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M. Lee
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Proceedings Papers
ISTFA2016, ISTFA 2016: Conference Proceedings from the 42nd International Symposium for Testing and Failure Analysis, 540-546, November 6–10, 2016,
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EeLADA has been introduced previously as a prospective alternative approach to DFT scan diagnosis for scan logic defect localization. It has the capability to reveal induced signals from laser stimulation that are relevant to the failure signature by comparing failing pins and cycles of the bad device. Multiple schemes involving different combinations for comparison are possible. Defect simulations based on cell fault injections on a multi-level logic of a real digital device circuit characterizes the different comparison schemes. The findings are used to devise an optimized methodology to determine suspected fail locations to guide physical failure analysis to reveal the defect. A successful case study substantiates the method.
Proceedings Papers
ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 70-74, November 2–6, 2008,
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This paper presents a case study on via high resistance issue. A logical failure analysis process EDCA ( E ffect, D efect, C ause, and A ction) is successfully applied to find out the failure mechanism, pinpoint the root cause and solve the problem. It sets up a very good example of how to do tough failure analysis in a controllable way.