Abstract We report on aberration compensation in an aplanatic solid immersion lens microscope used for high-resolution backside inspection of silicon integrated circuits. The imaging quality of aplanatic SIL microscope is shown to be significantly degraded by aberrations, especially when the silicon integrated circuit samples have thicknesses that are more than a few micrometers thicker or thinner than ideal. We describe and demonstrate a technique to recover near-ideal imaging quality by compensating those aberrations using a MEMS deformable mirror. The mirror, located in an optical plane conjugate to the microscope objective, is shaped in a way that counteracts spherical aberration errors associated with non-ideal sample thickness.

Abstract As the feature size in integrated circuits (ICs) become smaller, the techniques we use to localize defects must also progress to the level that they can resolve potential errors. Additionally, because most errors cannot be identified by visual inspection alone, it is necessary to develop techniques, such as thermography, with the capability of localizing failures to the specific component or defect at fault. This paper will review the theory and application of an advanced subsurface (through the substrate) analytical technique for IC failure analysis – solid immersion lens thermal emission microscopy.