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Yunfei Wang
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Proceedings Papers
ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 241-247, October 31–November 4, 2021,
Abstract
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This paper presents a number of case studies in which various methods and tools are used to localize resistive open defects, including two-terminal IV, two-terminal electron-beam absorbed current (EBAC), electron beam induced resistance change (EBIRCH), pulsed IV, capacitance-voltage (CV) measurements, and scanning capacitance microscopy (SCM). It also reviews the advantages and limitations of each technique.
