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T. Gordon
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Proceedings Papers
ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 34-39, October 31–November 4, 2021,
Abstract
PDF
There are several variants of artificial intelligence (AI) hardware structures that are under study by the semiconductor industry for potential use in complementary metal–oxide–semiconductor (CMOS) designs. This paper discusses some of the failure analysis challenges that have appeared in discrete test structures and test arrays developed as part of an exploratory phase-change memory (PCM) program at IBM's Albany AI Hardware Research Center.
