Abstract Thermal issues management is a daily design challenge for teams working with analog mixed-signal technologies such as “SmartMOS”, with the integration of analog circuitry, high power density devices and logic control. A case study based on an NXP new product introduction will illustrate the use of Thermography as a complementary technique to standard Design debug activities, leading to the demonstration of a thermal crosstalk phenomenon in the analyzed analog mixed signal device. Based on InfraRed Thermography principle and specific Trigger Delay and Thermal Mapping modes, a transient thermal event was fully characterized, in addition to more common techniques such as Design and Layout study, electrical characterization, simulation, Microprobing, and Thermal Laser Stimulation. The added value of the thermography, as well as the limitations of the technique, will be discussed in that paper.