Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Date
Availability
1-4 of 4
Defect-Based Testing
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Proceedings Papers
The Challenge of IC Test and Fault Diagnosis
Available to Purchase
ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 459-464, November 11–15, 2001,
Abstract
View Papertitled, The Challenge of IC Test and Fault Diagnosis
View
PDF
for content titled, The Challenge of IC Test and Fault Diagnosis
The ongoing challenge of test is to obtain high quality at a reasonable cost. Increasing design complexity, signal integrity, and power issues mean that design-for-testability (DFT) and design-for-diagnosibility (DFD) can no longer be treated as an add-on. Similarly, serious attention is needed for parametric testing or the cost requirements for GHz frequency test will be prohibitive. Is the industry ready for the challenge?
Proceedings Papers
Innovative Technique for Bitmap Verification Using Laser Light
Available to Purchase
ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 465-468, November 11–15, 2001,
Abstract
View Papertitled, Innovative Technique for Bitmap Verification Using Laser Light
View
PDF
for content titled, Innovative Technique for Bitmap Verification Using Laser Light
This paper describes the use of a Nd:YAG laser to validate logical to physical mapping of embedded arrays found on devices packaged in “flip-chip” configurations.
Proceedings Papers
Smart Testing Interface: New Inexpensive Tool for Defect Localization in ICs
Available to Purchase
ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 469-475, November 11–15, 2001,
Abstract
View Papertitled, Smart Testing Interface: New Inexpensive Tool for Defect Localization in ICs
View
PDF
for content titled, Smart Testing Interface: New Inexpensive Tool for Defect Localization in ICs
To deal with failure analysis laboratory tasks, we have developed a modular and smart test system. We demonstrate that Smart Testing Interface can keep a device in the proper electrical state for defect localization. It is a key part of our system and can be easily adapted on a wide range of electrical testers. It offers a unique combination of a slave and a standalone mode. In slave mode, it has a non-disruptive interface between the tester and the component. In stand-alone mode, it is an electrical stimuli generator that can keep the device under test in the correct internal electrical state during IC defect localization. A battery or a power supply powers it up. It can be readily carried in stand-alone mode from one tool to another tool. In stand-alone mode, it has a range of eight hours or more according to the battery capacity and device consumption. We will review a failure analysis laboratory needs and then describe test solutions with our Modular and Smart Test System and a 344 I/O Smart Testing Interface. It is used for EMMI and OBIRCH applications on PHEMOS 1000.
Proceedings Papers
Failure Analysis of Silicided related Integral Nonlinearity in Submicron Digital-to-Analog Converters
Available to Purchase
ISTFA2001, ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis, 477-482, November 11–15, 2001,
Abstract
View Papertitled, Failure Analysis of Silicided related Integral Nonlinearity in Submicron Digital-to-Analog Converters
View
PDF
for content titled, Failure Analysis of Silicided related Integral Nonlinearity in Submicron Digital-to-Analog Converters
The use of analog blocks in deep submicron intergrated circuits has become commonplace. The process used for these circuits is tuned for pure digital applications. Thus, identification of failures in these blocks requires a detailed understanding of the design, test, and process not previously done with digital failure analysis. This paper will detail the method, results, and solution to a silicided related integral non-linearity in a deep submicron 10-bit DAC.