Abstract Methodology remains an underdeveloped segment of the semiconductor Failure Analysis discipline. This paper describes a general formulation of scientific method for semiconductor Failure Analysis. The formulation creates a rigorous, customized analysis flow that flags both poorly-understood cause-effect relationships and missing techniques. It eases the application of basic inferential logic to the resulting analysis process, helping reduce errors in the analysis thought process. Finally, the methodology provides a uniform nomenclature and representation of the analysis process that lets the analyst describe complex flows in a simple and informative way. This general material has been presented by SDG Analytic, Inc. (now Metatech Corporation) in a public training course called “Precision Failure Analysis Logic.”

Abstract Three enhancements to Liquid Crystal hot spot detection improve thermal and optical sensitivity while substantially maintaining simplicity, safety and relative low cost. These enhancements have permitted detection of hot spots unidentifiable by traditional LC methods. Details, capabilities and limitations of the enhancements are discussed, results of rudimentary defect thermal modeling are presented, and an improved metric for evaluating LC technique sensitivity is proposed.