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Natsuko Asano
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Proceedings Papers
ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 280-284, November 15–19, 2020, Event canceled
Abstract
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Abstract Understanding solder joints is very important for failure analysis in semiconductor manufacturing because it is commonly used for mounting semiconductor devices on boards. However, regarding sample preparation for analysis, solder poses challenges in crosssection preparation due to the differences in melting point and hardness of its constituents. Therefore, precision cutting methods such as ion milling are required. On the other hand, ion milling method usually causes thermal damage during cutting. In this paper, we tried to optimize the sample temperature during Ar ion milling using liquid nitrogen cooling [1].
Proceedings Papers
ISTFA2019, ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis, 286-291, November 10–14, 2019, Portland, Oregon USA
Abstract
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Abstract Voltage contrast (VC) observation using a scanning electron microscope (SEM) or a focused ion beam (FIB) is a common failure analysis technique for semiconductor devices.[1] The VC information allows understanding of failure localization issues. In general, VC images are acquired using secondary electrons (SEs) from a sample surface at an acceleration voltage of 0.8–2.0 kV in SEM. In this study, we aimed to find an optimized electron energy range for VC acquisition using Auger electron spectroscopy (AES) for quantitative understanding.