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Proceedings Papers
ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 8-13, November 5–9, 2017,
Abstract
View Papertitled, A Detailed Analysis Scheme to Interpret Multiple Photon Emissions Micrograph for Improved Diagnostic Resolution on Open Defects
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for content titled, A Detailed Analysis Scheme to Interpret Multiple Photon Emissions Micrograph for Improved Diagnostic Resolution on Open Defects
Photon Emission Microscopy is the most widely used mainstream defect isolation technique in failure analysis labs. It is easy to perform and has a fast turnaround time for results. However, interpreting a photon emission micrograph to postulate the suspected defect site accurately is challenging when there are multiple abnormal hotspots and driving nets involved. This is commonly encountered in dynamic emission micrographs that are caused by open defects in digital logic. This paper presents a methodology incorporating layout-aware trace analysis and post schematic extraction with test bench analysis to enhance the diagnostic resolution on the suspected defective net(s).
Proceedings Papers
ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 1-6, November 6–10, 2016,
Abstract
View Papertitled, Unusual Defects Generated by Wafer Sawing—An Update—Including Pick and Place Processing
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for content titled, Unusual Defects Generated by Wafer Sawing—An Update—Including Pick and Place Processing
At ESREF 2008, the paper “Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures” had won the Best Paper Award. In the meantime, new experiences were collected, related to new methods as laser sawing and its specific ESD risks and additional failure mechanisms as backside damage, charging of foils, pad corrosion and sawing residue damages. This paper explains in detail these failure sources, including detailed explanations on root causes and physical mechanisms as well as important hints for failure analysts how to distinguish related failure signatures from those, which look similar but are of other origin.
Proceedings Papers
ISTFA2015, ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis, 1-5, November 1–5, 2015,
Abstract
View Papertitled, Fault Isolation Using Electrically-Enhanced LADA (EeLADA)
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for content titled, Fault Isolation Using Electrically-Enhanced LADA (EeLADA)
Pulsed-LADA is found to play an important role in the advancement of next-generation LADA and it is reported that tens of μs pulses with 10 kHz frequency is sufficient to observe enhancements in carrier injection. Electrically-enhanced LADA (EeLADA), based on pulsed-LADA, is introduced as a new fault localization method capable to overcome current limitation of Laser Assisted Device Alteration (LADA) application on soft failure and extends it to hard failure debug. We present the EeLADA methodology and experimental data to demonstrate its feasibility.