This paper discusses the development of an electrical failure analysis workflow that uses a multifunction direct current tester (DCT) to map the location of defects associated with open and short circuits as well as leakage current. It explains how software and tooling were designed to accommodate a wide range of package types and sizes and how they were verified by testing. It also presents two case studies showing the accuracy of the defect mapping function for sockets with 0.8 and 1.0 mm ball pitch.

Electro Optical Terahertz Pulse Reflectometry (EOTPR) is an E-FA (Electrical Failure Analysis) technique in the semiconductor industry for non-destructive electrical fault isolation for shorts, leakages and opens. This paper introduces the capability and presents several case studies identifying the physical location of defects where EOTPR is useful as a non-destructive analysis technique. In this paper, the methodology and application of EOTPR on open and short failure isolations in advanced 2.5D IC and wafer level packages (WLP) have been presented. The experimental results of P-FA (Physical Failure Analysis) verify the accuracy of the EOTPR system in determining the distance to defect.