This paper discusses the development of an electrical failure analysis workflow that uses a multifunction direct current tester (DCT) to map the location of defects associated with open and short circuits as well as leakage current. It explains how software and tooling were designed to accommodate a wide range of package types and sizes and how they were verified by testing. It also presents two case studies showing the accuracy of the defect mapping function for sockets with 0.8 and 1.0 mm ball pitch.