Abstract This presentation is chronologically-progressive to the author's ISTFA Keynote given in 2010: "Counterfeiters' Techniques: Constantly Improving to Avoid Detection - National Security Depends on Us to Keep Up". It shares, in detail, the forensic test methodologies utilized by SMT and ultimately the research breakthroughs which gave the labs crystal-clear insight into the counterfeiters specific step-by-step rework process. The presentation includes all forensic work utilized in exposing the "Micro-blast" & "Flat-Lap" counterfeit processes identified at SMT labs during 2011, as well as unpublished novel process threats and refinements identified in 2013 & 2014. It also covers the counterfeit mitigation work that SMT supported with the GAO and Senate Armed Services Committee's investigation into counterfeits within DoD supply chains during the 2011-2012 time period.

Abstract The entire electronics industry is now facing a much more insidious counterfeit threat than at any time in the past. The existence of cloned electronic components bearing the markings of major component manufacturers in today’s global supply chains has been clearly established within SMT’s labs over the past 3 years. The most worrisome aspect of these “made from scratch” fakes is their ability to easily pass current Industry-Standard counterfeit inspection processes and electrical testing to the manufacturers’ data sheet. My presentation will focus on several actual examples of this most concerning advanced counterfeiter capability and some of the processes utilized by SMT as an obsolescence component supplier and testing lab to mitigate this new and growing threat from making it to our OEM & CM customers.