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Yaobin Zhao
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Proceedings Papers
ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 271-274, November 14–18, 2010,
Abstract
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Abstract Grain size monitor of Al pad is necessary to assure pad quality and electrical performance in IC manufacturing. Currently, the sample is prepared either without pretreatment or with 4.9% HF stain or ion milling before grain size measurement. In this paper, we demonstrate the pretreatment has a pronounced effect on the grain size measurement and the method with ion milling pretreatment shows more reliable results. The mechanism is further discussed.
