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Y. Bouttement
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Proceedings Papers
ISTFA2003, ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis, 440-445, November 2–6, 2003,
Abstract
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Abstract We developed a system and a method to characterize the magnetic field induced by circuit board and electronic component, especially integrated inductor, with magnetic sensors. The different magnetic sensors are presented and several applications using this method are discussed. Particularly, in several semiconductor applications (e.g. Mobile phone), active dies are integrated with passive components. To minimize magnetic disturbance, arbitrary margin distances are used. We present a system to characterize precisely the magnetic emission to insure that the margin is sufficient and to reduce the size of the printed circuit board.