Abstract Today’s high volume FA labs are constantly looking for ways to improve the data to customer cycle. Current dye & pull sample preparation materials and methods have some time to completion requirements that cannot be avoided without compromising data. This paper demonstrates that significant improvements in data cycle time and quality can be realized by using a combination of the latest UV cure adhesives, masks, and complimentary equipment such as LED cure lights and gantry dispensing robots.

Abstract Existing tools used by industry to manually remove PCB components for disbond type mapping or crack area measurement present significant ergonomic and process quality concerns. The most common tool designs often cause damage to some of the solder joints on components during pull, and frequently, operators using these designs report safety concerns. This paper evaluates these concerns and proposes a design solution that eliminates them. With a manual T-handle pull tool system introduced here, there is no prying, lever or angular force applied to remove the component. The pull tool rotates using vertical threads to apply vertical removal force. It demonstrates a reduction in manual operator force by an average of 93% compared to the cam lobe lever design. Additionally, the pull tool reduces bending of pull bolts and angular pull direction that may interfere with availability and interpretation of subsequent disbond data.