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Yian-Liang Kuo
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Proceedings Papers

3DIC Fault Isolation Using the OBIRCH Approach

Ming-Sung Hsu, Yian-Liang Kuo, Yu-Ting Lin, Ru-Ying Huang, Min-Feng Ku ...
ISTFA2011, ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis, 60-63, November 13–17, 2011,
https://doi.org/10.31399/asm.cp.istfa2011p0060
Abstract
Abstract This paper uses an interesting specific case study to highlight the non-destructive fault isolation demonstration of 3DIC stacked dies applied the optical beam induced resistance change (OBIRCH) approach.
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Proceedings Papers

Advanced Sample Preparation Method for Lead Free Bump IMC and Solder Grain Image Enhancement

Ming-Song Sheu, Yian-Liang Kuo, Jeng-Hun Lee, Yu-Ting Lin, Hui-Chen Chu ...
ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 79-83, November 14–18, 2010,
https://doi.org/10.31399/asm.cp.istfa2010p0079
Abstract
Abstract An advanced method for LF (Lead Free) bump sample preparation to improve the surface of sample that can enhance the image of IMC (Inter Metallic Compound), solder grain boundary and micro-crack after TC (thermal cycle) reliability test is proposed. By this advanced method application, LF bump micro-crack location and propagation path can be observed easily for the reliability test fracture failure mechanism study and LF bump crack improvement further.
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