of the global supply chain and the various forms of counterfeiting taking place. It then identifies assets that require tamper protection and the types of attacks to which they are prone. It also presents several approaches for physical inspection and assurance at the IC and system level.