Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Article Type
Volume Subject Area
Date
Availability
1-2 of 2
S. Ferrier
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Proceedings Papers
ISTFA2002, ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis, 341-347, November 3–7, 2002,
Abstract
PDF
Abstract Methodology remains an underdeveloped segment of the semiconductor Failure Analysis discipline. This paper describes a general formulation of scientific method for semiconductor Failure Analysis. The formulation creates a rigorous, customized analysis flow that flags both poorly-understood cause-effect relationships and missing techniques. It eases the application of basic inferential logic to the resulting analysis process, helping reduce errors in the analysis thought process. Finally, the methodology provides a uniform nomenclature and representation of the analysis process that lets the analyst describe complex flows in a simple and informative way. This general material has been presented by SDG Analytic, Inc. (now Metatech Corporation) in a public training course called “Precision Failure Analysis Logic.”
Proceedings Papers
ISTFA1997, ISTFA 1997: Conference Proceedings from the 23rd International Symposium for Testing and Failure Analysis, 57-62, October 27–31, 1997,
Abstract
PDF
Abstract Three enhancements to Liquid Crystal hot spot detection improve thermal and optical sensitivity while substantially maintaining simplicity, safety and relative low cost. These enhancements have permitted detection of hot spots unidentifiable by traditional LC methods. Details, capabilities and limitations of the enhancements are discussed, results of rudimentary defect thermal modeling are presented, and an improved metric for evaluating LC technique sensitivity is proposed.